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Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326
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ELECTRICITY
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Electric elements
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SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L21/00
Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Current Industry
H01L21/50
Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326
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Patents Grants
last 30 patents
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Patent Grant
Power module semiconductor device and inverter equipment, and fabri...
Patent number
11,973,007
Issue date
Apr 30, 2024
Rohm Co., Ltd.
Toshio Hanada
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Fluid cooled inverter
Patent number
11,967,899
Issue date
Apr 23, 2024
Marel Power Solutions
Jean-Claude Harel
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Power module semiconductor device and inverter equipment, and fabri...
Patent number
11,967,543
Issue date
Apr 23, 2024
Rohm Co., Ltd.
Toshio Hanada
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package structure and measurement method for the package structure
Patent number
11,965,731
Issue date
Apr 23, 2024
Taiwan Semiconductor Manufacturing Company Ltd.
Kuei-Sung Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of manufacturing semiconductor products, corresponding subst...
Patent number
11,967,544
Issue date
Apr 23, 2024
STMicroelectronics S.r.l.
Mauro Mazzola
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor assemblies with system and methods for aligning dies...
Patent number
11,955,461
Issue date
Apr 9, 2024
Micron Technology, Inc.
Shiro Uchiyama
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bonding method of package components and bonding apparatus
Patent number
11,955,378
Issue date
Apr 9, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Yi-Li Hsiao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package structure and method for manufacturing the same
Patent number
11,935,841
Issue date
Mar 19, 2024
Advanced Semiconductor Engineering, Inc.
Cheng-Yuan Kung
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stress relief for flip-chip packaged devices
Patent number
11,930,590
Issue date
Mar 12, 2024
Texas Instruments Incorporated
Tianyi Luo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Chemical bonding method, package-type electronic component, and hyb...
Patent number
11,916,038
Issue date
Feb 27, 2024
Canon Anelva Corporation
Takayuki Saitoh
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Multi-functional PCB for assembling GaN-based power converter and m...
Patent number
11,916,005
Issue date
Feb 27, 2024
INNOSCIENCE (SUZHOU) TECHNOLOGY CO., LTD.
Yanbo Zou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Contaminant control in thermocompression bonding of semiconductors...
Patent number
11,908,828
Issue date
Feb 20, 2024
Micron Technology, Inc.
Brandon P. Wirz
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Profiled thermode
Patent number
11,910,533
Issue date
Feb 20, 2024
Pragmatic Printing Ltd
Neil Davies
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Semiconductor devices and methods of manufacturing semiconductor de...
Patent number
11,908,755
Issue date
Feb 20, 2024
Amkor Technology Singapore Holding Pte Ltd.
Sang Jae Jang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Substrate chuck for self-assembling semiconductor light emitting di...
Patent number
11,901,208
Issue date
Feb 13, 2024
LG Electronics Inc.
Inbum Yang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Microelectronic arrangement and method for manufacturing the same
Patent number
11,901,285
Issue date
Feb 13, 2024
Fraunhofer-Gesellschaft zur Forderung der Angewandten Forschung E.V.
Christof Landesberger
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package structure and fabrication methods
Patent number
11,887,934
Issue date
Jan 30, 2024
Applied Materials, Inc.
Han-Wen Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Ceramic semiconductor package seal rings
Patent number
11,881,460
Issue date
Jan 23, 2024
Texas Instruments Incorporated
Yiqi Tang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package manufacturing method
Patent number
11,876,070
Issue date
Jan 16, 2024
Mitsui Mining & Smelting Co., Ltd.
Toshimi Nakamura
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Packaging high-frequency microwave circuits using hot via die attac...
Patent number
11,869,858
Issue date
Jan 9, 2024
Marki Microwave, Inc.
Christopher Ferenc Marki
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Front end of line interconnect structures and associated systems an...
Patent number
11,862,569
Issue date
Jan 2, 2024
Micron Technology, Inc.
Kyle K. Kirby
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor devices and methods of manufacturing semiconductor de...
Patent number
11,862,892
Issue date
Jan 2, 2024
Amkor Technology Singapore Holding Pte. Ltd.
Masaya Tazawa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Shutter disk
Patent number
11,862,480
Issue date
Jan 2, 2024
Applied Materials, Inc.
Kang Zhang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device package and a method of manufacturing the same
Patent number
11,862,525
Issue date
Jan 2, 2024
Advanced Semiconductor Engineering, Inc.
Tsung-Yu Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bonded semiconductor devices having processor and NAND flash memory...
Patent number
11,864,367
Issue date
Jan 2, 2024
Yangtze Memory Technologies Co., Ltd.
Weihua Cheng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package structure and method of fabricating the same
Patent number
11,855,060
Issue date
Dec 26, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Tsung-Fu Tsai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuitry, a method used in forming integrated circuitry...
Patent number
11,844,202
Issue date
Dec 12, 2023
Micron Technology, Inc.
Purnima Narayanan
G11 - INFORMATION STORAGE
Information
Patent Grant
Ball grid array package design
Patent number
11,837,522
Issue date
Dec 5, 2023
Dell Products L.P.
Qinghong He
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Creating interconnects between dies using a cross-over die and thro...
Patent number
11,830,817
Issue date
Nov 28, 2023
Advanced Micro Devices, Inc.
Rahul Agarwal
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Conductive barrier direct hybrid bonding
Patent number
11,830,838
Issue date
Nov 28, 2023
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Paul M. Enquist
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND A METHOD OF MANUFACTURING THE SAME
Publication number
20240145319
Publication date
May 2, 2024
Advanced Semiconductor Engineering, Inc.
Tsung-Yu LIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME
Publication number
20240136376
Publication date
Apr 25, 2024
TONG HSING ELECTRONIC INDUSTRIES, LTD.
DONG-RU WU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FRONT END OF LINE INTERCONNECT STRUCTURES AND ASSOCIATED SYSTEMS AN...
Publication number
20240136295
Publication date
Apr 25, 2024
Micron Technology, Inc.
Kyle K. Kirby
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Shutter Disk
Publication number
20240087913
Publication date
Mar 14, 2024
Applied Materials, Inc.
Kang Zhang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CREATING INTERCONNECTS BETWEEN DIES USING A CROSS-OVER DIE AND THRO...
Publication number
20240071940
Publication date
Feb 29, 2024
ADVANCED MICRO DEVICES, INC.
RAHUL AGARWAL
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME
Publication number
20240071776
Publication date
Feb 29, 2024
TONG HSING ELECTRONIC INDUSTRIES, LTD.
DEI-CHENG LIU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP PACKAGE WITH CORE EMBEDDED INTEGRATED DEVICES
Publication number
20240055359
Publication date
Feb 15, 2024
Xilinx, Inc.
Li-Sheng WENG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
POWER MODULE SEMICONDUCTOR DEVICE AND INVERTER EQUIPMENT, AND FABRI...
Publication number
20240047311
Publication date
Feb 8, 2024
ROHM CO., LTD.
Toshio HANADA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
Publication number
20240047425
Publication date
Feb 8, 2024
Samsung Electronics Co., Ltd.
Jun Yun Kweon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BALL GRID ARRAY PACKAGE DESIGN
Publication number
20240030091
Publication date
Jan 25, 2024
Dell Products L.P.
Qinghong He
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
RECONSTITUTED SUBSTRATE STRUCTURE AND FABRICATION METHODS FOR HETER...
Publication number
20240021533
Publication date
Jan 18, 2024
Applied Materials, Inc.
Han-Wen CHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
Publication number
20240014180
Publication date
Jan 11, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Chia-Kuei Hsu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THIN DIE RELEASE FOR SEMICONDUCTOR DEVICE ASSEMBLY
Publication number
20230420300
Publication date
Dec 28, 2023
Micron Technology, Inc.
Andrew M. Bayless
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HEAT SPREADER FOR USE WITH A SEMICONDUCTOR DEVICE
Publication number
20230402344
Publication date
Dec 14, 2023
STATS ChipPAC Pte Ltd.
SooHan PARK
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHODS OF MANUFACTURING STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH...
Publication number
20230395463
Publication date
Dec 7, 2023
Micron Technology, Inc.
Sameer S. Vadhavkar
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR MEMORY STACKS CONNECTED TO PROCESSING UNITS AND ASSOC...
Publication number
20230395516
Publication date
Dec 7, 2023
Micron Technology, Inc.
Kyle K. Kirby
G11 - INFORMATION STORAGE
Information
Patent Application
SYSTEMS AND METHODS FOR WAFER BOND MONITORING
Publication number
20230393081
Publication date
Dec 7, 2023
Taiwan Semiconductor Manufacturing Co., Ltd.
Chih-Yu WANG
G01 - MEASURING TESTING
Information
Patent Application
STACKED SEMICONDUCTOR DEVICE INCLUDING A COOLING STRUCTURE
Publication number
20230386957
Publication date
Nov 30, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Jen-Yuan CHANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE
Publication number
20230386862
Publication date
Nov 30, 2023
Taiwan Semiconductor Manufacturing Co., Ltd.
Wei-Yu Chen
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
CHIP PACKAGE STRUCTURE WITH ANCHOR STRUCTURE
Publication number
20230369250
Publication date
Nov 16, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Hui-Ting LIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICES WITH RECESSED PADS FOR DIE STACK INTERCONNECT...
Publication number
20230352413
Publication date
Nov 2, 2023
Micron Technology, Inc.
Ruei Ying Sheng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MANUFACTURING PROCESS STEPS OF A SEMICONDUCTOR DEVICE PACKAGE
Publication number
20230335505
Publication date
Oct 19, 2023
Advanced Semiconductor Engineering, Inc.
Ming-Hung CHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MANUFUCTURING METHOD OF PACKAGING STRUCTURE FOR BIPOLAR TRANSISTOR...
Publication number
20230307400
Publication date
Sep 28, 2023
Fuji Electric Co., Ltd.
Ryoichi KATO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
Publication number
20230307422
Publication date
Sep 28, 2023
KIOXIA Corporation
Takeori MAEDA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR CHECKING AND PRODUCING A COMPOSITE OF A SUBSTRATE STACK...
Publication number
20230274991
Publication date
Aug 31, 2023
SCHOTT AG
Jens Ulrich Thomas
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
UNDER-BUMP-METALLIZATION STRUCTURE AND REDISTRIBUTION LAYER DESIGN...
Publication number
20230253384
Publication date
Aug 10, 2023
Taiwan Semiconductor Manufacturing Co., Ltd.
Yu-Chih Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING THE SAME
Publication number
20230246094
Publication date
Aug 3, 2023
Murata Manufacturing Co., Ltd.
Masayuki AOIKE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Stabilizing Heat Spreader on Sem...
Publication number
20230230893
Publication date
Jul 20, 2023
STATS ChipPAC Pte Ltd.
SooJung Park
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device with Compartment Shield Formed from Metal Bars...
Publication number
20230230934
Publication date
Jul 20, 2023
STATS ChipPAC Pte Ltd.
YongKook Shin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SOLDER TRANSFER INTEGRATED CIRCUIT PACKAGING
Publication number
20230230947
Publication date
Jul 20, 2023
International Business Machines Corporation
Katsuyuki Sakuma
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR