Assembly of heatsink parts

Industry

CPC
H01L21/4882

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/4882Assembly of heatsink parts

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Systems and methods for power module for inverter for electric vehicle
- Patent number 12,368,391
- Issue date Jul 22, 2025
- BorgWarner US Technologies LLC
- David Paul Buehler
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Embedded cooling systems for advanced device packaging and methods...
- Patent number 12,368,087
- Issue date Jul 22, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 12,368,084
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus including direct-contact heat paths and methods of manufa...
- Patent number 12,362,255
- Issue date Jul 15, 2025
- Micron Technology, Inc.
- Kelvin Tan Aik Boo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with ball grid array connection having improv...
- Patent number 12,362,307
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Sheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IC package with heat spreader
- Patent number 12,347,742
- Issue date Jul 1, 2025
- Texas Instruments Incorporated
- Rongwei Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for power module for inverter for electric vehicle
- Patent number 12,348,157
- Issue date Jul 1, 2025
- BorgWarner US Technologies LLC
- David Paul Buehler
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Chip cooling package with multiple fluid paths
- Patent number 12,341,082
- Issue date Jun 24, 2025
- BAIDU USA LLC
- Tianyi Gao
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Systems and methods for multiple output integrated gate driver for...
- Patent number 12,341,454
- Issue date Jun 24, 2025
- BorgWarner US Technologies LLC
- Mark Wendell Gose
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Electronic package and manufacturing method thereof
- Patent number 12,334,456
- Issue date Jun 17, 2025
- Siliconware Precision Industries Co., Ltd.
- Chung-Yu Ke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for galvanic isolation for inverter for electri...
- Patent number 12,328,083
- Issue date Jun 10, 2025
- BorgWarner US Technologies LLC
- Srikanth Vijaykumar
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Systems and methods for data recorder for inverter for electric veh...
- Patent number 12,323,080
- Issue date Jun 3, 2025
- BorgWarner US Technologies LLC
- Marc R. Engelhardt
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Encapsulation structure and encapsulation method of power module
- Patent number 12,322,678
- Issue date Jun 3, 2025
- Huawei Technologies Co., Ltd.
- Huibin Chen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems and methods for an interlocking feature on a power module
- Patent number 12,316,257
- Issue date May 27, 2025
- BorgWarner US Technologies LLC
- Edward Choi
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Electrochemical additive manufacturing system having conductive see...
- Patent number 12,308,251
- Issue date May 20, 2025
- FABRIC8LABS, INC.
- David Pain
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Semiconductor device having a heat dissipation structure connected...
- Patent number 12,300,618
- Issue date May 13, 2025
- Taiwna Semiconductor Manufacturing Company, Ltd.
- Po-Yuan Teng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid metal foam thermal interface material
- Patent number 12,300,567
- Issue date May 13, 2025
- Indium Corporation
- Ross B. Berntson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic circuit comprising a RF switches having reduced parasiti...
- Patent number 12,293,981
- Issue date May 6, 2025
- STMicroelectronics (Crolles 2) SAS
- Stephane Monfray
- G11 - INFORMATION STORAGE
Information Patent Grant
Systems and methods for cooling system and power module for inverte...
- Patent number 12,284,791
- Issue date Apr 22, 2025
- BorgWarner US Technologies LLC
- Bryan Rohl
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Integrated cooling assemblies for advanced device packaging and met...
- Patent number 12,283,490
- Issue date Apr 22, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Gaius Gillman Fountain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for parameter drift correction for inverter for...
- Patent number 12,279,402
- Issue date Apr 15, 2025
- BorgWarner US Technologies LLC
- Seyed R. Zarabadi
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Semiconductor package
- Patent number 12,278,156
- Issue date Apr 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chin-Hua Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor module with injection-molded or laminated coole...
- Patent number 12,278,163
- Issue date Apr 15, 2025
- HITACHI ENERGY LTD
- Niko Pavlicek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures and methods for integrated cold plate in XPUs and memory
- Patent number 12,266,545
- Issue date Apr 1, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Laura Mirkarimi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for cooling system and power module for inverte...
- Patent number 12,261,558
- Issue date Mar 25, 2025
- BorgWarner US Technologies LLC
- Bryan Rohl
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Composite substrate and method of producing the composite substrate...
- Patent number 12,261,090
- Issue date Mar 25, 2025
- Nichia Corporation
- Masatsugu Ichikawa
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Micro heat transfer arrays, micro cold plates, and thermal manageme...
- Patent number 12,255,123
- Issue date Mar 18, 2025
- Microfabrica Inc.
- Onnik Yaglioglu
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Manufacturing method of integrated substrate structure
- Patent number 12,249,567
- Issue date Mar 11, 2025
- Dyi-Chung Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic packages with integral heat spreaders
- Patent number 12,243,799
- Issue date Mar 4, 2025
- NAVITAS SEMICONDUCTOR LIMITED
- Charles Bailley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of fabricating the same
- Patent number 12,243,798
- Issue date Mar 4, 2025
- Samsung Electronics Co., Ltd.
- Jae-Min Jung
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE HAVING A HEAT DISSIPATION STRUCTURE CONNECTED...
- Publication number 20250239528
- Publication date Jul 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Yuan Teng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING A COOLING DEVICE
- Publication number 20250233052
- Publication date Jul 17, 2025
- MIBA SINTER AUSTRIA GMBH
- Daniel RIEMER
- B22 - CASTING POWDER METALLURGY
Information Patent Application
INTEGRATED COOLING ASSEMBLIES FOR ADVANCED DEVICE PACKAGING AND MET...
- Publication number 20250233053
- Publication date Jul 17, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Gaius Gillman Fountain Jr.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR COOLING SYSTEM AND POWER MODULE FOR INVERTE...
- Publication number 20250219554
- Publication date Jul 3, 2025
- BorgWarner US Technologies LLC
- Bryan Rohl
- B60 - VEHICLES IN GENERAL
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD FOR THE SAME
- Publication number 20250210440
- Publication date Jun 26, 2025
- Samsung Electronics Co., Ltd.
- Minjung KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC CIRCUIT COMPRISING A RF SWITCHES HAVING REDUCED PARASITI...
- Publication number 20250210550
- Publication date Jun 26, 2025
- STMicroelectronics (Crolles 2) SAS
- Stephane MONFRAY
- G11 - INFORMATION STORAGE
Information Patent Application
EMBEDDED COOLING SYSTEMS FOR ADVANCED DEVICE PACKAGING AND METHODS...
- Publication number 20250210459
- Publication date Jun 26, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE INCLUDING THERMAL INTERPOSER LAYER
- Publication number 20250201662
- Publication date Jun 19, 2025
- QUALCOMM Incorporated
- Je-Hsiung LAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTELLIGENT POWER MODULE
- Publication number 20250201680
- Publication date Jun 19, 2025
- RICHTEK TECHNOLOGY CORPORATION
- Lung-Sheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMI-CONDUCTOR DEVICE
- Publication number 20250183118
- Publication date Jun 5, 2025
- NEXPERIA B.V.
- Wai Wai Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING HEAT RADIATION STRUCTURE, COOLING S...
- Publication number 20250174521
- Publication date May 29, 2025
- JMJ KOREA CO., LTD.
- Yun Hwa CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SUBSTRATE COOLING MECHANISM AND SUBSTRATE...
- Publication number 20250174511
- Publication date May 29, 2025
- NEC Corporation
- Junichi Chiba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHODS FOR ON-CHIP HEAT ROUTING ARCHITECTURES
- Publication number 20250167064
- Publication date May 22, 2025
- Samsung Electronics Co., Ltd.
- Radwanul Hasan SIDDIQUE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CERAMIC SUBSTRATE UNIT AND MANUFACTURING METHOD THEREFOR
- Publication number 20250167071
- Publication date May 22, 2025
- AMOGREENTECH CO., LTD.
- Jihyung LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY MODULE AND METHOD OF MANUFACTURING THE MEMORY MODULE
- Publication number 20250167068
- Publication date May 22, 2025
- Samsung Electronics Co., Ltd.
- Jinkyu YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT-INCORPORATING SUBSTRATE
- Publication number 20250149404
- Publication date May 8, 2025
- Shinko Electric Industries Co., Ltd.
- Shinichiro Sekijima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMMERSION DIRECT COOLING MODULES AND RELATED METHODS
- Publication number 20250149406
- Publication date May 8, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Oseob JEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, ELECTRIC POWER CONVERSION UNIT AND METHOD FOR...
- Publication number 20250149405
- Publication date May 8, 2025
- ROHM CO., LTD.
- Kazunori FUJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR ADAPTIVE GATE DRIVER FOR INVERTER FOR ELECT...
- Publication number 20250133708
- Publication date Apr 24, 2025
- BorgWarner US Technologies LLC
- Seyed R. Zarabadi
- B60 - VEHICLES IN GENERAL
Information Patent Application
MULTILAYER HIGH ASPECT RATIO MICROCHANNEL DEVICE
- Publication number 20250123058
- Publication date Apr 17, 2025
- ThermAvant Technologies, LLC
- Lily Ellebracht
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
SYSTEMS AND METHODS FOR INTEGRATED GATE DRIVER FOR INVERTER FOR ELE...
- Publication number 20250126762
- Publication date Apr 17, 2025
- BorgWarner US Technologies LLC
- Mark Wendell Gose
- B60 - VEHICLES IN GENERAL
Information Patent Application
METHOD FOR ATTACHING A HEAT SPREADER TO A SEMICONDUCTOR PACKAGE AND...
- Publication number 20250125158
- Publication date Apr 17, 2025
- STATS ChipPAC Pte Ltd.
- YongHyuk JEONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT BONDED COPPER SUBSTRATES FABRICATED USING SILVER SINTERING
- Publication number 20250118622
- Publication date Apr 10, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Erik Nino Mercado TOLENTINO
- B22 - CASTING POWDER METALLURGY
Information Patent Application
SEMICONDUCTOR ASSEMBLY COMPRISING A FIRST SEMICONDUCTOR ELEMENT AND...
- Publication number 20250112118
- Publication date Apr 3, 2025
- SIEMENS AKTIENGESELLSCHAFT
- VLADIMIR DANOV
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT SINK, SLUG, OR SPREADER AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250112107
- Publication date Apr 3, 2025
- STMicroelectronics International N.V.
- Roseanne DUCA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT PANEL LEVEL PACKAGING STRUCTURE AND MANUFACTURING METHOD
- Publication number 20250112111
- Publication date Apr 3, 2025
- Zhuhai ACCESS Semiconductor Co., Ltd
- XIANMING CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH LAYER TRANSFER
- Publication number 20250105005
- Publication date Mar 27, 2025
- Silanna UV Technologies Pte Ltd
- Petar Atanackovic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR NON-OVERLAP ENFORCEMENT FOR INVERTER FOR EL...
- Publication number 20250089224
- Publication date Mar 13, 2025
- BorgWarner US Technologies LLC
- Jack Lavern Glenn
- B60 - VEHICLES IN GENERAL
Information Patent Application
ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES
- Publication number 20250087549
- Publication date Mar 13, 2025
- Amkor Technology Singapore Holding Pte. Ltd.
- Yu Jin JEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250087601
- Publication date Mar 13, 2025
- Siliconware Precision Industries Co., Ltd.
- Chao-Chiang Pu
- H01 - BASIC ELECTRIC ELEMENTS

Assembly of heatsink parts

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Systems and methods for power module for inverter for electric vehicle

Embedded cooling systems for advanced device packaging and methods...

Package structure and manufacturing method thereof

Apparatus including direct-contact heat paths and methods of manufa...

Semiconductor package with ball grid array connection having improv...

IC package with heat spreader

Systems and methods for power module for inverter for electric vehicle

Chip cooling package with multiple fluid paths

Systems and methods for multiple output integrated gate driver for...

Electronic package and manufacturing method thereof

Systems and methods for galvanic isolation for inverter for electri...

Systems and methods for data recorder for inverter for electric veh...

Encapsulation structure and encapsulation method of power module

Systems and methods for an interlocking feature on a power module

Electrochemical additive manufacturing system having conductive see...

Semiconductor device having a heat dissipation structure connected...

Solid metal foam thermal interface material

Electronic circuit comprising a RF switches having reduced parasiti...

Systems and methods for cooling system and power module for inverte...

Integrated cooling assemblies for advanced device packaging and met...

Systems and methods for parameter drift correction for inverter for...

Semiconductor package

Power semiconductor module with injection-molded or laminated coole...

Structures and methods for integrated cold plate in XPUs and memory

Systems and methods for cooling system and power module for inverte...

Composite substrate and method of producing the composite substrate...

Micro heat transfer arrays, micro cold plates, and thermal manageme...

Manufacturing method of integrated substrate structure

Electronic packages with integral heat spreaders

Semiconductor device and method of fabricating the same

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE HAVING A HEAT DISSIPATION STRUCTURE CONNECTED...

METHOD FOR PRODUCING A COOLING DEVICE

INTEGRATED COOLING ASSEMBLIES FOR ADVANCED DEVICE PACKAGING AND MET...

SYSTEMS AND METHODS FOR COOLING SYSTEM AND POWER MODULE FOR INVERTE...

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD FOR THE SAME

ELECTRONIC CIRCUIT COMPRISING A RF SWITCHES HAVING REDUCED PARASITI...

EMBEDDED COOLING SYSTEMS FOR ADVANCED DEVICE PACKAGING AND METHODS...

INTEGRATED CIRCUIT DEVICE INCLUDING THERMAL INTERPOSER LAYER

INTELLIGENT POWER MODULE

SEMI-CONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE INCLUDING HEAT RADIATION STRUCTURE, COOLING S...

METHOD FOR MANUFACTURING SUBSTRATE COOLING MECHANISM AND SUBSTRATE...

SYSTEM AND METHODS FOR ON-CHIP HEAT ROUTING ARCHITECTURES

CERAMIC SUBSTRATE UNIT AND MANUFACTURING METHOD THEREFOR

MEMORY MODULE AND METHOD OF MANUFACTURING THE MEMORY MODULE

ELECTRONIC COMPONENT-INCORPORATING SUBSTRATE

IMMERSION DIRECT COOLING MODULES AND RELATED METHODS

SEMICONDUCTOR DEVICE, ELECTRIC POWER CONVERSION UNIT AND METHOD FOR...

SYSTEMS AND METHODS FOR ADAPTIVE GATE DRIVER FOR INVERTER FOR ELECT...

MULTILAYER HIGH ASPECT RATIO MICROCHANNEL DEVICE

SYSTEMS AND METHODS FOR INTEGRATED GATE DRIVER FOR INVERTER FOR ELE...

METHOD FOR ATTACHING A HEAT SPREADER TO A SEMICONDUCTOR PACKAGE AND...

DIRECT BONDED COPPER SUBSTRATES FABRICATED USING SILVER SINTERING

SEMICONDUCTOR ASSEMBLY COMPRISING A FIRST SEMICONDUCTOR ELEMENT AND...

HEAT SINK, SLUG, OR SPREADER AND METHOD OF MANUFACTURING THE SAME

FAN-OUT PANEL LEVEL PACKAGING STRUCTURE AND MANUFACTURING METHOD

SEMICONDUCTOR DEVICE WITH LAYER TRANSFER

SYSTEMS AND METHODS FOR NON-OVERLAP ENFORCEMENT FOR INVERTER FOR EL...

ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF