Patent Application
20250157884
Embodiments of this application relate to the technical field of semiconductors, and in particular, to a chip liquid-cooling heat-dissipation structure, a manufacturing method therefor, and an electronic device.
As development of chips follows Moore's law, power density is gradually increasing, and some industries, such as gallium nitride power devices, have exceeded 1000 W/cm2. Therefore, conventional air cooling and liquid cooling can no longer meet heat dissipation requirements of chips.
At present, the conventional heat dissipation methods including both air cooling and liquid cooling involve removing heat from a chip with a conventional-sized heat sink. With the increase of heat density, the proportion of interface thermal resistance is increasing, and the convective heat transfer capability is approaching its limit, resulting in insufficient heat dissipation capability. In the related art, a chip is designed to be integrated with a heat sink in the field of gallium nitride devices. However, the integrated design has unsatisfactory reliability and is difficult to maintain. Once a heat dissipation channel is blocked or other reliability problem occurs, the entire chip cannot be used.
The following is a summary of a subject matter described in detail herein. This summary is not intended to limit the protection scope of the claims.
Embodiments of the present disclosure provide a chip liquid-cooling heat-dissipation structure, a manufacturing method therefor, and an electronic device.
According to a first aspect of the present disclosure, an embodiment provides a chip liquid-cooling heat-dissipation structure, which may include: a bare chip, provided with a body, a plurality of microchannels being etched on a surface of the body; and a cover plate, configured to cover the microchannels, where the cover plate is detachably connected to the bare chip, the cover plate is provided with an inlet and an outlet, and the microchannels are communicated with the inlet and the outlet.
According to a second aspect of the present disclosure, an embodiment provides an electronic device, which may include the chip liquid-cooling heat-dissipation structure described in the first aspect.
According to a third aspect of the present disclosure, an embodiment provides a manufacturing method for a chip liquid-cooling heat-dissipation structure, which may include: etching a plurality of microchannels on a surface of a body of a bare chip; and installing a cover plate on the bare chip to cover the microchannels, where the cover plate is detachably connected to the bare chip, the cover plate is provided with an inlet and an outlet, and the microchannels are communicated with the inlet and the outlet.
Additional features and advantages of the present disclosure will be set forth in the description which follows, and in part will be apparent from the description, or may be learned by the practice of the present disclosure. The objectives and other advantages of the present disclosure can be realized and obtained by the structures particularly pointed out in the description, claims, and drawings.
The drawings are provided for a further understanding of the technical schemes of the present disclosure, and constitute a part of the description. The drawings and the embodiments of the present disclosure are used to illustrate the technical schemes of the present disclosure, but are not intended to limit the technical schemes of the present disclosure.
To make the objectives, technical schemes, and advantages of the present disclosure clear, the present disclosure is described in further detail in conjunction with accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely used for illustrating the present disclosure, and are not intended to limit the present disclosure.
It should be understood that in the description of the embodiments of the present disclosure, the term “plurality of (or multiple)” means two or more, the terms such as “greater than”, “less than”, “exceed” prior to a number or series of numbers are understood to not include the number adjacent to the term. The terms such as “above”, “below”, “within” prior to a number or series of numbers are understood to include the number adjacent to the term. If used herein, the terms such as “first”, “second”, and the like are merely used for distinguishing technical features, and are not intended to indicate or imply relative importance, or implicitly point out the number of the indicated technical features, or implicitly point out the precedence order of the indicated technical features.
At present, the conventional heat dissipation methods including both air cooling and liquid cooling involve removing heat from a chip with a conventional-sized heat sink. With the increase of heat density, the proportion of interface thermal resistance is increasing, and the convective heat transfer capability is approaching its limit, resulting in insufficient heat dissipation capability. In the related art, a chip is designed to be integrated with a heat sink in the field of gallium nitride devices. However, the integrated design has unsatisfactory reliability and is difficult to maintain. Once a heat dissipation channel is blocked or other reliability problem occurs, the entire chip cannot be used.
In view of the foregoing problem, embodiments of the present disclosure provide a chip liquid-cooling heat-dissipation structure, a manufacturing method therefor, and an electronic device. The chip liquid-cooling heat-dissipation structure includes a bare chip and a cover plate. The bare chip is provided with a body, and a plurality of microchannels are etched on a surface of the body. The cover plate is configured to cover the microchannels. The cover plate is detachably connected to the bare chip, and is provided with an inlet and an outlet. The microchannels are communicated with the inlet and the outlet. Based on this, the microchannels are manufactured on the surface of the body, and the cover plate and the bare chip are designed to be detachable from each other, such that ultra-high heat dissipation capability can be ensured while realizing detachable maintenance of the chip microchannels, thereby improving product reliability and reusability, reducing costs, and ultimately improving product competitiveness.
In the related art, as shown in
As shown in
In an example implementation, taking a single board installed on a device as an example, a specific maintenance process is as follows. When it is detected that pressure of a microchannel 121 of the body 120 on the board is abnormal, that is, the microchannel 121 is blocked, the board is drawn out. Then, screws 250 are loosened, and the cover plate 200 and a rubber pad 300 are removed. The microchannel 121 is cleaned and dried, a new rubber pad 300 is prepared and installed, the cover plate 200 is installed, the screws 250 are tightened, and the board is reinserted into the device.
In an example implementation, as shown in
In an example implementation, as shown in
In an example implementation, as shown in
In an example implementation, as shown in
In an example implementation, as shown in
In an example implementation, as shown in
Based on this, in the present disclosure, the microchannels 121 are manufactured on the surface of the body 120, and the cover plate 200 and the bare chip 100 are designed to be detachable from each other, such that ultra-high heat dissipation capability can be ensured while realizing detachable maintenance of the chip microchannels 121, thereby improving product reliability and reusability, reducing costs, and ultimately improving product competitiveness.
It should be noted that instead of directly etching microchannels on the surface of the body, a base plate may be arranged on a top portion of the bare chip, and microchannels are etched on the base plate. The base plate may be combined with the bare chip by bonding, welding, or the like. Compared with the foregoing implementation of directly etching microchannels on the surface of the body, this implementation has little impact on chip design and high feasibility, but the heat dissipation capability may be reduced due to interface thermal resistance. It should be noted that, for a material of the base plate, a silicon plate with a satisfactory heat dissipation capability is preferentially selected, or a base plate containing a metal material may be selected, which is not limited in this implementation.
An embodiment of the present disclosure provides an electronic device. The electronic device includes the chip liquid-cooling heat-dissipation structure.
In an embodiment, since the electronic device uses the chip liquid-cooling heat-dissipation structure, the electronic device can achieve the same technical effects as the chip liquid-cooling heat-dissipation structure. The chip liquid-cooling heat-dissipation structure in the electronic device includes a bare chip 100 and a cover plate 200. The bare chip 100 is provided with a body 120, and a plurality of microchannels 121 are etched on a surface of the body 120. The cover plate 200 is configured to cover the microchannels 121. The cover plate 200 is detachably connected to the bare chip 100, and is provided with an inlet 210 and an outlet 220. The microchannels 121 are communicated with the inlet 210 and the outlet 220. Based on this, in the present disclosure, the microchannels 121 are manufactured on the surface of the body 120, and the cover plate 200 and the bare chip 100 are designed to be detachable from each other, such that ultra-high heat dissipation capability can be ensured while realizing detachable maintenance of the chip microchannels 121, thereby improving product reliability and reusability, reducing costs, and ultimately improving product competitiveness.
As shown in
In a step of S901, a plurality of microchannels are etched on a surface of a body of a bare chip.
In a step of S902, a cover plate is installed on the bare chip to cover the microchannels, where the cover plate is detachably connected to the bare chip, the cover plate is provided with an inlet and an outlet, and the microchannels are communicated with the inlet and the outlet.
The bare chip has a body. During manufacturing, the plurality of microchannels are etched on the surface of the body. For example, the microchannels may be etched through reactive-ion etching. The cover plate is installed on the bare chip. The cover plate is configured to cover the microchannels, is detachably connected to the bare chip, and is provided with the inlet and the outlet. The microchannels are communicated with the inlet and the outlet. Since heat emitted by a heat source at a bottom layer of the body is transferred from bottom to top to the plurality of microchannels on the upper surface of the body, a coolant entering from the inlet of the cover plate, flowing through the plurality of microchannels and then flowing out of the outlet can remove the heat, achieving an efficient heat dissipation effect. Furthermore, the cover plate and the bare chip are designed to be detachable from each other, such that when a microchannel is blocked, the cover plate can be easily detached to clean the microchannel, thereby achieving detachable maintenance.
