Arrangements for conducting electric current to or from the device in operations

Industry

CPC
H01L31/02002

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L31/00Semiconductor devices sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation Processes or apparatus peculiar to the manufacture or treatment thereof or of parts thereof Details thereof

Current Industry

H01L31/02002Arrangements for conducting electric current to or from the device in operations

Industries

Patents Grantslast 30 patents

Information Patent Grant
Photoelectric conversion device, method for producing the same, and...
- Patent number 12,107,110
- Issue date Oct 1, 2024
- Canon Kabushiki Kaisha
- Toshiyuki Ogawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a semiconductor component having an insulating...
- Patent number 12,100,791
- Issue date Sep 24, 2024
- OSRAM OLED GmbH
- Benjamin Michaelis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-foil-assisted fabrication of thin-silicon solar cell
- Patent number 12,080,811
- Issue date Sep 3, 2024
- Maxeon Solar Pte. Ltd.
- Seung Bum Rim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid integrated circuit package
- Patent number 12,068,297
- Issue date Aug 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photonic package and method of manufacture
- Patent number 12,038,599
- Issue date Jul 16, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component having an element and alligned first and secon...
- Patent number 12,033,931
- Issue date Jul 9, 2024
- Canon Kabushiki Kaisha
- Hidehiro Wakamiya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Windowed wafer assemblies having interposers
- Patent number 12,021,156
- Issue date Jun 25, 2024
- Texas Instruments Incorporated
- Simon Joshua Jacobs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid pocket post and tailored via dielectric for 3D-integrated el...
- Patent number 12,002,773
- Issue date Jun 4, 2024
- Raytheon Company
- Andrew Clarke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor package structure having ring-shaped solder mask frame
- Patent number 11,984,516
- Issue date May 14, 2024
- Tong Hsing Electronic Industries, Ltd.
- Fu-Chou Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and a method in a wireless communications network
- Patent number 11,979,113
- Issue date May 7, 2024
- Telefonaktiebolaget LM Ericsson (publ)
- Lackis Eleftheriadis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photonic semiconductor device and method of manufacture
- Patent number 11,973,074
- Issue date Apr 30, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor package structure having solder mask frame
- Patent number 11,967,652
- Issue date Apr 23, 2024
- Tong Hsing Electronic Industries, Ltd.
- Fu-Chou Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure and method for manufacturing the same, and m...
- Patent number 11,929,313
- Issue date Mar 12, 2024
- Shanghai Tianma Micro-Electronics Co., Ltd.
- Mingyu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light sensor with voltage reversing mechanism detecting light from...
- Patent number 11,908,959
- Issue date Feb 20, 2024
- Anpec Electronics Corporation
- Jia-Hua Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming a colored conductive ribbon for integration in a...
- Patent number 11,876,139
- Issue date Jan 16, 2024
- SOLARCA LLC
- Lisong Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical system
- Patent number 11,852,844
- Issue date Dec 26, 2023
- TDK TAIWAN CORP.
- Fu-Yuan Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and forming method thereof
- Patent number 11,855,232
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Hsuan Tai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer scale bonded active photonics interposer
- Patent number 11,841,531
- Issue date Dec 12, 2023
- The Research Foundation for the State University of New York
- Douglas Coolbaugh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical package structure and method for manufacturing the same
- Patent number 11,784,174
- Issue date Oct 10, 2023
- Advanced Semiconductor Engineering, Inc.
- Ying-Chung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical device and electronic device
- Patent number 11,764,311
- Issue date Sep 19, 2023
- Advanced Semiconductor Engineering, Inc.
- Yu-Pin Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
WLCSP with transparent substrate and method of manufacturing the same
- Patent number 11,742,437
- Issue date Aug 29, 2023
- STMicroelectronics Ltd.
- David Gani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solar cell module on flexible supporting film
- Patent number 11,728,452
- Issue date Aug 15, 2023
- SolAero Techologies Corp.
- Daniel Aiken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photonic semiconductor device and method of manufacture
- Patent number 11,715,728
- Issue date Aug 1, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- G02 - OPTICS
Information Patent Grant
Semiconductor component having a compressive strain layer and metho...
- Patent number 11,705,370
- Issue date Jul 18, 2023
- OSRAM OLED GmbH
- Benjamin Michaelis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a cover for an electronic package and elec...
- Patent number 11,688,815
- Issue date Jun 27, 2023
- STMicroelectronics (Grenoble 2) SAS
- Karine Saxod
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of adjusting optical system
- Patent number 11,650,430
- Issue date May 16, 2023
- TDK TAIWAN CORP.
- Chao-Chang Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermoelectric cooler including a single, solid, and electrically i...
- Patent number 11,640,999
- Issue date May 2, 2023
- Moxtek, Inc.
- Jason Maynard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method for manufacturing the same
- Patent number 11,626,525
- Issue date Apr 11, 2023
- Advanced Semiconductor Engineering, Inc.
- Chun Yu Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid integrated circuit package and method
- Patent number 11,605,621
- Issue date Mar 14, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnection of neighboring solar cells on a flexible supporting...
- Patent number 11,594,652
- Issue date Feb 28, 2023
- SolAero Technologies Corp.
- Daniel Aiken
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
HYBRID INTEGRATED CIRCUIT PACKAGES
- Publication number 20240363610
- Publication date Oct 31, 2024
- Taiwan Semiconductor Mamufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Photonic Package and Method of Manufacture
- Publication number 20240329302
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Photonic Semiconductor Device and Method of Manufacture
- Publication number 20240266338
- Publication date Aug 8, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT-RECEIVING ELEMENT AND LIGHT DETECTION DEVICE
- Publication number 20240234593
- Publication date Jul 11, 2024
- Sumitomo Electric Industries, Ltd.
- Kazutoshi NATSUME
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL SEMICONDUCTOR ELEMENT
- Publication number 20240222529
- Publication date Jul 4, 2024
- HAMAMATSU PHOTONICS K. K.
- Takahide YANAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CURRENT-ASSISTED PHOTONIC DEMODULATOR INCLUDING DOPED MODULATION AN...
- Publication number 20240192440
- Publication date Jun 13, 2024
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Abdelkader ALIANE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES WITH SIDE-FACING AMBIENT LIGHT SENSORS
- Publication number 20240178329
- Publication date May 30, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Masamitsu MATSUURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR SYSTEM WITH WAVEGUIDE ASSEMBLY WITH RF SIGNAL IMPEDAN...
- Publication number 20240145612
- Publication date May 2, 2024
- Purdue Research Foundation
- Thomas R. Jones
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND FORMING METHOD THEREOF
- Publication number 20240088307
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hsuan Tai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT SENSOR WITH VOLTAGE REVERSING MECHANISM
- Publication number 20240038905
- Publication date Feb 1, 2024
- ANPEC ELECTRONICS CORPORATION
- Jia-Hua Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING A COLORED CONDUCTIVE RIBBON FOR INTEGRATION IN A...
- Publication number 20230411541
- Publication date Dec 21, 2023
- The Solaria Corporation
- Lisong Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20230369528
- Publication date Nov 16, 2023
- XINTEC INC.
- Chia-Ming CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSOR PACKAGE STRUCTURE
- Publication number 20230207709
- Publication date Jun 29, 2023
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- FU-CHOU LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSOR PACKAGE STRUCTURE
- Publication number 20230207708
- Publication date Jun 29, 2023
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- FU-CHOU LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSOR PACKAGE STRUCTURE
- Publication number 20230197863
- Publication date Jun 22, 2023
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- FU-CHOU LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...
- Publication number 20230117746
- Publication date Apr 20, 2023
- Amkor Technology Singapore Holding Pte. Ltd.
- Ki Dong Sim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING TERAHERTZ DEVICE
- Publication number 20230065768
- Publication date Mar 2, 2023
- ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Dong Woo PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Radiation Hardened Infrared Focal Plane Array
- Publication number 20230008594
- Publication date Jan 12, 2023
- Yong Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES
- Publication number 20220393039
- Publication date Dec 8, 2022
- Amkor Technology Singapore Holding Pte. Ltd.
- Ji Young Chung
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Photonic Semiconductor Device and Method of Manufacture
- Publication number 20220392881
- Publication date Dec 8, 2022
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT OPTICAL PACKAGE
- Publication number 20220392820
- Publication date Dec 8, 2022
- STMicroelectronics (Grenoble 2) SAS
- Romain COFFY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER SCALE BONDED ACTIVE PHOTONICS INTERPOSER
- Publication number 20220381974
- Publication date Dec 1, 2022
- The Research Foundation for the State University of New York
- Douglas COOLBAUGH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HBM SILICON PHOTONIC TSV ARCHITECTURE FOR LOOKUP COMPUTING AI ACCEL...
- Publication number 20220367412
- Publication date Nov 17, 2022
- Samsung Electronics Co., Ltd.
- Peng GU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTODETECTOR
- Publication number 20220344520
- Publication date Oct 27, 2022
- Hamamatsu Photonics K.K.
- Masaharu MURAMATSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermoelectric Cooler Mount
- Publication number 20220320353
- Publication date Oct 6, 2022
- MOXTEK, INC.
- Jason Maynard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID POCKET POST AND TAILORED VIA DIELECTRIC FOR 3D-INTEGRATED EL...
- Publication number 20220285298
- Publication date Sep 8, 2022
- Raytheon Company
- Andrew Clarke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND FORMING METHOD THEREOF
- Publication number 20220285566
- Publication date Sep 8, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hsuan Tai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20220246592
- Publication date Aug 4, 2022
- Advanced Semiconductor Engineering, Inc.
- Ying-Chung CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTOELECTRIC CONVERSION DEVICE, PHOTOELECTRIC CONVERSION SYSTEM, A...
- Publication number 20220238743
- Publication date Jul 28, 2022
- Canon Kabushiki Kaisha
- Ayman Tarek Abdelghafar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTOELECTRIC CONVERSION DEVICE, METHOD FOR PRODUCING THE SAME, AND...
- Publication number 20220238588
- Publication date Jul 28, 2022
- Canon Kabushiki Kaisha
- Toshiyuki Ogawa
- H01 - BASIC ELECTRIC ELEMENTS

Arrangements for conducting electric current to or from the device in operations

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Photoelectric conversion device, method for producing the same, and...

Method for producing a semiconductor component having an insulating...

Metal-foil-assisted fabrication of thin-silicon solar cell

Hybrid integrated circuit package

Photonic package and method of manufacture

Electronic component having an element and alligned first and secon...

Windowed wafer assemblies having interposers

Hybrid pocket post and tailored via dielectric for 3D-integrated el...

Sensor package structure having ring-shaped solder mask frame

Apparatus and a method in a wireless communications network

Photonic semiconductor device and method of manufacture

Sensor package structure having solder mask frame

Chip package structure and method for manufacturing the same, and m...

Light sensor with voltage reversing mechanism detecting light from...

Methods of forming a colored conductive ribbon for integration in a...

Optical system

Semiconductor package and forming method thereof

Wafer scale bonded active photonics interposer

Optical package structure and method for manufacturing the same

Optical device and electronic device

WLCSP with transparent substrate and method of manufacturing the same

Solar cell module on flexible supporting film

Photonic semiconductor device and method of manufacture

Semiconductor component having a compressive strain layer and metho...

Method for manufacturing a cover for an electronic package and elec...

Method of adjusting optical system

Thermoelectric cooler including a single, solid, and electrically i...

Package structure and method for manufacturing the same

Hybrid integrated circuit package and method

Interconnection of neighboring solar cells on a flexible supporting...

Patents Applicationslast 30 patents

HYBRID INTEGRATED CIRCUIT PACKAGES

Photonic Package and Method of Manufacture

Photonic Semiconductor Device and Method of Manufacture

LIGHT-RECEIVING ELEMENT AND LIGHT DETECTION DEVICE

OPTICAL SEMICONDUCTOR ELEMENT

CURRENT-ASSISTED PHOTONIC DEMODULATOR INCLUDING DOPED MODULATION AN...

SEMICONDUCTOR PACKAGES WITH SIDE-FACING AMBIENT LIGHT SENSORS

SEMICONDUCTOR SYSTEM WITH WAVEGUIDE ASSEMBLY WITH RF SIGNAL IMPEDAN...

SEMICONDUCTOR PACKAGE AND FORMING METHOD THEREOF

LIGHT SENSOR WITH VOLTAGE REVERSING MECHANISM

METHODS OF FORMING A COLORED CONDUCTIVE RIBBON FOR INTEGRATION IN A...

CHIP PACKAGE AND MANUFACTURING METHOD THEREOF

SENSOR PACKAGE STRUCTURE

SENSOR PACKAGE STRUCTURE

SENSOR PACKAGE STRUCTURE

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...

METHOD FOR FABRICATING TERAHERTZ DEVICE

Radiation Hardened Infrared Focal Plane Array

ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES

Photonic Semiconductor Device and Method of Manufacture

INTEGRATED CIRCUIT OPTICAL PACKAGE

WAFER SCALE BONDED ACTIVE PHOTONICS INTERPOSER

HBM SILICON PHOTONIC TSV ARCHITECTURE FOR LOOKUP COMPUTING AI ACCEL...

PHOTODETECTOR

Thermoelectric Cooler Mount

HYBRID POCKET POST AND TAILORED VIA DIELECTRIC FOR 3D-INTEGRATED EL...

SEMICONDUCTOR PACKAGE AND FORMING METHOD THEREOF

OPTICAL PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

PHOTOELECTRIC CONVERSION DEVICE, PHOTOELECTRIC CONVERSION SYSTEM, A...

PHOTOELECTRIC CONVERSION DEVICE, METHOD FOR PRODUCING THE SAME, AND...