Assembly of heatsink parts

Industry

CPC
H01L21/4882

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/4882Assembly of heatsink parts

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device having a heat dissipation structure connected...
- Patent number 12,300,618
- Issue date May 13, 2025
- Taiwna Semiconductor Manufacturing Company, Ltd.
- Po-Yuan Teng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid metal foam thermal interface material
- Patent number 12,300,567
- Issue date May 13, 2025
- Indium Corporation
- Ross B. Berntson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic circuit comprising a RF switches having reduced parasiti...
- Patent number 12,293,981
- Issue date May 6, 2025
- STMicroelectronics (Crolles 2) SAS
- Stephane Monfray
- G11 - INFORMATION STORAGE
Information Patent Grant
Systems and methods for cooling system and power module for inverte...
- Patent number 12,284,791
- Issue date Apr 22, 2025
- BorgWarner US Technologies LLC
- Bryan Rohl
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Integrated cooling assemblies for advanced device packaging and met...
- Patent number 12,283,490
- Issue date Apr 22, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Gaius Gillman Fountain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for parameter drift correction for inverter for...
- Patent number 12,279,402
- Issue date Apr 15, 2025
- BorgWarner US Technologies LLC
- Seyed R. Zarabadi
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Semiconductor package
- Patent number 12,278,156
- Issue date Apr 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chin-Hua Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor module with injection-molded or laminated coole...
- Patent number 12,278,163
- Issue date Apr 15, 2025
- HITACHI ENERGY LTD
- Niko Pavlicek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures and methods for integrated cold plate in XPUs and memory
- Patent number 12,266,545
- Issue date Apr 1, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Laura Mirkarimi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for cooling system and power module for inverte...
- Patent number 12,261,558
- Issue date Mar 25, 2025
- BorgWarner US Technologies LLC
- Bryan Rohl
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Composite substrate and method of producing the composite substrate...
- Patent number 12,261,090
- Issue date Mar 25, 2025
- Nichia Corporation
- Masatsugu Ichikawa
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Micro heat transfer arrays, micro cold plates, and thermal manageme...
- Patent number 12,255,123
- Issue date Mar 18, 2025
- Microfabrica Inc.
- Onnik Yaglioglu
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Manufacturing method of integrated substrate structure
- Patent number 12,249,567
- Issue date Mar 11, 2025
- Dyi-Chung Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic packages with integral heat spreaders
- Patent number 12,243,799
- Issue date Mar 4, 2025
- NAVITAS SEMICONDUCTOR LIMITED
- Charles Bailley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of fabricating the same
- Patent number 12,243,798
- Issue date Mar 4, 2025
- Samsung Electronics Co., Ltd.
- Jae-Min Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Immersion direct cooling modules
- Patent number 12,230,551
- Issue date Feb 18, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Oseob Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for low inductance phase switch for inverter fo...
- Patent number 12,225,696
- Issue date Feb 11, 2025
- BorgWarner US Technologies LLC
- Mark Wendell Gose
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Systems and methods for adaptive gate driver for inverter for elect...
- Patent number 12,220,992
- Issue date Feb 11, 2025
- BorgWarner US Technologies LLC
- Seyed R. Zarabadi
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Systems and methods for integrated gate driver for inverter for ele...
- Patent number 12,214,677
- Issue date Feb 4, 2025
- BorgWarner US Technologies LLC
- Mark Wendell Gose
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Manufacturing method of semiconductor package using jig
- Patent number 12,211,818
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-cooling semiconductor resistor and manufacturing method thereof
- Patent number 12,205,863
- Issue date Jan 21, 2025
- MONTAGE TECHNOLOGY CO., LTD.
- Xiong Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded body, power module substrate, power module, method for manuf...
- Patent number 12,199,006
- Issue date Jan 14, 2025
- Mitsubishi Materials Corporation
- Nobuyuki Terasaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic package and manufacturing method thereof
- Patent number 12,199,047
- Issue date Jan 14, 2025
- Siliconware Precision Industries Co., Ltd.
- Chao-Chiang Pu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for non-overlap enforcement for inverter for el...
- Patent number 12,194,870
- Issue date Jan 14, 2025
- Borg Warner US Technologies LLC
- Jack Lavern Glenn
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Electronic packages with integral heat spreaders
- Patent number 12,199,004
- Issue date Jan 14, 2025
- NAVITAS SEMICONDUCTOR LIMITED
- Charles Bailley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Modular microchannel thermal solutions for integrated circuit devices
- Patent number 12,199,012
- Issue date Jan 14, 2025
- Intel Corporation
- Adel Elsherbini
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Integrated cooling assemblies for advanced device packaging and met...
- Patent number 12,191,234
- Issue date Jan 7, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Gaius Gillman Fountain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for single channel fault encoding for inverter...
- Patent number 12,179,610
- Issue date Dec 31, 2024
- Borg Warner US Technologies LLC
- Marc R. Engelhardt
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Thermally conductive sheet and method of manufacturing semiconducto...
- Patent number 12,183,656
- Issue date Dec 31, 2024
- Resonac Corporation
- Mika Kobune
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module, method for manufacturing same, and semiconduc...
- Patent number 12,183,713
- Issue date Dec 31, 2024
- ULTRAMEMORY, INC.
- Fumitake Okutsu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC COMPONENT-INCORPORATING SUBSTRATE
- Publication number 20250149404
- Publication date May 8, 2025
- Shinko Electric Industries Co., Ltd.
- Shinichiro Sekijima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMMERSION DIRECT COOLING MODULES AND RELATED METHODS
- Publication number 20250149406
- Publication date May 8, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Oseob JEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, ELECTRIC POWER CONVERSION UNIT AND METHOD FOR...
- Publication number 20250149405
- Publication date May 8, 2025
- ROHM CO., LTD.
- Kazunori FUJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR ADAPTIVE GATE DRIVER FOR INVERTER FOR ELECT...
- Publication number 20250133708
- Publication date Apr 24, 2025
- BorgWarner US Technologies LLC
- Seyed R. Zarabadi
- B60 - VEHICLES IN GENERAL
Information Patent Application
SYSTEMS AND METHODS FOR INTEGRATED GATE DRIVER FOR INVERTER FOR ELE...
- Publication number 20250126762
- Publication date Apr 17, 2025
- BorgWarner US Technologies LLC
- Mark Wendell Gose
- B60 - VEHICLES IN GENERAL
Information Patent Application
MULTILAYER HIGH ASPECT RATIO MICROCHANNEL DEVICE
- Publication number 20250123058
- Publication date Apr 17, 2025
- ThermAvant Technologies, LLC
- Lily Ellebracht
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
METHOD FOR ATTACHING A HEAT SPREADER TO A SEMICONDUCTOR PACKAGE AND...
- Publication number 20250125158
- Publication date Apr 17, 2025
- STATS ChipPAC Pte Ltd.
- YongHyuk JEONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT BONDED COPPER SUBSTRATES FABRICATED USING SILVER SINTERING
- Publication number 20250118622
- Publication date Apr 10, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Erik Nino Mercado TOLENTINO
- B22 - CASTING POWDER METALLURGY
Information Patent Application
SEMICONDUCTOR ASSEMBLY COMPRISING A FIRST SEMICONDUCTOR ELEMENT AND...
- Publication number 20250112118
- Publication date Apr 3, 2025
- SIEMENS AKTIENGESELLSCHAFT
- VLADIMIR DANOV
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT PANEL LEVEL PACKAGING STRUCTURE AND MANUFACTURING METHOD
- Publication number 20250112111
- Publication date Apr 3, 2025
- Zhuhai ACCESS Semiconductor Co., Ltd
- XIANMING CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT SINK, SLUG, OR SPREADER AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250112107
- Publication date Apr 3, 2025
- STMicroelectronics International N.V.
- Roseanne DUCA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH LAYER TRANSFER
- Publication number 20250105005
- Publication date Mar 27, 2025
- Silanna UV Technologies Pte Ltd
- Petar Atanackovic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR NON-OVERLAP ENFORCEMENT FOR INVERTER FOR EL...
- Publication number 20250089224
- Publication date Mar 13, 2025
- BorgWarner US Technologies LLC
- Jack Lavern Glenn
- B60 - VEHICLES IN GENERAL
Information Patent Application
ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES
- Publication number 20250087549
- Publication date Mar 13, 2025
- Amkor Technology Singapore Holding Pte. Ltd.
- Yu Jin JEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250087601
- Publication date Mar 13, 2025
- Siliconware Precision Industries Co., Ltd.
- Chao-Chiang Pu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE FOR INTEGRATED CIRCUIT WITH HEAT DISSIPATION
- Publication number 20250079259
- Publication date Mar 6, 2025
- STMicroelectronics International N.V.
- Jerome LOPEZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES WITH THERMAL DISSIPATION
- Publication number 20250079261
- Publication date Mar 6, 2025
- UTAC Headquarters Pte. Ltd.
- IL Kwon SHIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CERAMIC SUBSTRATE UNIT AND MANUFACTURING METHOD THEREFOR
- Publication number 20250069983
- Publication date Feb 27, 2025
- AMOSENSE CO., LTD.
- Jihyung LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COOLER UNIT, SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING A CO...
- Publication number 20250069988
- Publication date Feb 27, 2025
- Hitachi Energy Ltd
- Fabian FISCHER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20250069980
- Publication date Feb 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20250062174
- Publication date Feb 20, 2025
- Advanced Semiconductor Engineering, Inc.
- Hsu-Nan FANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INFO PACKAGES INCLUDING THERMAL DISSIPATION BLOCKS
- Publication number 20250054775
- Publication date Feb 13, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ching-Yi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR PHASE SWITCH TIMING CONTROLLER FOR INVERTER...
- Publication number 20250056773
- Publication date Feb 13, 2025
- BorgWarner US Technologies LLC
- Jack Lavern Glenn
- B60 - VEHICLES IN GENERAL
Information Patent Application
MANUFACTURING METHOD OF HEAT DISSIPATION DEVICE-INTEGRATED HEAT DIS...
- Publication number 20250046675
- Publication date Feb 6, 2025
- Jong Eun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGING, MANUFACTURING METHOD FOR ELECTRONIC PACKAGING...
- Publication number 20250038091
- Publication date Jan 30, 2025
- CHENGDU HAIGUANG INTEGRATED CIRCUIT DESIGN CO., LTD.
- Shuan Du
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Customized heat dissipation from different types of integrated circ...
- Publication number 20250029888
- Publication date Jan 23, 2025
- Marvell Asia Pte Ltd.
- Carl E. Benes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARRYING SUBSTRATE, ELECTRONIC PACKAGE HAVING THE CARRYING SUBSTRAT...
- Publication number 20250015054
- Publication date Jan 9, 2025
- Siliconware Precision Industries Co., Ltd.
- Chi-Ching Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BOND SHEET AND COOLED SEMICONDUCTOR POWER MODULE
- Publication number 20250014964
- Publication date Jan 9, 2025
- Huawei Digital Power Technologies Co., Ltd.
- Andreas MUNDING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PASSIVE COOLING HEAT SPREADER WITH PHASE CHANGE MATERIAL INFUSED MESH
- Publication number 20250006588
- Publication date Jan 2, 2025
- Intel Corporation
- Jiun Hann SIR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Module and Method for Assembling a Power Module
- Publication number 20240429121
- Publication date Dec 26, 2024
- ZF Friedrichshafen AG
- Wei Liu
- H01 - BASIC ELECTRIC ELEMENTS

Assembly of heatsink parts

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device having a heat dissipation structure connected...

Solid metal foam thermal interface material

Electronic circuit comprising a RF switches having reduced parasiti...

Systems and methods for cooling system and power module for inverte...

Integrated cooling assemblies for advanced device packaging and met...

Systems and methods for parameter drift correction for inverter for...

Semiconductor package

Power semiconductor module with injection-molded or laminated coole...

Structures and methods for integrated cold plate in XPUs and memory

Systems and methods for cooling system and power module for inverte...

Composite substrate and method of producing the composite substrate...

Micro heat transfer arrays, micro cold plates, and thermal manageme...

Manufacturing method of integrated substrate structure

Electronic packages with integral heat spreaders

Semiconductor device and method of fabricating the same

Immersion direct cooling modules

Systems and methods for low inductance phase switch for inverter fo...

Systems and methods for adaptive gate driver for inverter for elect...

Systems and methods for integrated gate driver for inverter for ele...

Manufacturing method of semiconductor package using jig

Self-cooling semiconductor resistor and manufacturing method thereof

Bonded body, power module substrate, power module, method for manuf...

Electronic package and manufacturing method thereof

Systems and methods for non-overlap enforcement for inverter for el...

Electronic packages with integral heat spreaders

Modular microchannel thermal solutions for integrated circuit devices

Integrated cooling assemblies for advanced device packaging and met...

Systems and methods for single channel fault encoding for inverter...

Thermally conductive sheet and method of manufacturing semiconducto...

Semiconductor module, method for manufacturing same, and semiconduc...

Patents Applicationslast 30 patents

ELECTRONIC COMPONENT-INCORPORATING SUBSTRATE

IMMERSION DIRECT COOLING MODULES AND RELATED METHODS

SEMICONDUCTOR DEVICE, ELECTRIC POWER CONVERSION UNIT AND METHOD FOR...

SYSTEMS AND METHODS FOR ADAPTIVE GATE DRIVER FOR INVERTER FOR ELECT...

SYSTEMS AND METHODS FOR INTEGRATED GATE DRIVER FOR INVERTER FOR ELE...

MULTILAYER HIGH ASPECT RATIO MICROCHANNEL DEVICE

METHOD FOR ATTACHING A HEAT SPREADER TO A SEMICONDUCTOR PACKAGE AND...

DIRECT BONDED COPPER SUBSTRATES FABRICATED USING SILVER SINTERING

SEMICONDUCTOR ASSEMBLY COMPRISING A FIRST SEMICONDUCTOR ELEMENT AND...

FAN-OUT PANEL LEVEL PACKAGING STRUCTURE AND MANUFACTURING METHOD

HEAT SINK, SLUG, OR SPREADER AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE WITH LAYER TRANSFER

SYSTEMS AND METHODS FOR NON-OVERLAP ENFORCEMENT FOR INVERTER FOR EL...

ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

PACKAGE FOR INTEGRATED CIRCUIT WITH HEAT DISSIPATION

SEMICONDUCTOR PACKAGES WITH THERMAL DISSIPATION

CERAMIC SUBSTRATE UNIT AND MANUFACTURING METHOD THEREFOR

COOLER UNIT, SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING A CO...

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

INFO PACKAGES INCLUDING THERMAL DISSIPATION BLOCKS

SYSTEMS AND METHODS FOR PHASE SWITCH TIMING CONTROLLER FOR INVERTER...

MANUFACTURING METHOD OF HEAT DISSIPATION DEVICE-INTEGRATED HEAT DIS...

ELECTRONIC PACKAGING, MANUFACTURING METHOD FOR ELECTRONIC PACKAGING...

Customized heat dissipation from different types of integrated circ...

CARRYING SUBSTRATE, ELECTRONIC PACKAGE HAVING THE CARRYING SUBSTRAT...

HYBRID BOND SHEET AND COOLED SEMICONDUCTOR POWER MODULE

PASSIVE COOLING HEAT SPREADER WITH PHASE CHANGE MATERIAL INFUSED MESH

Power Module and Method for Assembling a Power Module