In an example implementation, a width of the microchannel is 10 um to 100 um, and an arrangement manner of the plurality of microchannels is not limited.
As shown in
In a step of S1001, a surface of the monocrystalline silicon is spin-coated with a photoresist and dried.
In a step of S1002, the monocrystalline silicon is covered with a mask and exposed under ultraviolet light to form a microchannel photolithography pattern.
In a step of S1003, the microchannel photolithography pattern is etched through reactive-ion etching to obtain the microchannels.
In an example implementation, a surface of the monocrystalline silicon is spin-coated with a photoresist and dried, the monocrystalline silicon is covered with a mask and exposed under ultraviolet light to form a microchannel photolithography pattern, and the microchannel photolithography pattern is etched through reactive-ion etching to obtain the microchannels.
As shown in
In a step of S1101, a rubber pad is attached to a surface of the chip protection enclosure.
In a step of S1102, the cover plate is pressed on the rubber pad.
In a step of S1103, the cover plate and the bare chip are installed together through the rubber pad by using screws, such that the cover plate fits the body.
In an example implementation, a rubber pad is attached to a surface of the chip protection enclosure, and the cover plate is pressed on an upper portion of the rubber pad, such that the cover plate and the bare chip can be combined by spring screws.
In an example implementation, a diversion structure may be further arranged on a side of the cover plate facing the microchannels. The diversion structure includes a liquid inlet manifold connected to the inlet and a liquid outlet manifold connected to the outlet. The liquid inlet manifold and the liquid outlet manifold can enhance heat exchange and reduce flow resistance. In addition, the cover plate may be changed into different structural forms according to use requirements. For example, the number of liquid inlet or outlet manifolds may be changed or another diversion form may be used.
In an example implementation, a spacing between a periphery surrounding the microchannels and the chip protection enclosure is less than 1 mm, to minimize a gap between the microchannels on the body and the chip protection enclosure, such that the coolant is restricted as much as possible to flow on the microchannel, to avoid ineffective flow of the coolant, thereby further improving the heat dissipation effect.
In an example implementation, taking a single board installed on a device as an example, a specific maintenance process is as follows. When it is detected that pressure of a microchannel of the body on the board is abnormal, that is, the microchannel is blocked, the board is drawn out. Then, the screws are loosened, and the cover plate and a rubber pad are removed. The microchannel is cleaned and dried, a new rubber pad is prepared and installed, the cover plate is installed, the screws are tightened, and the board is reinserted into the device.
Based on this, in the present disclosure, the microchannels are manufactured on the surface of the body, and the cover plate and the bare chip are designed to be detachable from each other, such that ultra-high heat dissipation capability can be ensured while realizing detachable maintenance of the chip microchannels, thereby improving product reliability and reusability, reducing costs, and ultimately improving product competitiveness.
The embodiments of the present disclosure include a chip liquid-cooling heat-dissipation structure, a manufacturing method therefor, an electronic device. The chip liquid-cooling heat-dissipation structure includes a bare chip and a cover plate. The bare chip is provided with a body, and a plurality of microchannels are etched on a surface of the body. The cover plate is configured to cover the microchannels. The cover plate is detachably connected to the bare chip, and is provided with an inlet and an outlet. The microchannels are communicated with the inlet and the outlet. Based on this, in the present disclosure, the microchannels are manufactured on the surface of the body, and the cover plate and the bare chip are designed to be detachable from each other, such that ultra-high heat dissipation capability can be ensured while realizing detachable maintenance of the chip microchannels, thereby improving product reliability and reusability, reducing costs, and ultimately improving product competitiveness.
Although some embodiments of the present disclosure have been described above, the present disclosure is not limited to the implementations described above. Those having ordinary skills in the art can make various equivalent modifications or replacements without departing from the essence of the present disclosure. Such equivalent modifications or replacements fall within the scope defined by the claims of the present disclosure.
| Number | Date | Country | Kind |
|---|---|---|---|
| 202210736620.6 | Jun 2022 | CN | national |
This application is a national stage filing under 35 U.S.C. § 371 of international application number PCT/CN2023/074666 filed on Feb. 6, 2023, which claims priority to Chinese patent application No. 202210736620.6 filed on Jun. 27, 2022. The contents of these applications are incorporated herein by reference in their entirety.
| Filing Document | Filing Date | Country | Kind |
|---|---|---|---|
| PCT/CN2023/074666 | 2/6/2023 | WO |
