Assembly of heatsink parts

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H01L21/4882

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/4882Assembly of heatsink parts

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Electronic packages with integral heat spreaders
- Patent number 12,243,799
- Issue date Mar 4, 2025
- NAVITAS SEMICONDUCTOR LIMITED
- Charles Bailley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of fabricating the same
- Patent number 12,243,798
- Issue date Mar 4, 2025
- Samsung Electronics Co., Ltd.
- Jae-Min Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Immersion direct cooling modules
- Patent number 12,230,551
- Issue date Feb 18, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Oseob Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for low inductance phase switch for inverter fo...
- Patent number 12,225,696
- Issue date Feb 11, 2025
- BorgWarner US Technologies LLC
- Mark Wendell Gose
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Systems and methods for adaptive gate driver for inverter for elect...
- Patent number 12,220,992
- Issue date Feb 11, 2025
- BorgWarner US Technologies LLC
- Seyed R. Zarabadi
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Systems and methods for integrated gate driver for inverter for ele...
- Patent number 12,214,677
- Issue date Feb 4, 2025
- BorgWarner US Technologies LLC
- Mark Wendell Gose
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Manufacturing method of semiconductor package using jig
- Patent number 12,211,818
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-cooling semiconductor resistor and manufacturing method thereof
- Patent number 12,205,863
- Issue date Jan 21, 2025
- MONTAGE TECHNOLOGY CO., LTD.
- Xiong Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded body, power module substrate, power module, method for manuf...
- Patent number 12,199,006
- Issue date Jan 14, 2025
- Mitsubishi Materials Corporation
- Nobuyuki Terasaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic package and manufacturing method thereof
- Patent number 12,199,047
- Issue date Jan 14, 2025
- Siliconware Precision Industries Co., Ltd.
- Chao-Chiang Pu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for non-overlap enforcement for inverter for el...
- Patent number 12,194,870
- Issue date Jan 14, 2025
- Borg Warner US Technologies LLC
- Jack Lavern Glenn
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Electronic packages with integral heat spreaders
- Patent number 12,199,004
- Issue date Jan 14, 2025
- NAVITAS SEMICONDUCTOR LIMITED
- Charles Bailley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Modular microchannel thermal solutions for integrated circuit devices
- Patent number 12,199,012
- Issue date Jan 14, 2025
- Intel Corporation
- Adel Elsherbini
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Integrated cooling assemblies for advanced device packaging and met...
- Patent number 12,191,234
- Issue date Jan 7, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Gaius Gillman Fountain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for single channel fault encoding for inverter...
- Patent number 12,179,610
- Issue date Dec 31, 2024
- Borg Warner US Technologies LLC
- Marc R. Engelhardt
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Thermally conductive sheet and method of manufacturing semiconducto...
- Patent number 12,183,656
- Issue date Dec 31, 2024
- Resonac Corporation
- Mika Kobune
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module, method for manufacturing same, and semiconduc...
- Patent number 12,183,713
- Issue date Dec 31, 2024
- ULTRAMEMORY, INC.
- Fumitake Okutsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating package structure
- Patent number 12,176,261
- Issue date Dec 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct bonded copper substrates fabricated using silver sintering
- Patent number 12,170,239
- Issue date Dec 17, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Erik Nino Mercado Tolentino
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 12,170,237
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for phase switch timing controller for inverter...
- Patent number 12,162,366
- Issue date Dec 10, 2024
- BorgWarner US Technologies LLC
- Jack Lavern Glenn
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Info packages including thermal dissipation blocks
- Patent number 12,159,791
- Issue date Dec 3, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ching-Yi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor arrangement and method of forming
- Patent number 12,154,838
- Issue date Nov 26, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
- Chih-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module, method for manufacturing semiconductor module...
- Patent number 12,148,631
- Issue date Nov 19, 2024
- Fuji Electric Co., Ltd.
- Kazunaga Onishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat dissipation device assembly
- Patent number 12,146,714
- Issue date Nov 19, 2024
- Asia Vital Components Co., Ltd.
- Sheng-Huang Lin
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Package structure and method for manufacturing the same
- Patent number 12,136,579
- Issue date Nov 5, 2024
- Advanced Semiconductor Engineering, Inc.
- Hsu-Nan Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing semiconductor pac...
- Patent number 12,131,974
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chin-Fu Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cooling system and methods
- Patent number 12,133,365
- Issue date Oct 29, 2024
- Shuaib Badat
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method of forming hybrid TIM layers
- Patent number 12,125,764
- Issue date Oct 22, 2024
- STATS ChipPAC Pte. Ltd.
- TaeKeun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for bidirectional message architecture for inve...
- Patent number 12,122,251
- Issue date Oct 22, 2024
- BorgWarner US Technologies LLC
- Jack Lavern Glenn
- B60 - VEHICLES IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE FOR INTEGRATED CIRCUIT WITH HEAT DISSIPATION
- Publication number 20250079259
- Publication date Mar 6, 2025
- STMicroelectronics International N.V.
- Jerome LOPEZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES WITH THERMAL DISSIPATION
- Publication number 20250079261
- Publication date Mar 6, 2025
- UTAC Headquarters Pte. Ltd.
- IL Kwon SHIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CERAMIC SUBSTRATE UNIT AND MANUFACTURING METHOD THEREFOR
- Publication number 20250069983
- Publication date Feb 27, 2025
- AMOSENSE CO., LTD.
- Jihyung LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COOLER UNIT, SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING A CO...
- Publication number 20250069988
- Publication date Feb 27, 2025
- Hitachi Energy Ltd
- Fabian FISCHER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20250069980
- Publication date Feb 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20250062174
- Publication date Feb 20, 2025
- Advanced Semiconductor Engineering, Inc.
- Hsu-Nan FANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INFO PACKAGES INCLUDING THERMAL DISSIPATION BLOCKS
- Publication number 20250054775
- Publication date Feb 13, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ching-Yi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR PHASE SWITCH TIMING CONTROLLER FOR INVERTER...
- Publication number 20250056773
- Publication date Feb 13, 2025
- BorgWarner US Technologies LLC
- Jack Lavern Glenn
- B60 - VEHICLES IN GENERAL
Information Patent Application
MANUFACTURING METHOD OF HEAT DISSIPATION DEVICE-INTEGRATED HEAT DIS...
- Publication number 20250046675
- Publication date Feb 6, 2025
- Jong Eun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGING, MANUFACTURING METHOD FOR ELECTRONIC PACKAGING...
- Publication number 20250038091
- Publication date Jan 30, 2025
- CHENGDU HAIGUANG INTEGRATED CIRCUIT DESIGN CO., LTD.
- Shuan Du
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Customized heat dissipation from different types of integrated circ...
- Publication number 20250029888
- Publication date Jan 23, 2025
- Marvell Asia Pte Ltd.
- Carl E. Benes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARRYING SUBSTRATE, ELECTRONIC PACKAGE HAVING THE CARRYING SUBSTRAT...
- Publication number 20250015054
- Publication date Jan 9, 2025
- Siliconware Precision Industries Co., Ltd.
- Chi-Ching Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BOND SHEET AND COOLED SEMICONDUCTOR POWER MODULE
- Publication number 20250014964
- Publication date Jan 9, 2025
- Huawei Digital Power Technologies Co., Ltd.
- Andreas MUNDING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PASSIVE COOLING HEAT SPREADER WITH PHASE CHANGE MATERIAL INFUSED MESH
- Publication number 20250006588
- Publication date Jan 2, 2025
- Intel Corporation
- Jiun Hann SIR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Module and Method for Assembling a Power Module
- Publication number 20240429121
- Publication date Dec 26, 2024
- ZF Friedrichshafen AG
- Wei Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC MODULE COMPRISING AT LEAST ONE POWER SEMICONDUCTOR, AND...
- Publication number 20240429124
- Publication date Dec 26, 2024
- ROBERT BOSCH GmbH
- Arne Stephen Fischer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS, APPARATUSES, AND METHODS FOR NANOWIRES FOR SEMICONDCUTOR P...
- Publication number 20240413043
- Publication date Dec 12, 2024
- STMicroelectronics International N.V.
- Romain COFFY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR INTEGRATED GATE DRIVER FOR INVERTER FOR ELE...
- Publication number 20240399895
- Publication date Dec 5, 2024
- DELPHI TECHNOLOGIES IP LIMITED
- Mark Wendell Gose
- B60 - VEHICLES IN GENERAL
Information Patent Application
POWER MODULE HAVING SEMICONDUCTOR COMPONENTS AND INCORPORATING A TE...
- Publication number 20240395651
- Publication date Nov 28, 2024
- SAFRAN
- Rabih KHAZAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT DISSIPATION MEMBER, METHOD OF MANUFACTURING THE HEAT DISSIPATI...
- Publication number 20240395653
- Publication date Nov 28, 2024
- DENSO CORPORATION
- MASAKI AOSHIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT DISSIPATION SOLUTIONS FOR INTEGRATED CIRCUIT PACKAGES
- Publication number 20240395655
- Publication date Nov 28, 2024
- Intel Corporation
- Avi Tsarfati
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE WITH RING DAM
- Publication number 20240387195
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Sheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ARRANGEMENT AND METHOD OF FORMING
- Publication number 20240387316
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Chih-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES WITH THERMAL LID AND METHODS OF FORMING THE...
- Publication number 20240387317
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Po-Chen Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED COOLING ASSEMBLIES FOR ADVANCED DEVICE PACKAGING AND MET...
- Publication number 20240387322
- Publication date Nov 21, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Gaius Gillman Fountain Jr.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
JIG FOR MANUFACTURING SEMICONDUCTOR PACKAGE
- Publication number 20240387446
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CORELESS SUBSTRATES AND MANUFACUTRING METHODS THEREOF
- Publication number 20240379514
- Publication date Nov 14, 2024
- Avago Technologies International Sales Pte. Limited
- Kwok Cheung Tsang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240379609
- Publication date Nov 14, 2024
- Siliconware Precision Industries Co., Ltd.
- Wei-Shen HUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240379488
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chin-Hua WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE
- Publication number 20240379491
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chin-Fu Kao
- H01 - BASIC ELECTRIC ELEMENTS

Assembly of heatsink parts

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Electronic packages with integral heat spreaders

Semiconductor device and method of fabricating the same

Immersion direct cooling modules

Systems and methods for low inductance phase switch for inverter fo...

Systems and methods for adaptive gate driver for inverter for elect...

Systems and methods for integrated gate driver for inverter for ele...

Manufacturing method of semiconductor package using jig

Self-cooling semiconductor resistor and manufacturing method thereof

Bonded body, power module substrate, power module, method for manuf...

Electronic package and manufacturing method thereof

Systems and methods for non-overlap enforcement for inverter for el...

Electronic packages with integral heat spreaders

Modular microchannel thermal solutions for integrated circuit devices

Integrated cooling assemblies for advanced device packaging and met...

Systems and methods for single channel fault encoding for inverter...

Thermally conductive sheet and method of manufacturing semiconducto...

Semiconductor module, method for manufacturing same, and semiconduc...

Method of fabricating package structure

Direct bonded copper substrates fabricated using silver sintering

Semiconductor structure and manufacturing method thereof

Systems and methods for phase switch timing controller for inverter...

Info packages including thermal dissipation blocks

Semiconductor arrangement and method of forming

Semiconductor module, method for manufacturing semiconductor module...

Heat dissipation device assembly

Package structure and method for manufacturing the same

Semiconductor package and method of manufacturing semiconductor pac...

Cooling system and methods

Semiconductor device and method of forming hybrid TIM layers

Systems and methods for bidirectional message architecture for inve...

Patents Applicationslast 30 patents

PACKAGE FOR INTEGRATED CIRCUIT WITH HEAT DISSIPATION

SEMICONDUCTOR PACKAGES WITH THERMAL DISSIPATION

CERAMIC SUBSTRATE UNIT AND MANUFACTURING METHOD THEREFOR

COOLER UNIT, SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING A CO...

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

INFO PACKAGES INCLUDING THERMAL DISSIPATION BLOCKS

SYSTEMS AND METHODS FOR PHASE SWITCH TIMING CONTROLLER FOR INVERTER...

MANUFACTURING METHOD OF HEAT DISSIPATION DEVICE-INTEGRATED HEAT DIS...

ELECTRONIC PACKAGING, MANUFACTURING METHOD FOR ELECTRONIC PACKAGING...

Customized heat dissipation from different types of integrated circ...

CARRYING SUBSTRATE, ELECTRONIC PACKAGE HAVING THE CARRYING SUBSTRAT...

HYBRID BOND SHEET AND COOLED SEMICONDUCTOR POWER MODULE

PASSIVE COOLING HEAT SPREADER WITH PHASE CHANGE MATERIAL INFUSED MESH

Power Module and Method for Assembling a Power Module

ELECTRONIC MODULE COMPRISING AT LEAST ONE POWER SEMICONDUCTOR, AND...

SYSTEMS, APPARATUSES, AND METHODS FOR NANOWIRES FOR SEMICONDCUTOR P...

SYSTEMS AND METHODS FOR INTEGRATED GATE DRIVER FOR INVERTER FOR ELE...

POWER MODULE HAVING SEMICONDUCTOR COMPONENTS AND INCORPORATING A TE...

HEAT DISSIPATION MEMBER, METHOD OF MANUFACTURING THE HEAT DISSIPATI...

HEAT DISSIPATION SOLUTIONS FOR INTEGRATED CIRCUIT PACKAGES

CHIP PACKAGE STRUCTURE WITH RING DAM

SEMICONDUCTOR ARRANGEMENT AND METHOD OF FORMING

SEMICONDUCTOR PACKAGES WITH THERMAL LID AND METHODS OF FORMING THE...

INTEGRATED COOLING ASSEMBLIES FOR ADVANCED DEVICE PACKAGING AND MET...

JIG FOR MANUFACTURING SEMICONDUCTOR PACKAGE

CORELESS SUBSTRATES AND MANUFACUTRING METHODS THEREOF

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE

METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE