associated with surface mounted components

Industry

CPC
H05K1/181

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K1/00Printed circuits

Current Industry

H05K1/181associated with surface mounted components

Industries

Patents Grantslast 30 patents

Information Patent Grant
Platforms including microelectronic packages therein coupled to a c...
- Patent number 12,150,271
- Issue date Nov 19, 2024
- Intel Corporation
- Telesphor Kamgaing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package assembly
- Patent number 12,150,243
- Issue date Nov 19, 2024
- Wiwynn Corporation
- Yi Cheng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Anti-theft retail merchandise pusher with remote alarm feature
- Patent number 12,144,438
- Issue date Nov 19, 2024
- Fasteners For Retail, Inc.
- Brent O. Ewing
- A47 - FURNITURE DOMESTIC ARTICLES OR APPLIANCES COFFEE MILLS SPICE MILLS SUCT...
Information Patent Grant
Electronic device including PCB including shielding structure, and PCB
- Patent number 12,150,288
- Issue date Nov 19, 2024
- Samsung Electronics Co., Ltd.
- Hansu Cheon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate having optical waveguide
- Patent number 12,150,244
- Issue date Nov 19, 2024
- Ibiden Co., Ltd.
- Masatoshi Kunieda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Compact oscillator device with a cavity resonator on a circuit board
- Patent number 12,142,810
- Issue date Nov 12, 2024
- Telefonaktiebolaget LM Ericsson (publ)
- Mikael Hörberg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stiffener ring combined with ASIC power delivery
- Patent number 12,142,578
- Issue date Nov 12, 2024
- Cisco Technology, Inc.
- Xiaohong Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Module
- Patent number 12,144,159
- Issue date Nov 12, 2024
- Murata Manufacturing Co., Ltd.
- Yoshihito Otsubo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Device for driving a compressor and processes for mounting the device
- Patent number 12,138,989
- Issue date Nov 12, 2024
- HANON SYSTEMS
- Hendrik Varain
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Electronic device including coin-cell battery
- Patent number 12,144,123
- Issue date Nov 12, 2024
- Samsung Electronics Co., Ltd.
- Kiwook Han
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Antenna-in-package devices and methods of making
- Patent number 12,136,759
- Issue date Nov 5, 2024
- STATS ChipPAC Pte. Ltd.
- HunTeak Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power converter
- Patent number 12,136,884
- Issue date Nov 5, 2024
- Delta Electronics, Inc.
- Yang Leng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring circuit board
- Patent number 12,137,522
- Issue date Nov 5, 2024
- Nitto Denko Corporation
- Rihito Fukushima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electromagnetic interference shielding and thermal management syste...
- Patent number 12,137,515
- Issue date Nov 5, 2024
- Aptiv Technologies AG
- Scott D. Brandenburg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat dissipation apparatus and methods for UV-LED photoreactors
- Patent number 12,134,572
- Issue date Nov 5, 2024
- The University of British Columbia
- Fariborz Taghipour
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Memory card and memory system
- Patent number 12,136,606
- Issue date Nov 5, 2024
- Kioxia Corporation
- Yuki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power conversion device
- Patent number 12,133,369
- Issue date Oct 29, 2024
- Mitsubishi Electric Corporation
- Yuta Yoshimi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Keyboard assembly with interchangeable keys and method of operating...
- Patent number 12,131,875
- Issue date Oct 29, 2024
- Home Control Singapore Pte. Ltd.
- Kwok Hoong Siu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Memory system
- Patent number 12,131,062
- Issue date Oct 29, 2024
- Kioxia Corporation
- Fuminori Kimura
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Circuit board and display device including the same
- Patent number 12,130,979
- Issue date Oct 29, 2024
- Samsung Display Co., Ltd.
- Min-Hong Kim
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Wiring substrate and semiconductor device
- Patent number 12,133,330
- Issue date Oct 29, 2024
- Shinko Electric Industries Co., Ltd.
- Akihiro Takeuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Sensor mounted wafer
- Patent number 12,131,968
- Issue date Oct 29, 2024
- E-TRON CO., LTD.
- Ho Seung Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device including interface terminal having outer shell a...
- Patent number 12,126,122
- Issue date Oct 22, 2024
- Samsung Electronics Co., Ltd.
- Juho Yi
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Maintaining the shape of a circuit board
- Patent number 12,127,334
- Issue date Oct 22, 2024
- Dis Tech America, LLC
- Heng-Kit Too
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stretchable mounting substrate
- Patent number 12,127,339
- Issue date Oct 22, 2024
- Murata Manufacturing Co., Ltd.
- Tadahiko Matsumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for bidirectional message architecture for inve...
- Patent number 12,122,251
- Issue date Oct 22, 2024
- BorgWarner US Technologies LLC
- Jack Lavern Glenn
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Multilayer printed circuit board
- Patent number 12,127,341
- Issue date Oct 22, 2024
- Thales
- Geoffroy Aupee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metal base substrate, electronic component mounting substrate
- Patent number 12,127,342
- Issue date Oct 22, 2024
- Mitsubishi Materials Corporation
- Fumiaki Ishikawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Display apparatus
- Patent number 12,127,353
- Issue date Oct 22, 2024
- Samsung Electronics Co., Ltd.
- Jiwon Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate and memory system
- Patent number 12,127,346
- Issue date Oct 22, 2024
- Kioxia Corporation
- Kazuyuki Niitsuma
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
CIRCUIT BOARD
- Publication number 20240387344
- Publication date Nov 21, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Chi Hyeon JEONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR ASSEMBLING PROCESSOR SYSTEMS
- Publication number 20240387496
- Publication date Nov 21, 2024
- 1372934 B.C. Ltd.
- Kelly T. R. Boothby
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCED BALL GRID ARRAY PAD CAPACITANCE
- Publication number 20240389220
- Publication date Nov 21, 2024
- Dell Products L.P.
- Sandor FARKAS
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT MODULE
- Publication number 20240389235
- Publication date Nov 21, 2024
- Murata Manufacturing Co., Ltd.
- Yoshihito OTSUBO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER CERAMIC CAPACITOR, MULTILAYER-CERAMIC-CAPACITOR MANUFACT...
- Publication number 20240387112
- Publication date Nov 21, 2024
- Murata Manufacturing Co., Ltd.
- Toshiyuki NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATELESS HYBRID POWER MODULE ASSEMBLY AND METHOD FOR FABRICATI...
- Publication number 20240389237
- Publication date Nov 21, 2024
- IndiaVPSemiconductor Pvt Ltd.
- VIJAY BOLLOJU BOLLOJU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STRETCHABLE AND FLEXIBLE METAL FILM STRUCTURES
- Publication number 20240389225
- Publication date Nov 21, 2024
- Liquid Wire Inc.
- Trevor Antonio Rivera
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MATERIALS FOR SEMICONDUCTOR PACKAGE MOUNT APPLICATIONS AND METHODS...
- Publication number 20240389240
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Chao-Wei Chiu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT
- Publication number 20240383035
- Publication date Nov 21, 2024
- Resonac Corporation
- Yoshinori EJIRI
- B22 - CASTING POWDER METALLURGY
Information Patent Application
LIQUID METAL PATCH INTERCONNECT FOR LARGE WARPAGE COMPONENTS
- Publication number 20240388018
- Publication date Nov 21, 2024
- Intel Corporation
- Karumbu MEYYAPPAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC CONTROL DEVICE
- Publication number 20240389228
- Publication date Nov 21, 2024
- Hitachi Astemo, Ltd.
- Akira ISHII
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC CONTROL APPARATUS AND ELECTRIC BRAKE APPARATUS
- Publication number 20240389279
- Publication date Nov 21, 2024
- Hitachi Astemo, Ltd.
- Tomohiro UCHIDA
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
Information Patent Application
METHODS AND SYSTEMS FOR IMPROVING SURFACE MOUNT JOINDER
- Publication number 20240389239
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wen Liu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Manufacturing a Component Carrier by a Nano Imprint Lithography Pro...
- Publication number 20240381538
- Publication date Nov 14, 2024
- AT&S Austria Technologie & Systemtechnik
- Heinrich TRISCHLER
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SINTERING PASTE, METHOD FOR ELECTRICALLY CONDUCTIVE, MATERIALLY BON...
- Publication number 20240381539
- Publication date Nov 14, 2024
- MAHLE International GmbH
- Matthias Tuerpe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTERPOSER FOR IMPLEMENTING FLIP-CHIP DIES IN WIREBONDED CIRCUIT AS...
- Publication number 20240379518
- Publication date Nov 14, 2024
- BAE SYSTEMS INFORMATION AND ELECTRONIC SYSTEMS INTEGRATION INC
- Nicholas L. Campbell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHOCK ABSORBER ASSEMBLY FOR A PRINTED CIRCUIT BOARD
- Publication number 20240381524
- Publication date Nov 14, 2024
- Western Digital Technologies, Inc.
- MyungJin Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT APPLIQUES
- Publication number 20240381536
- Publication date Nov 14, 2024
- Liquid Wire Inc.
- Mark William Ronay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240381535
- Publication date Nov 14, 2024
- Hitachi Astemo, Ltd.
- Fumiya IIJIMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MODULAR ROUTABLE CIRCUIT BOARD CONDUCTOR BLOCKS
- Publication number 20240381541
- Publication date Nov 14, 2024
- Microsoft Technology Licensing, LLC
- Jason HARRIGAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT COMPONENT, ELECTRONIC DEVICE AND METHOD FOR PRODUCING CIRCU...
- Publication number 20240379281
- Publication date Nov 14, 2024
- ROHM CO., LTD.
- Tatsuya MIYAZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE, CIRCUIT BOARD, AND MANUFACTURING METHOD FOR CIRC...
- Publication number 20240373553
- Publication date Nov 7, 2024
- Huawei Technologies Co., Ltd
- Xuanling Liang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT ASSEMBLY INCLUDING GALLIUM NITRIDE DEVICES
- Publication number 20240373557
- Publication date Nov 7, 2024
- Murata Manufacturing Co., Ltd.
- Jahangir AFSHARIAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240373558
- Publication date Nov 7, 2024
- Innolux Corporation
- Chin-Lung Ting
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
NOISE FILTER CIRCUIT
- Publication number 20240372521
- Publication date Nov 7, 2024
- Mitsubishi Electric Corporation
- Satoshi Yoneda
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
METHOD AND APPARATUS FOR TRANSMITTING CURRENT AND VOLTAGE SIGNALS O...
- Publication number 20240372116
- Publication date Nov 7, 2024
- CATARC New Energy Vehicle Test Center (Tianjin) Co., Ltd.
- Zirong YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SUPPLY AND WIRE SECURING ASSEMBLY THEREOF
- Publication number 20240372344
- Publication date Nov 7, 2024
- ACBEL POLYTECH INC.
- Cheng-Chia LIN
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
TECHNIQUES TO CONTROL SYSTEM UPDATES AND CONFIGURATION CHANGES VIA...
- Publication number 20240372792
- Publication date Nov 7, 2024
- Intel Corporation
- MURUGASAMY K. NACHIMUTHU
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Application
SELF-HEALING CAP FOR LIQUID METAL CONTAINMENT IN SOCKET APPLICATIONS
- Publication number 20240363520
- Publication date Oct 31, 2024
- Intel Corporation
- Ziyin LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAMERA MODULE
- Publication number 20240364989
- Publication date Oct 31, 2024
- LG Innotek Co., Ltd.
- Young Bae JANG
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

associated with surface mounted components

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Platforms including microelectronic packages therein coupled to a c...

Package assembly

Anti-theft retail merchandise pusher with remote alarm feature

Electronic device including PCB including shielding structure, and PCB

Wiring substrate having optical waveguide

Compact oscillator device with a cavity resonator on a circuit board

Stiffener ring combined with ASIC power delivery

Module

Device for driving a compressor and processes for mounting the device

Electronic device including coin-cell battery

Antenna-in-package devices and methods of making

Power converter

Wiring circuit board

Electromagnetic interference shielding and thermal management syste...

Heat dissipation apparatus and methods for UV-LED photoreactors

Memory card and memory system

Power conversion device

Keyboard assembly with interchangeable keys and method of operating...

Memory system

Circuit board and display device including the same

Wiring substrate and semiconductor device

Sensor mounted wafer

Electronic device including interface terminal having outer shell a...

Maintaining the shape of a circuit board

Stretchable mounting substrate

Systems and methods for bidirectional message architecture for inve...

Multilayer printed circuit board

Metal base substrate, electronic component mounting substrate

Display apparatus

Substrate and memory system

Patents Applicationslast 30 patents

CIRCUIT BOARD

SYSTEMS AND METHODS FOR ASSEMBLING PROCESSOR SYSTEMS

REDUCED BALL GRID ARRAY PAD CAPACITANCE

CIRCUIT MODULE

MULTILAYER CERAMIC CAPACITOR, MULTILAYER-CERAMIC-CAPACITOR MANUFACT...

SUBSTRATELESS HYBRID POWER MODULE ASSEMBLY AND METHOD FOR FABRICATI...

STRETCHABLE AND FLEXIBLE METAL FILM STRUCTURES

MATERIALS FOR SEMICONDUCTOR PACKAGE MOUNT APPLICATIONS AND METHODS...

ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT

LIQUID METAL PATCH INTERCONNECT FOR LARGE WARPAGE COMPONENTS

ELECTRONIC CONTROL DEVICE

ELECTRONIC CONTROL APPARATUS AND ELECTRIC BRAKE APPARATUS

METHODS AND SYSTEMS FOR IMPROVING SURFACE MOUNT JOINDER

Manufacturing a Component Carrier by a Nano Imprint Lithography Pro...

SINTERING PASTE, METHOD FOR ELECTRICALLY CONDUCTIVE, MATERIALLY BON...

INTERPOSER FOR IMPLEMENTING FLIP-CHIP DIES IN WIREBONDED CIRCUIT AS...

SHOCK ABSORBER ASSEMBLY FOR A PRINTED CIRCUIT BOARD

ELECTRONIC COMPONENT APPLIQUES

ELECTRONIC DEVICE

MODULAR ROUTABLE CIRCUIT BOARD CONDUCTOR BLOCKS

CIRCUIT COMPONENT, ELECTRONIC DEVICE AND METHOD FOR PRODUCING CIRCU...

ELECTRONIC DEVICE, CIRCUIT BOARD, AND MANUFACTURING METHOD FOR CIRC...

CIRCUIT ASSEMBLY INCLUDING GALLIUM NITRIDE DEVICES

ELECTRONIC DEVICE

NOISE FILTER CIRCUIT

METHOD AND APPARATUS FOR TRANSMITTING CURRENT AND VOLTAGE SIGNALS O...

POWER SUPPLY AND WIRE SECURING ASSEMBLY THEREOF

TECHNIQUES TO CONTROL SYSTEM UPDATES AND CONFIGURATION CHANGES VIA...

SELF-HEALING CAP FOR LIQUID METAL CONTAINMENT IN SOCKET APPLICATIONS

CAMERA MODULE