Membership
Tour
Register
Log in
Arsenic [As]
Follow
Industry
CPC
H01L2924/01033
This industry / category may be too specific. Please go to a parent level for more data
Parent Industries
H
ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2924/00
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
Current Industry
H01L2924/01033
Arsenic [As]
Industries
Overview
Organizations
People
Information
Impact
Patents Grants
last 30 patents
Information
Patent Grant
Semiconductor device having electrode pads arranged between groups...
Patent number
11,901,251
Issue date
Feb 13, 2024
Rohm Co., Ltd.
Kunihiro Komiya
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multi-chip package and method of providing die-to-die interconnects...
Patent number
11,876,053
Issue date
Jan 16, 2024
Intel Corporation
Henning Braunisch
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor components having conductive vias with aligned back s...
Patent number
11,869,809
Issue date
Jan 9, 2024
Micron Technology, Inc.
Jin Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for forming a semiconductor device having TSV formed through...
Patent number
11,854,990
Issue date
Dec 26, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Hsien-Pin Hu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device with sealed semiconductor chip
Patent number
11,854,946
Issue date
Dec 26, 2023
Kioxia Corporation
Isao Ozawa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device with a semiconductor chip connected in a flip...
Patent number
11,842,972
Issue date
Dec 12, 2023
Rohm Co., Ltd.
Kazumasa Tanida
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multi-chip package and method of providing die-to-die interconnects...
Patent number
11,824,008
Issue date
Nov 21, 2023
Intel Corporation
Henning Braunisch
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device having through silicon vias and manufacturing...
Patent number
11,817,427
Issue date
Nov 14, 2023
LONGITUDE LICENSING LIMITED
Ryohei Kitada
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Circuit board structure and method for manufacturing a circuit boar...
Patent number
11,792,941
Issue date
Oct 17, 2023
IMBERATEK, LLC
Risto Tuominen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of room temperature covalent bonding
Patent number
11,760,059
Issue date
Sep 19, 2023
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Qin-Yi Tong
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Semiconductor memory device structure
Patent number
11,742,307
Issue date
Aug 29, 2023
OVONYX MEMORY TECHNOLOGY, LLC
John Moore
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Apparatuses and methods for monitoring health of probing u-bump clu...
Patent number
11,740,282
Issue date
Aug 29, 2023
Intel Corporation
Jagat Shakya
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method for production of semiconductor device
Patent number
11,715,752
Issue date
Aug 1, 2023
Sony Group Corporation
Atsushi Okuyama
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for manufacturing an electronic module and electronic module
Patent number
11,716,816
Issue date
Aug 1, 2023
IMBERATEK, LLC
Antti Iihola
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods for attachment and devices produced using the methods
Patent number
11,699,632
Issue date
Jul 11, 2023
Alpha Assembly Solutions Inc.
Monnir Boureghda
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for manufacturing a semiconductor device having a semiconduc...
Patent number
11,688,659
Issue date
Jun 27, 2023
Kioxia Corporation
Yoshiaki Goto
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and a method of manufacturing the same
Patent number
11,600,522
Issue date
Mar 7, 2023
Renesas Electronics Corporation
Katsuhiko Hotta
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Packaged integrated circuit devices with through-body conductive vi...
Patent number
11,594,525
Issue date
Feb 28, 2023
Micron Technology, Inc.
Tongbi Jiang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Microelectronic devices with through-substrate interconnects and as...
Patent number
11,527,436
Issue date
Dec 13, 2022
Micron Technology, Inc.
Kyle K. Kirby
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor die contact structure and method
Patent number
11,515,272
Issue date
Nov 29, 2022
Taiwan Semiconductor Manufacturing Company, Ltd.
Chung-Shi Liu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
3D IC method and device
Patent number
11,515,202
Issue date
Nov 29, 2022
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Paul M. Enquist
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of making flip chip
Patent number
RE49286
Issue date
Nov 8, 2022
Research & Business Foundation SUNGKYUNKWAN UNIV
Seung Boo Jung
Information
Patent Grant
Systems and methods for optimizing looping parameters and looping t...
Patent number
11,495,570
Issue date
Nov 8, 2022
Kulicke and Soffa Industries, Inc.
Ivy Wei Qin
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Semiconductor chip with redundant thru-silicon-vias
Patent number
11,469,212
Issue date
Oct 11, 2022
Advanced Micro Devices, Inc.
Bryan Black
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Universal surface-mount semiconductor package
Patent number
11,469,205
Issue date
Oct 11, 2022
Adventive International Ltd.
Richard K. Williams
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Four D device process and structure
Patent number
11,458,717
Issue date
Oct 4, 2022
International Business Machines Corporation
Roy R. Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stretchable form of single crystal silicon for high performance ele...
Patent number
11,456,258
Issue date
Sep 27, 2022
The Board of Trustees of the University of Illinois
John A. Rogers
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Impedance controlled electrical interconnection employing meta-mate...
Patent number
11,456,255
Issue date
Sep 27, 2022
Taiwan Semiconductor Manufacturing Company, Ltd
Christopher Wyland
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device with sealed semiconductor chip
Patent number
11,424,176
Issue date
Aug 23, 2022
Kioxia Corporation
Isao Ozawa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device having electrode pads arranged between groups...
Patent number
11,410,900
Issue date
Aug 9, 2022
Rohm Co., Ltd.
Kunihiro Komiya
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
SEMICONDUCTOR DEVICE HAVING ELECTRODE PADS ARRANGED BETWEEN GROUPS...
Publication number
20240136241
Publication date
Apr 25, 2024
Rohm Co., Ltd.
Kunihiro KOMIYA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE WITH A SEMICONDUCTOR CHIP CONNECTED IN A FLIP...
Publication number
20240055384
Publication date
Feb 15, 2024
Rohm Co., Ltd.
Kazumasa Tanida
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP-SCALE PACKAGE
Publication number
20230230892
Publication date
Jul 20, 2023
NEXPERIA B.V.
Regnerus Hermannus Poelma
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE
Publication number
20230223441
Publication date
Jul 13, 2023
Fuji Electric Co., Ltd.
Hayato NAKANO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
REMOTE MECHANICAL ATTACHMENT FOR BONDED THERMAL MANAGEMENT SOLUTIONS
Publication number
20230197565
Publication date
Jun 22, 2023
Jerrod P. Peterson
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGED INTEGRATED CIRCUIT DEVICES WITH THROUGH-BODY CONDUCTIVE VI...
Publication number
20230197690
Publication date
Jun 22, 2023
Micron Technology, Inc.
Tongbi Jiang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME
Publication number
20230187275
Publication date
Jun 15, 2023
RENESAS ELECTRONICS CORPORATION
Katsuhiko HOTTA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Die Contact Structure and Method
Publication number
20230085696
Publication date
Mar 23, 2023
Taiwan Semiconductor Manufacturing Co., Ltd.
Chung-Shi Liu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CONNECTION STRUCTURE AND MANUFACTURING METHOD THEREFOR
Publication number
20230060577
Publication date
Mar 2, 2023
Showa Denko Materials Co., Ltd.
Kunihiko AKAI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR CHIP WITH REDUNDANT THRU-SILICON-VIAS
Publication number
20230031099
Publication date
Feb 2, 2023
ADVANCED MICRO DEVICES, INC.
BRYAN BLACK
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Impedance Controlled Electrical Interconnection Employing Meta-Mate...
Publication number
20230020310
Publication date
Jan 19, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Christopher Wyland
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
COPPER ALLOY BONDING WIRE FOR SEMICONDUCTOR DEVICES
Publication number
20230018430
Publication date
Jan 19, 2023
NIPPON MICROMETAL CORPORATION
Daizo ODA
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Universal Surface-Mount Semiconductor Package
Publication number
20220415849
Publication date
Dec 29, 2022
Adventive International Ltd.
Richard K Williams
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE WITH SEALED SEMICONDUCTOR CHIP
Publication number
20220352053
Publication date
Nov 3, 2022
KIOXIA Corporation
Isao OZAWA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MICROELECTRONIC DEVICES WITH THROUGH-SUBSTRATE INTERCONNECTS AND AS...
Publication number
20220336273
Publication date
Oct 20, 2022
Micron Technology, Inc.
Kyle K. Kirby
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
EMBEDDED SEMICONDUCTIVE CHIPS IN RECONSTITUTED WAFERS, AND SYSTEMS...
Publication number
20220336229
Publication date
Oct 20, 2022
Intel Corporation
Robert L. Sankman
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE HAVING ELECTRODE PADS ARRANGED BETWEEN GROUPS...
Publication number
20220336305
Publication date
Oct 20, 2022
Rohm Co., Ltd.
Kunihiro KOMIYA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGED INTEGRATED CIRCUIT DEVICES WITH THROUGH-BODY CONDUCTIVE VI...
Publication number
20220285325
Publication date
Sep 8, 2022
Micron Technology, Inc.
Tongbi Jiang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
EMBEDDED SEMICONDUCTIVE CHIPS IN RECONSTITUTED WAFERS, AND SYSTEMS...
Publication number
20220172962
Publication date
Jun 2, 2022
Intel Corporation
Robert L. Sankman
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR MEMORY DEVICE STRUCTURE
Publication number
20220157753
Publication date
May 19, 2022
Ovonyx Memory Technology, LLC
John Moore
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE PROCESS AND PACKAGE STRUCTURE
Publication number
20220157775
Publication date
May 19, 2022
Advanced Semiconductor Engineering, Inc.
Chi-Chih SHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGED MICROELECTRONIC DEVICES HAVING STACKED INTERCONNECT ELEMEN...
Publication number
20220122938
Publication date
Apr 21, 2022
Micron Technology, Inc.
Young Do Kweon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device Having Through Silicon Vias and Manufacturing...
Publication number
20220102318
Publication date
Mar 31, 2022
Ryohei Kitada
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
COMPOSITION FOR CONDUCTIVE ADHESIVE, SEMICONDUCTOR PACKAGE COMPRISI...
Publication number
20220077099
Publication date
Mar 10, 2022
ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
Gwang-Mun CHOI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DESIGNS AND METHODS FOR CONDUCTIVE BUMPS
Publication number
20220059484
Publication date
Feb 24, 2022
Intel Corporation
Valery M. DUBIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE WITH SEALED SEMICONDUCTOR CHIP
Publication number
20220044987
Publication date
Feb 10, 2022
Toshiba Memory Corporation
Isao OZAWA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGED SEMICONDUCTOR ASSEMBLIES AND METHODS FOR MANUFACTURING SUC...
Publication number
20220013460
Publication date
Jan 13, 2022
Micron Technology, Inc.
Suan Jeung Boon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Circuit board structure and method for manufacturing a circuit boar...
Publication number
20210392752
Publication date
Dec 16, 2021
ImberaTek LLC
Risto Tuominen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCTION OF SEMICONDUCTOR DEVICE
Publication number
20210366975
Publication date
Nov 25, 2021
SONY GROUP CORPORATION
Atsushi Okuyama
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC MODULE
Publication number
20210321520
Publication date
Oct 14, 2021
IMBERATEK, LLC
Risto Tuominen
H01 - BASIC ELECTRIC ELEMENTS