Arrangement of the layer connectors prior to mounting

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CPC
H01L2224/8319

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/8319Arrangement of the layer connectors prior to mounting

Industries

Patents Grantslast 30 patents

Information Patent Grant
Wafer stencil for controlling die attach material thickness on die
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- Issue date Nov 12, 2024
- Texas Instruments Incorporated
- Mario Alfonso Eduardo Magana
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device package and manufacturing method thereof
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- Issue date Nov 5, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Michael G. Kelly
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Information Patent Grant
System and method for integration of biological chips
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- Issue date Oct 29, 2024
- MGI Tech Co., Ltd.
- Liang Wang
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Grant
Semiconductor bonding structures and methods
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- Issue date Oct 15, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Tse Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method of manufacturing thereof
- Patent number 12,119,321
- Issue date Oct 15, 2024
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- Shih-An Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low pressure sintering powder
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- Issue date Oct 8, 2024
- Alpha Assembly Solutions Inc.
- Shamik Ghoshal
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Three-dimensional stacked fan-out packaging structure and method ma...
- Patent number 12,113,045
- Issue date Oct 8, 2024
- SJ SEMICONDUCTOR(JIANGYIN) CORPORATION
- Yenheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip package including lead frame and manufacturing m...
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- Issue date Oct 8, 2024
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- Shiau-Shi Lin
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Information Patent Grant
Semiconductor device with a semiconductor die embedded between an e...
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- Issue date Oct 1, 2024
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- Jae Yun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light-emitting device, manufacturing method thereof and display mod...
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- Issue date Oct 1, 2024
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- Min-Hsun Hsieh
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Information Patent Grant
Bonding structure production method and bonding structure
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- Issue date Sep 17, 2024
- Osaka University
- Katsuaki Suganuma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thick-silver layer interface
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- Issue date Sep 17, 2024
- NXP USA, INC.
- Lakshminarayan Viswanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged integrated circuit devices with through-body conductive vi...
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- Issue date Sep 10, 2024
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Information Patent Grant
Package with different types of semiconductor dies attached to a fl...
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- Issue date Sep 3, 2024
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- Xikun Zhang
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Information Patent Grant
Display device and method of manufacturing the same
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- Issue date Sep 3, 2024
- Samsung Display Co., Ltd.
- Eui Jeong Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Monolithic conductive column in a semiconductor device and associat...
- Patent number 12,074,094
- Issue date Aug 27, 2024
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and devices for fabricating and assembling printable semico...
- Patent number 12,074,213
- Issue date Aug 27, 2024
- The Board of Trustees of the University of Illinois
- Ralph G. Nuzzo
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Selective transfer of micro devices
- Patent number 12,075,565
- Issue date Aug 27, 2024
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of forming the same
- Patent number 12,058,101
- Issue date Aug 6, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Sinterable films and pastes and methods for use thereof
- Patent number 12,042,883
- Issue date Jul 23, 2024
- Henkel AG & Co. KGaA
- Pukun Zhu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chip package with redistribution structure having multiple chips
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- Issue date Jul 23, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shin-Puu Jeng
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Information Patent Grant
Circuit board and method for manufacturing electrical connection bo...
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- Akira Haraguchi
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Information Patent Grant
Systems of applying materials to components
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- Issue date Jul 16, 2024
- Laird Technologies, Inc.
- Jason L. Strader
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonded body and method for manufacturing same
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- Issue date Jul 9, 2024
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- Kei Anai
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Information Patent Grant
Semiconductor package having a through intervia through the molding...
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- Issue date Jul 9, 2024
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- Chen-Hua Yu
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Information Patent Grant
Connection body, method for manufacturing connection body, and conn...
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- Issue date Jul 9, 2024
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Information Patent Grant
Display panel, preparation method thereof, and display device
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- Quanpeng Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for fabricating silicon die stacks for electron...
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- Issue date Jul 2, 2024
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Information Patent Grant
Device including semiconductor chips and method for producing such...
- Patent number 12,027,481
- Issue date Jul 2, 2024
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- Petteri Palm
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Information Patent Grant
Camera module, and photosensitive component thereof and manufacturi...
- Patent number 12,021,097
- Issue date Jun 25, 2024
- NINGBO SUNNY OPOTECH CO., LTD.
- Mingzhu Wang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE
- Publication number 20240387387
- Publication date Nov 21, 2024
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Information Patent Application
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Information Patent Application
MONOLITHIC CONDUCTIVE COLUMN IN A SEMICONDUCTOR DEVICE AND ASSOCIAT...
- Publication number 20240379503
- Publication date Nov 14, 2024
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- H01 - BASIC ELECTRIC ELEMENTS
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PACKAGE SUBSTRATE HAVING EMBEDDED ELECTRONIC COMPONENT MOUNTED ON C...
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- Seongryul CHOI
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SYSTEMS AND METHODS FOR FABRICATING SILICON DIE STACKS FOR ELECTRON...
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Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240355900
- Publication date Oct 24, 2024
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- Man-Nung Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE INCLUDING SEMICONDUCTOR CHIPS AND METHOD FOR PRODUCING SUCH...
- Publication number 20240355767
- Publication date Oct 24, 2024
- INFINEON TECHNOLOGIES AG
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE HAVING MULTIPLE CHIPS
- Publication number 20240347439
- Publication date Oct 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shin-Puu JENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL SOLUTIONS FOR ADVANCED SEMICONDUCTORS
- Publication number 20240347497
- Publication date Oct 17, 2024
- International Business Machines Corporation
- SHIDONG LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTIDEVICE PACKAGE WITH RECESSED MOUNTING SURFACE
- Publication number 20240332105
- Publication date Oct 3, 2024
- NXP USA, Inc.
- Namrata Kanth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240332032
- Publication date Oct 3, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING THE SAME, AND METHOD...
- Publication number 20240312968
- Publication date Sep 19, 2024
- RENESAS ELECTRONICS CORPORATION
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FINGERPRINT SENSOR AND MANUFACTURING METHOD THEREOF
- Publication number 20240304577
- Publication date Sep 12, 2024
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- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
OPTICAL SENSOR PACKAGE
- Publication number 20240304639
- Publication date Sep 12, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
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Information Patent Application
INTEGRATION AND BONDING OF MICRO-DEVICES INTO SYSTEM SUBSTRATE
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- Publication date Sep 5, 2024
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heterogeneous Antenna in Fan-Out Package
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- Publication date Sep 5, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Po-Yao Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH DIE SUPPORT MEMBERS AND A...
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- Publication date Aug 15, 2024
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- Seng Kim Ye
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Information Patent Application
HEAT DISSIPATION IN SEMICONDUCTOR DEVICES
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- Publication date Aug 15, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Che Chi Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH HIGH ROUTING DENSITY PATCH
- Publication number 20240266324
- Publication date Aug 8, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Michael Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240266189
- Publication date Aug 8, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREFOR
- Publication number 20240234364
- Publication date Jul 11, 2024
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- Tae Sup CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING PACKAGE STRUCTURE
- Publication number 20240234329
- Publication date Jul 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Fang-Yu Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH A MULTI-LAYERED ENCAPSULANT AND ASSOCIATE...
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- Publication date Jul 4, 2024
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- Shijian Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3DIC PACKAGING WITH HOT SPOT THERMAL MANAGEMENT FEATURES
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Information Patent Application
SENSOR PACKAGING METHOD AND SENSOR PACKAGE
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGING DEVICE AND HEAT DISSIPATION COVER THEREOF
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- Global Unichip Corporation
- Sheng-Fan YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240203900
- Publication date Jun 20, 2024
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Information Patent Application
Semiconductor Device and Method of Making a Semiconductor Package w...
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Information Patent Application
IN-SITU UV CURE PLACEMENT TOOL FOR ROOM TEMPERATURE CHIP/GLASS DEVI...
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Information Patent Application
DISCONTINUOUS PATTERNED BONDS FOR SEMICONDUCTOR DEVICES AND ASSOCIA...
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- Scott D. Schellhammer
- H01 - BASIC ELECTRIC ELEMENTS

Arrangement of the layer connectors prior to mounting

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Wafer stencil for controlling die attach material thickness on die

Semiconductor device package and manufacturing method thereof

System and method for integration of biological chips

Semiconductor bonding structures and methods

Semiconductor device and a method of manufacturing thereof

Low pressure sintering powder

Three-dimensional stacked fan-out packaging structure and method ma...

Semiconductor chip package including lead frame and manufacturing m...

Semiconductor device with a semiconductor die embedded between an e...

Light-emitting device, manufacturing method thereof and display mod...

Bonding structure production method and bonding structure

Thick-silver layer interface

Packaged integrated circuit devices with through-body conductive vi...

Package with different types of semiconductor dies attached to a fl...

Display device and method of manufacturing the same

Monolithic conductive column in a semiconductor device and associat...

Methods and devices for fabricating and assembling printable semico...

Selective transfer of micro devices

Package structure and method of forming the same

Sinterable films and pastes and methods for use thereof

Chip package with redistribution structure having multiple chips

Circuit board and method for manufacturing electrical connection bo...

Systems of applying materials to components

Bonded body and method for manufacturing same

Semiconductor package having a through intervia through the molding...

Connection body, method for manufacturing connection body, and conn...

Display panel, preparation method thereof, and display device

Systems and methods for fabricating silicon die stacks for electron...

Device including semiconductor chips and method for producing such...

Camera module, and photosensitive component thereof and manufacturi...

Patents Applicationslast 30 patents

ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE

SELECTIVE TRANSFER OF MICRO DEVICES

MONOLITHIC CONDUCTIVE COLUMN IN A SEMICONDUCTOR DEVICE AND ASSOCIAT...

PACKAGE SUBSTRATE HAVING EMBEDDED ELECTRONIC COMPONENT MOUNTED ON C...

SYSTEMS AND METHODS FOR FABRICATING SILICON DIE STACKS FOR ELECTRON...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

DEVICE INCLUDING SEMICONDUCTOR CHIPS AND METHOD FOR PRODUCING SUCH...

CHIP PACKAGE HAVING MULTIPLE CHIPS

THERMAL SOLUTIONS FOR ADVANCED SEMICONDUCTORS

MULTIDEVICE PACKAGE WITH RECESSED MOUNTING SURFACE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING THE SAME, AND METHOD...

FINGERPRINT SENSOR AND MANUFACTURING METHOD THEREOF

OPTICAL SENSOR PACKAGE

INTEGRATION AND BONDING OF MICRO-DEVICES INTO SYSTEM SUBSTRATE

Heterogeneous Antenna in Fan-Out Package

STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH DIE SUPPORT MEMBERS AND A...

HEAT DISSIPATION IN SEMICONDUCTOR DEVICES

SEMICONDUCTOR PACKAGE WITH HIGH ROUTING DENSITY PATCH

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREFOR

METHOD OF FORMING PACKAGE STRUCTURE

SEMICONDUCTOR DEVICE WITH A MULTI-LAYERED ENCAPSULANT AND ASSOCIATE...

3DIC PACKAGING WITH HOT SPOT THERMAL MANAGEMENT FEATURES

SENSOR PACKAGING METHOD AND SENSOR PACKAGE

SEMICONDUCTOR PACKAGING DEVICE AND HEAT DISSIPATION COVER THEREOF

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

Semiconductor Device and Method of Making a Semiconductor Package w...

IN-SITU UV CURE PLACEMENT TOOL FOR ROOM TEMPERATURE CHIP/GLASS DEVI...

DISCONTINUOUS PATTERNED BONDS FOR SEMICONDUCTOR DEVICES AND ASSOCIA...