Membership
Tour
Register
Log in
Assembly of heatsink parts
Follow
Industry
CPC
H01L21/4882
This industry / category may be too specific. Please go to a parent level for more data
Parent Industries
H
ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L21/00
Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Current Industry
H01L21/4882
Assembly of heatsink parts
Industries
Overview
Organizations
People
Information
Impact
Patents Grants
last 30 patents
Information
Patent Grant
Three dimensional IC package with thermal enhancement
Patent number
11,967,538
Issue date
Apr 23, 2024
Google LLC
Woon-Seong Kwon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Power semiconductor device
Patent number
11,967,584
Issue date
Apr 23, 2024
Hitachi Astemo, Ltd.
Hiromi Shimazu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor module, power conversion device, and manufacturing me...
Patent number
11,961,780
Issue date
Apr 16, 2024
Hitachi Astemo, Ltd.
Nobutake Tsuyuno
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device
Patent number
RE49912
Issue date
Apr 9, 2024
Rohm Co., Ltd.
Akihiro Kimura
Information
Patent Grant
Semiconductor package thermal spreader having integrated EF/EMI shi...
Patent number
11,935,809
Issue date
Mar 19, 2024
NXP USA, INC.
Zhiwei Gong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Chip warpage reduction via raised free bending and re-entrant (auxe...
Patent number
11,935,810
Issue date
Mar 19, 2024
Board of Trustees of the University of Arkansas
David Huitink
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Composite substrate and method of producing the composite substrate...
Patent number
11,929,294
Issue date
Mar 12, 2024
Nichia Corporation
Masatsugu Ichikawa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Carrying substrate, electronic package having the carrying substrat...
Patent number
11,923,337
Issue date
Mar 5, 2024
Siliconware Precision Industries Co., Ltd.
Chi-Ching Ho
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package with isolated heat spreader
Patent number
11,923,281
Issue date
Mar 5, 2024
Texas Instruments Incorporated
Anindya Poddar
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for manufacturing a power module unit
Patent number
11,915,990
Issue date
Feb 27, 2024
Siemens Aktiengesellschaft
Daniel Kappauf
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Thermal interface material having different thicknesses in packages
Patent number
11,916,023
Issue date
Feb 27, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Sung-Hui Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor structure and manufacturing method thereof
Patent number
11,908,835
Issue date
Feb 20, 2024
Taiwan Semiconductor Manufacturing Company Ltd.
Chi-Yang Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Cooling solution including microchannel arrays and methods of formi...
Patent number
11,901,262
Issue date
Feb 13, 2024
Intel Corporation
Nicholas Neal
F28 - HEAT EXCHANGE IN GENERAL
Information
Patent Grant
Semiconductor package, metal sheet for use in a semiconductor packa...
Patent number
11,901,257
Issue date
Feb 13, 2024
Infineon Technologies AG
Thomas Stoek
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device with integrated heat distribution and manufact...
Patent number
11,901,343
Issue date
Feb 13, 2024
Amkor Technology Singapore Holding Pte Ltd.
Bora Baloglu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electrochemical additive manufacturing method using deposition feed...
Patent number
11,881,412
Issue date
Jan 23, 2024
FABRIC8LABS, INC.
David Pain
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Grant
Semiconductor package
Patent number
11,876,083
Issue date
Jan 16, 2024
Samsung Electronics Co., Ltd.
Dongho Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Liquid-cooled chip
Patent number
11,876,035
Issue date
Jan 16, 2024
Commissariat a l'Energie Atomique et Aux Energies Alternatives
Gilles Simon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Clad material and method for producing same
Patent number
11,876,030
Issue date
Jan 16, 2024
Dowa Holdings Co., Ltd.
Tomotsugu Aoyama
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Method for forming semiconductor package
Patent number
11,862,528
Issue date
Jan 2, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Chin-Hua Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated substrate structure, electronic assembly, and manufactur...
Patent number
11,862,545
Issue date
Jan 2, 2024
Dyi-Chung Hu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor component, motor vehicle, and method for producing a...
Patent number
11,848,252
Issue date
Dec 19, 2023
Audi AG
Thomas Gradinger
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Thermal dissipation through seal rings in 3DIC structure
Patent number
11,848,247
Issue date
Dec 19, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Jing-Cheng Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor structure having a thermal shunt below a metallizatio...
Patent number
11,842,940
Issue date
Dec 12, 2023
GLOBALFOUNDRIES U.S. Inc.
Ramsey Hazbun
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
IC assemblies including die perimeter frames suitable for containin...
Patent number
11,842,944
Issue date
Dec 12, 2023
Intel Corporation
Kyle Arrington
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Non-planar conforming heatsink
Patent number
11,817,371
Issue date
Nov 14, 2023
Intel Corporation
Brian S. Jarrett
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device package having thermal dissipation feature and...
Patent number
11,817,366
Issue date
Nov 14, 2023
NXP USA, INC.
Michael B. Vincent
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Info packages including thermal dissipation blocks
Patent number
11,817,324
Issue date
Nov 14, 2023
Taiwan Semiconductor Manufacturing Co., Ltd
Ching-Yi Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Thermal mitigation die using back side etch
Patent number
11,817,365
Issue date
Nov 14, 2023
QUALCOMM Incorporated
Aniket Patil
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Heat sink configuration for multi-chip module
Patent number
11,810,832
Issue date
Nov 7, 2023
MARVELL ASIA PTE. LTD.
Janak Patel
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
Integrated Circuit Packages and Methods of Forming the Same
Publication number
20240128148
Publication date
Apr 18, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Chang-Jung Hsueh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
POWER SEMICONDUCTOR MODULE, POWER SEMICONDUCTOR DEVICE AND METHOD F...
Publication number
20240120255
Publication date
Apr 11, 2024
Hitachi Energy Switzerland AG
Dominik TRUESSEL
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MAKING THE SAME
Publication number
20240112981
Publication date
Apr 4, 2024
STATS ChipPAC Pte Ltd.
ChangOh KIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SYSTEMS AND METHODS FOR ACTIVE AND PASSIVE COOLING OF ELECTRICAL CO...
Publication number
20240105553
Publication date
Mar 28, 2024
DELPHI TECHNOLOGIES IP LIMITED
Kevin M. Gertiser
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
POWER MODULE AND METHOD OF MANUFACTURING SAME
Publication number
20240105542
Publication date
Mar 28, 2024
HYUNDAI MOBIS CO., LTD.
Jae Min HWANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE
Publication number
20240096731
Publication date
Mar 21, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Chin-Hua WANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Forming Graphene-Coated Core Emb...
Publication number
20240096736
Publication date
Mar 21, 2024
STATS ChipPAC Pte Ltd.
YongMoo Shin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
COOLING APPARATUS, SEMICONDUCTOR DEVICE INCLUDING THE APPARATUS, AN...
Publication number
20240096742
Publication date
Mar 21, 2024
KOOLMICRO INC.
Kyo Sung CHOO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DIE PACKAGE WITH SEALED DIE ENCLOSURES
Publication number
20240088081
Publication date
Mar 14, 2024
QUALCOMM Incorporated
Bart KASSTEEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MANUFACTURING METHOD OF INTEGRATED SUBSTRATE STRUCTURE
Publication number
20240079304
Publication date
Mar 7, 2024
Dyi-Chung Hu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE WITH BALL GRID ARRAY CONNECTION HAVING IMPROV...
Publication number
20240071974
Publication date
Feb 29, 2024
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
Yu-Sheng Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Power Semiconductor Device and Method of Manufacturing the Same, an...
Publication number
20240074122
Publication date
Feb 29, 2024
MITSUBISHI ELECTRIC CORPORATION
Yasuyuki SANDA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Package with Improved Heat Dissipation Efficiency and Method for Fo...
Publication number
20240063079
Publication date
Feb 22, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Tung-Liang Shao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES
Publication number
20240047301
Publication date
Feb 8, 2024
Amkor Technology Singapore Holding Pte. Ltd.
Sang Hyoun Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MULTILAYER THERMAL INTERFACE MATERIAL FOR INTEGRATED CIRCUITS
Publication number
20240038629
Publication date
Feb 1, 2024
GM Cruise Holdings LLC
Yafei Han
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR MODULE COMPRISING AT LEAST ONE SEMICONDUCTOR ELEMENT
Publication number
20240038630
Publication date
Feb 1, 2024
SIEMENS AKTIENGESELLSCHAFT
STEFAN PFEFFERLEIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THERMALLY ENHANCED EMBEDDED DIE PACKAGE
Publication number
20240038619
Publication date
Feb 1, 2024
TEXAS INSTRUMENTS INCORPORATED
Woochan Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
Publication number
20240030099
Publication date
Jan 25, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Chuei-Tang Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME
Publication number
20240021491
Publication date
Jan 18, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Chen-Hsuan Tsai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Forming Thin Heat Sink Using E-B...
Publication number
20240021490
Publication date
Jan 18, 2024
STATS ChipPAC Pte Ltd.
Jongtae Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Info Packages Including Thermal Dissipation Blocks
Publication number
20240021441
Publication date
Jan 18, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Ching-Yi Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE WITH LEAD-ON-CHIP INTERCONNECT AND METHOD THER...
Publication number
20240014123
Publication date
Jan 11, 2024
NXP B.V.
Kuan-Hsiang Mao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD
Publication number
20240014095
Publication date
Jan 11, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Ming-Fa Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE HAVING HEAT DISSIPA...
Publication number
20240014048
Publication date
Jan 11, 2024
NANYA TECHNOLOGY CORPORATION
Shing-Yih SHIH
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Hermetic Package Cooling Using Silver Tubes with Getter Absorption...
Publication number
20240006267
Publication date
Jan 4, 2024
TEXAS INSTRUMENTS INCORPORATED
Li Jiang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES
Publication number
20240006393
Publication date
Jan 4, 2024
Amkor Technology Singapore Holding Pte. Ltd.
Young Do KWEON
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME
Publication number
20240006268
Publication date
Jan 4, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Chen-Chiang Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DIRECT BONDED COPPER SUBSTRATES FABRICATED USING SILVER SINTERING
Publication number
20240006266
Publication date
Jan 4, 2024
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Erik Nino Mercado TOLENTINO
B22 - CASTING POWDER METALLURGY
Information
Patent Application
HIGH-MOBILITY-ELECTRON TRANSISTORS HAVING HEAT DISSIPATING STRUCTURES
Publication number
20230420326
Publication date
Dec 28, 2023
GLOBALFOUNDRIES U.S. Inc.
ZHONG-XIANG HE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
POWER SEMICONDUCTOR MODULE ARRANGEMENT AND METHOD FOR FORMING THE SAME
Publication number
20230420334
Publication date
Dec 28, 2023
Infineon Technologies Austria AG
Timo Bohnenberger
H01 - BASIC ELECTRIC ELEMENTS