at least one device in the stack being rotated or offset

Industry

CPC
H01L2225/06562

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2225/00Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups

Current Industry

H01L2225/06562at least one device in the stack being rotated or offset

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Package-on-package assembly with wire bond vias
- Patent number 12,211,821
- Issue date Jan 28, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Ellis Chau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor die assemblies with substrate heat sinks and...
- Patent number 12,211,822
- Issue date Jan 28, 2025
- Micron Technology, Inc.
- Shams U. Arifeen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Concurrent write to programmable resistance memory cells in cross-p...
- Patent number 12,205,638
- Issue date Jan 21, 2025
- SANDISK TECHNOLOGIES LLC
- Nathan Franklin
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor package structure and packaging method thereof
- Patent number 12,205,940
- Issue date Jan 21, 2025
- Yangtze Memory Technologies Co., Ltd.
- Peng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 12,205,875
- Issue date Jan 21, 2025
- Kioxia Corporation
- Satoshi Tsukiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages
- Patent number 12,199,061
- Issue date Jan 14, 2025
- SK hynix Inc.
- Ha Gyeong Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated voltage regulator (IVR) package including inductor and c...
- Patent number 12,191,288
- Issue date Jan 7, 2025
- Samsung Electronics Co., Ltd.
- Sangnam Jeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid mold chase surface for semiconductor bonding and related sys...
- Patent number 12,191,164
- Issue date Jan 7, 2025
- Micron Technology, Inc.
- Byung Hoon Moon
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Semiconductor memory device and memory system
- Patent number 12,183,405
- Issue date Dec 31, 2024
- Kioxia Corporation
- Mitsuhiro Abe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including stopper layer and electronic system...
- Patent number 12,176,389
- Issue date Dec 24, 2024
- Samsung Electronics Co., Ltd.
- Hyemi Lee
- G11 - INFORMATION STORAGE
Information Patent Grant
Dicing die attach film, and semiconductor package using the same an...
- Patent number 12,176,314
- Issue date Dec 24, 2024
- Furukawa Electric Co., Ltd.
- Minoru Morita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D chip package based on vertical-through-via connector
- Patent number 12,176,278
- Issue date Dec 24, 2024
- iCometrue Company Ltd.
- Ping-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,166,007
- Issue date Dec 10, 2024
- Samsung Electronics Co., Ltd.
- Byeonguk Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method of semiconductor pac...
- Patent number 12,166,015
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Kang Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device
- Patent number 12,159,856
- Issue date Dec 3, 2024
- Kioxia Corporation
- Satoshi Tsukiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 12,159,858
- Issue date Dec 3, 2024
- Samsung Electronics Co., Ltd.
- Hyunsoo Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing same
- Patent number 12,154,859
- Issue date Nov 26, 2024
- Samsung Electronics Co., Ltd.
- Woonchun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a semiconductor device including vertical contact...
- Patent number 12,154,860
- Issue date Nov 26, 2024
- SanDisk Technologies, Inc.
- Zhongli Ji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Erase method for non-volatile memory with multiple tiers
- Patent number 12,148,478
- Issue date Nov 19, 2024
- SANDISK TECHNOLOGIES LLC
- Xiang Yang
- G11 - INFORMATION STORAGE
Information Patent Grant
Three-dimensional bonding scheme and associated systems and methods
- Patent number 12,148,736
- Issue date Nov 19, 2024
- Micron Technology, Inc.
- Kelvin Tan Aik Boo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fan-out package and the methods of manufacturing
- Patent number 12,142,597
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Separate inter-die connectors for data and error correction informa...
- Patent number 12,141,084
- Issue date Nov 12, 2024
- Lodestar Licensing Group LLC
- Vijayakrishna J. Vankayala
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Bonding apparatus and bonding method
- Patent number 12,136,604
- Issue date Nov 5, 2024
- Shinkawa Ltd.
- Hideharu Nihei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages
- Patent number 12,131,997
- Issue date Oct 29, 2024
- SK hynix Inc.
- Won Duck Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level stacked die structures and associated systems and methods
- Patent number 12,125,826
- Issue date Oct 22, 2024
- Micron Technology, Inc.
- Chih Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Non-volatile memory with zoned control for limiting programming for...
- Patent number 12,119,065
- Issue date Oct 15, 2024
- SanDisk Technoloiges LLC
- Xiaochen Zhu
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
- Patent number 12,119,323
- Issue date Oct 15, 2024
- Kioxia Corporation
- Soichi Homma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip package and method of providing die-to-die interconnects...
- Patent number 12,113,026
- Issue date Oct 8, 2024
- Intel Corporation
- Henning Braunisch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Command and address interface regions, and associated devices and s...
- Patent number 12,100,471
- Issue date Sep 24, 2024
- Kazuhiro Yoshida
- G11 - INFORMATION STORAGE
Information Patent Grant
Chip-middle type fan-out panel-level package and packaging method t...
- Patent number 12,094,809
- Issue date Sep 17, 2024
- Powertech Technology Inc.
- Hiroyuki Fujishima
