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Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326
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ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L21/00
Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Current Industry
H01L21/50
Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326
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Patents Grants
last 30 patents
Information
Patent Grant
Flip-chip stacking structures and methods for forming the same
Patent number
12,166,012
Issue date
Dec 10, 2024
Yangtze Memory Technologies Co., Ltd.
Xinru Zeng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Lidded microelectronic device packages and related systems, apparat...
Patent number
12,159,811
Issue date
Dec 3, 2024
Micron Technology, Inc.
Xiaopeng Qu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and method of manufacturing the same
Patent number
12,154,888
Issue date
Nov 26, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Chia-Kuei Hsu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Shutter disk
Patent number
12,148,629
Issue date
Nov 19, 2024
Applied Materials, Inc.
Kang Zhang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multi-chip module leadless package
Patent number
12,142,550
Issue date
Nov 12, 2024
Texas Instruments Incorporated
Matthew David Romig
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method for producing the same
Patent number
12,136,664
Issue date
Nov 5, 2024
Murata Manufacturing Co., Ltd.
Masayuki Aoike
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and manufacturing method of semiconductor device
Patent number
12,125,794
Issue date
Oct 22, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Chih-Hang Tung
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Front end of line interconnect structures and associated systems an...
Patent number
12,107,050
Issue date
Oct 1, 2024
Micron Technology, Inc.
Kyle K. Kirby
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device with a semiconductor die embedded between an e...
Patent number
12,107,035
Issue date
Oct 1, 2024
Amkor Technology Singapore Holdings Pte. Ltd.
Jae Yun Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Power-forwarding bridge for inter-chip data signal transfer
Patent number
12,100,662
Issue date
Sep 24, 2024
Intel Corporation
Zhiguo Qian
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Systems and methods for wafer bond monitoring
Patent number
12,085,518
Issue date
Sep 10, 2024
Taiwan Semiconductor Manufacturing Co., Ltd
Chih-Yu Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor devices with recessed pads for die stack interconnect...
Patent number
12,087,697
Issue date
Sep 10, 2024
Micron Technology, Inc.
Ruei Ying Sheng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Seal ring structure with zigzag patterns and method forming same
Patent number
12,087,648
Issue date
Sep 10, 2024
Taiwan Semiconductor Manufacturing Co., Ltd
Kuan-Hung Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated structures with antenna elements and IC chips employing...
Patent number
12,080,661
Issue date
Sep 3, 2024
Viasat, Inc.
Steven J. Franson
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bonding method, bonding device, and holding member
Patent number
12,080,554
Issue date
Sep 3, 2024
Nikon Corporation
Hajime Mitsuishi
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method for fabricating electronic assembly including a magnetic fie...
Patent number
12,068,258
Issue date
Aug 20, 2024
3M Innovative Properties Company
Jiwoong Kong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method for manufacturing the same
Patent number
12,068,267
Issue date
Aug 20, 2024
Kioxia Corporation
Yoshihiro Uozumi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package structures
Patent number
12,068,218
Issue date
Aug 20, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Pu Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit (IC) structure protection scheme
Patent number
12,068,257
Issue date
Aug 20, 2024
Xilinx, Inc.
Myongseob Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Reconstituted substrate for radio frequency applications
Patent number
12,051,653
Issue date
Jul 30, 2024
Applied Materials, Inc.
Guan Huei See
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor memory stacks connected to processing units and assoc...
Patent number
12,046,559
Issue date
Jul 23, 2024
Micron Technology, Inc.
Kyle K. Kirby
G11 - INFORMATION STORAGE
Information
Patent Grant
Chip-scale package architectures containing a die back side metal a...
Patent number
12,040,246
Issue date
Jul 16, 2024
Intel Corporation
Susmriti Das Mahapatra
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package system and manufacturing method thereof
Patent number
12,040,247
Issue date
Jul 16, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Pei-Hsuan Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and manufacturing method thereof
Patent number
12,040,314
Issue date
Jul 16, 2024
Kioxia Corporation
Shinya Arai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Resonant inductive-capacitive isolated data channel
Patent number
12,033,936
Issue date
Jul 9, 2024
Texas Instruments Incorporated
Klaas De Haan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for interconnecting stacked semiconductor devices
Patent number
12,033,983
Issue date
Jul 9, 2024
Intel Corporation
Junfeng Zhao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package with stiffener ring having elevated opening
Patent number
12,033,960
Issue date
Jul 9, 2024
Amazon Technologies, Inc.
Bassam Abdel-Dayem
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Packaged module with sintered switch
Patent number
12,027,975
Issue date
Jul 2, 2024
Marel Power Solutions
Jean-Claude Harel
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Packaged memory device with flip chip and wire bond dies
Patent number
12,021,061
Issue date
Jun 25, 2024
Western Digital Technologies, Inc.
Rui Yuan
G11 - INFORMATION STORAGE
Information
Patent Grant
Semiconductor package and method of manufacturing the same
Patent number
12,021,042
Issue date
Jun 25, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Kai-Ming Ching
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
PACKAGE STRUCTURE INCLUDING RING STRUCTURE AND METHODS OF FORMING T...
Publication number
20250006572
Publication date
Jan 2, 2025
Taiwan Semiconductor Manufacturing Company Limited
Hsien-Wei Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICES WITH RECESSED PADS FOR DIE STACK INTERCONNECT...
Publication number
20240429172
Publication date
Dec 26, 2024
Micron Technology, Inc.
Ruei Ying Sheng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
RECONSTITUTED SUBSTRATE FOR RADIO FREQUENCY APPLICATIONS
Publication number
20240404960
Publication date
Dec 5, 2024
Applied Materials, Inc.
Guan Huei SEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SYSTEMS AND METHODS FOR WAFER BOND MONITORING
Publication number
20240385124
Publication date
Nov 21, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Chih-Yu WANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
Publication number
20240387472
Publication date
Nov 21, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Chia-Kuei Hsu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BONDING METHOD, BONDING DEVICE, AND HOLDING MEMBER
Publication number
20240387177
Publication date
Nov 21, 2024
Nikon Corporation
Hajime MITSUISHI
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
SEMICONDUCTOR MEMORY STACKS CONNECTED TO PROCESSING UNITS AND ASSOC...
Publication number
20240379568
Publication date
Nov 14, 2024
Micron Technology, Inc.
Kyle K. Kirby
G11 - INFORMATION STORAGE
Information
Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
Publication number
20240379569
Publication date
Nov 14, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Chih-Hang TUNG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC ASSEMBLY, ELECTRONIC APPARATUS INCLUDING THE SAME AND ME...
Publication number
20240371788
Publication date
Nov 7, 2024
3M Innovative Properties Company
Jiwoong Kong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STRUCTURES
Publication number
20240371724
Publication date
Nov 7, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Pu Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR PRODUCING AN ELECTRONIC COMPONENT, AND ELECTRONIC COMPONENT
Publication number
20240363367
Publication date
Oct 31, 2024
ams-OSRAM International GmbH
Johann Ramchen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Seal Ring Structure with Zigzag Patterns and Method Forming Same
Publication number
20240363457
Publication date
Oct 31, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Kuan-Hung Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
COMPACT POWER CONVERTER WITH TRANSISTORS THERMALLY AND ELECTRICALLY...
Publication number
20240348164
Publication date
Oct 17, 2024
Marel Power Solutions, Inc.
Jean-Claude Harel
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP-SCALE PACKAGE ARCHITECTURES CONTAINING A DIE BACK SIDE METAL A...
Publication number
20240332112
Publication date
Oct 3, 2024
Intel Corporation
Susmriti Das Mahapatra
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE THERMAL INTERFACE AND METHOD
Publication number
20240332116
Publication date
Oct 3, 2024
Intel Corporation
Chun Keang Ooi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
Publication number
20240312930
Publication date
Sep 19, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Kai-Ming Ching
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE SYSTEM AND MANUFACTURING METHOD THEREOF
Publication number
20240312859
Publication date
Sep 19, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Pei-Hsuan Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BONDING STRUCTURE AND METHOD THEREOF
Publication number
20240304580
Publication date
Sep 12, 2024
Taiwan Semiconductor Manufacturing company Ltd.
WEN-CHUAN TAI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTERCONNECTION STRUCTURE AND PACKAGE STRUCTURE
Publication number
20240297086
Publication date
Sep 5, 2024
Advanced Semiconductor Engineering, Inc.
Chun-Wei CHIANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
POWER MODULE SEMICONDUCTOR DEVICE AND INVERTER EQUIPMENT, AND FABRI...
Publication number
20240282675
Publication date
Aug 22, 2024
ROHM CO., LTD.
Toshio HANADA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
RESONANT INDUCTIVE-CAPACITIVE ISOLATED DATA CHANNEL
Publication number
20240274529
Publication date
Aug 15, 2024
TEXAS INSTRUMENTS INCORPORATED
Klaas De Haan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
Publication number
20240274442
Publication date
Aug 15, 2024
KIOXIA Corporation
Satoshi TSUKIYAMA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STRUCTURE AND MEASUREMENT METHOD FOR THE PACKAGE STRUCTURE
Publication number
20240263938
Publication date
Aug 8, 2024
Taiwan Semiconductor Manufacturing company Ltd.
KUEI-SUNG CHANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR PRODUCTS, CORRESPONDING SUBST...
Publication number
20240266259
Publication date
Aug 8, 2024
STMicroelectronics S.r.l
Mauro MAZZOLA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device with Compartment Shield Formed from Metal Bars...
Publication number
20240258246
Publication date
Aug 1, 2024
STATS ChipPAC Pte Ltd.
YongKook Shin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CONDUCTIVE BARRIER DIRECT HYBRID BONDING
Publication number
20240243085
Publication date
Jul 18, 2024
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Paul M. Enquist
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR ASSEMBLIES WITH SYSTEM AND METHODS FOR ALIGNING DIES...
Publication number
20240234378
Publication date
Jul 11, 2024
Micron Technology, Inc.
Shiro Uchiyama
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME
Publication number
20240234454
Publication date
Jul 11, 2024
TONG HSING ELECTRONIC INDUSTRIES, LTD.
DONG-RU WU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STRESS RELIEF FOR FLIP-CHIP PACKAGED DEVICES
Publication number
20240224415
Publication date
Jul 4, 2024
TEXAS INSTRUMENTS INCORPORATED
Tianyi Luo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...
Publication number
20240204444
Publication date
Jun 20, 2024
Amkor Technology Singapore Holding Pte. Ltd
Masaya TAZAWA
H01 - BASIC ELECTRIC ELEMENTS