applying unidirectional static pressure

Industry

CPC
H01L2224/83208

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/83208applying unidirectional static pressure

Industries

Patents Grantslast 30 patents

Information Patent Grant
Manufacturing method of semiconductor package using jig
- Patent number 11,804,468
- Issue date Oct 31, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip assembly
- Patent number 11,508,694
- Issue date Nov 22, 2022
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive paste for bonding
- Patent number 10,696,875
- Issue date Jun 30, 2020
- E. I. Du Pont de Nemours and Company
- Yumi Matsuura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chip assembly
- Patent number 10,636,766
- Issue date Apr 28, 2020
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip carrier and method thereof
- Patent number 10,163,820
- Issue date Dec 25, 2018
- Infineon Technologies AG
- Frank Pueschner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and method for producing an electronic device
- Patent number 10,147,696
- Issue date Dec 4, 2018
- Osram Opto Semiconductors GmbH
- Andreas Ploessl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a chip assembly with a die attach liquid
- Patent number 9,837,381
- Issue date Dec 5, 2017
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a material-bonding connection between a semico...
- Patent number 9,659,793
- Issue date May 23, 2017
- Infineon Technologies AG
- Nicolas Heuck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for ultrasonic bonding having at least one first and second...
- Patent number 9,296,065
- Issue date Mar 29, 2016
- Hesse GmbH
- Hans-Juergen Hesse
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing optical module
- Patent number 9,214,446
- Issue date Dec 15, 2015
- Citizen Holdings Co., Ltd.
- Kaoru Yoda
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Manufacturing process and heat dissipating device for forming inter...
- Patent number 8,941,234
- Issue date Jan 27, 2015
- DY 4 Systems, Inc.
- Ivan Straznicky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing process and heat dissipating device for forming inter...
- Patent number 8,728,872
- Issue date May 20, 2014
- DY 4 Systems, Inc.
- Ivan Straznicky
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Manufacturing method of semiconductor device
- Patent number 8,003,441
- Issue date Aug 23, 2011
- Lintec Corporation
- Jun Maeda
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
JIG FOR MANUFACTURING SEMICONDUCTOR PACKAGE
- Publication number 20240387446
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE USING JIG
- Publication number 20230369283
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
JIG FOR MANUFACTURING SEMICONDCUTOR PACKAGE AND MANUFACTURING METHO...
- Publication number 20220230985
- Publication date Jul 21, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING AN ELECTRONIC DEVICE
- Publication number 20200248040
- Publication date Aug 6, 2020
- DUPONT ELECTRONICS, INC.
- Yumi Matsuura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF FORMING A CHIP ASSEMBLY AND CHIP ASSEMBLY
- Publication number 20200219848
- Publication date Jul 9, 2020
- INFINEON TECHNOLOGIES AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE, ELECTRONIC DEVICE MANUFACTURING METHOD, AND ELEC...
- Publication number 20180358320
- Publication date Dec 13, 2018
- Fujitsu Limited
- Kimio Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP CARRIER AND METHOD THEREOF
- Publication number 20180040573
- Publication date Feb 8, 2018
- INFINEON TECHNOLOGIES AG
- FRANK PUESCHNER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Sintering Utilizing Non-Mechanical Pressure
- Publication number 20140224409
- Publication date Aug 14, 2014
- INTERNATIONAL RECTIFIER CORPORATION
- Henning M. Hauenstein
- B32 - LAYERED PRODUCTS
Information Patent Application
Electrical Connecting Element and Method for Manufacturing the Same
- Publication number 20140217593
- Publication date Aug 7, 2014
- National Chiao Tung University
- Chih CHEN
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING PROCESS AND HEAT DISSIPATING DEVICE FOR FORMING INTER...
- Publication number 20140209284
- Publication date Jul 31, 2014
- DY 4 Systems, Inc.
- Ivan Straznicky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR ULTRASONIC BONDING HAVING AT LEAST ONE FIRST AND SECOND...
- Publication number 20140151439
- Publication date Jun 5, 2014
- Hesse GmbH
- Hans-Juergen Hesse
- B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
Information Patent Application
MANUFACTURING PROCESS AND HEAT DISSIPATING DEVICE FOR FORMING INTER...
- Publication number 20130043015
- Publication date Feb 21, 2013
- DY 4 Systems, Inc.
- Ivan Straznicky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING OPTICAL MODULE
- Publication number 20120234458
- Publication date Sep 20, 2012
- Kaoru YODA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Manufacturing Method of Semiconductor Device
- Publication number 20100190293
- Publication date Jul 29, 2010
- LINTEC CORPORATION
- Jun Maeda
- H01 - BASIC ELECTRIC ELEMENTS

applying unidirectional static pressure

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Manufacturing method of semiconductor package using jig

Chip assembly

Conductive paste for bonding

Chip assembly

Chip carrier and method thereof

Electronic device and method for producing an electronic device

Method of forming a chip assembly with a die attach liquid

Method for producing a material-bonding connection between a semico...

Method for ultrasonic bonding having at least one first and second...

Method of manufacturing optical module

Manufacturing process and heat dissipating device for forming inter...

Manufacturing process and heat dissipating device for forming inter...

Manufacturing method of semiconductor device

Patents Applicationslast 30 patents

JIG FOR MANUFACTURING SEMICONDUCTOR PACKAGE

MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE USING JIG

JIG FOR MANUFACTURING SEMICONDCUTOR PACKAGE AND MANUFACTURING METHO...

METHOD OF MANUFACTURING AN ELECTRONIC DEVICE

METHOD OF FORMING A CHIP ASSEMBLY AND CHIP ASSEMBLY

ELECTRONIC DEVICE, ELECTRONIC DEVICE MANUFACTURING METHOD, AND ELEC...

CHIP CARRIER AND METHOD THEREOF

Sintering Utilizing Non-Mechanical Pressure

Electrical Connecting Element and Method for Manufacturing the Same

MANUFACTURING PROCESS AND HEAT DISSIPATING DEVICE FOR FORMING INTER...

METHOD FOR ULTRASONIC BONDING HAVING AT LEAST ONE FIRST AND SECOND...

MANUFACTURING PROCESS AND HEAT DISSIPATING DEVICE FOR FORMING INTER...

METHOD OF MANUFACTURING OPTICAL MODULE

Manufacturing Method of Semiconductor Device