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ADAPTIVE ERASE PULSE TO IMPROVE MEMORY CELL ENDURANCE AND ERASE TIM...
- Publication number 20250037772
- Publication date Jan 30, 2025
- Western Digital Technologies, Inc.
- Ming Wang
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250029936
- Publication date Jan 23, 2025
- Samsung Electronics Co., Ltd.
- Jongwon LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-LEVEL STACKED DIE STRUCTURES AND ASSOCIATED SYSTEMS AND METHODS
- Publication number 20250022852
- Publication date Jan 16, 2025
- Micron Technology, Inc.
- Chih Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE COMPRISING ADHESION ENHANCER LAYER AND METHOD...
- Publication number 20250022764
- Publication date Jan 16, 2025
- Samsung Electronics Co., Ltd.
- Minjung KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME, AND ELEC...
- Publication number 20250015182
- Publication date Jan 9, 2025
- Samsung Electronics Co., Ltd.
- Siyeong Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250014963
- Publication date Jan 9, 2025
- Samsung Electronics Co., Ltd.
- Yongkwan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING MEMORY DEVICES STACKED IN STAIRCASE
- Publication number 20250015051
- Publication date Jan 9, 2025
- SK HYNIX INC.
- Byung Deuk JEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20250015052
- Publication date Jan 9, 2025
- Samsung Electronics Co., Ltd.
- JUNBYEONG LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20250014999
- Publication date Jan 9, 2025
- SK HYNIX INC.
- Won Duck JUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIDUCIALS WITH UNDERLYING DUMMY METALLIZATION FOR INTEGRATED CIRCUI...
- Publication number 20250006652
- Publication date Jan 2, 2025
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20240429110
- Publication date Dec 26, 2024
- Samsung Electronics Co., Ltd.
- Jangwoo LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240429114
- Publication date Dec 26, 2024
- KIOXIA Corporation
- Yoshiharu OKADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP PACKAGE AND METHOD OF PROVIDING DIE-TO-DIE INTERCONNECTS...
- Publication number 20240429173
- Publication date Dec 26, 2024
- Intel Corporation
- Henning BRAUNISCH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE WIRE COATING DURING WIRE BONDING
- Publication number 20240429196
- Publication date Dec 26, 2024
- Western Digital Technologies, Inc.
- Darryl Wong Jun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240429118
- Publication date Dec 26, 2024
- KIOXIA Corporation
- Keisuke TOKUBUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20240421014
- Publication date Dec 19, 2024
- Samsung Electronics Co., Ltd.
- Injae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERFACE REGIONS, AND ASSOCIATED DEVICES AND SYSTEMS
- Publication number 20240420747
- Publication date Dec 19, 2024
- Lodestar Licensing Group LLC
- KAZUHIRO YOSHIDA
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240421121
- Publication date Dec 19, 2024
- KIOXIA Corporation
- Masayuki MIURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240413125
- Publication date Dec 12, 2024
- Samsung Electronics Co., Ltd.
- Seho You
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS INCLUDING SELECTABLE CIRCUIT PLACEMENT MECHANISM AND METH...
- Publication number 20240404995
- Publication date Dec 5, 2024
- Micron Technology, Inc.
- Chin Hui Chong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGES
- Publication number 20240404931
- Publication date Dec 5, 2024
- Samsung Electronics Co., Ltd.
- Hyejin LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURES, FABRICATING METHODS THEREOF, AND MEMORY SYSTEMS
- Publication number 20240404901
- Publication date Dec 5, 2024
- Yangtze Memory Technologies Co., Ltd.
- Qi Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-DIE MEMORY DEVICE
- Publication number 20240404580
- Publication date Dec 5, 2024
- Rambus Inc.
- Scott C. Best
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMALLY CONDUCTIVE SPACER
- Publication number 20240404994
- Publication date Dec 5, 2024
- Western Digital Technologies, Inc.
- Jayavel Pachamuthu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED MEMORY DEVICE WITH OVERHANG SUPPORT STRUCTURE
- Publication number 20240397735
- Publication date Nov 28, 2024
- Western Digital Technologies, Inc.
- Shujun Zheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Package with Die Stackup and Connection Platform
- Publication number 20240387461
- Publication date Nov 21, 2024
- Western Digital Technologies, Inc.
- Rajitha Indla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20240387460
- Publication date Nov 21, 2024
- Samsung Electronics Co., Ltd.
- Heejae NAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20240379620
- Publication date Nov 14, 2024
- Samsung Electronics Co., Ltd.
- Dahee PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNIQUES FOR POSITIONING BOND PADS OF MICROELECTRONIC DEVICES AND...
- Publication number 20240379599
- Publication date Nov 14, 2024
- Micron Technology, Inc.
- Ken Ota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING DOLMEN STRUCTURE AND MANUFACTURING METH...
- Publication number 20240371832
- Publication date Nov 7, 2024
- Resonac Corporation
- Tatsuya YAHATA
- H01 - BASIC ELECTRIC ELEMENTS

at least one device in the stack being rotated or offset

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Package-on-package assembly with wire bond vias

Stacked semiconductor die assemblies with substrate heat sinks and...

Concurrent write to programmable resistance memory cells in cross-p...

Semiconductor package structure and packaging method thereof

Semiconductor device and manufacturing method thereof

Semiconductor packages

Integrated voltage regulator (IVR) package including inductor and c...

Hybrid mold chase surface for semiconductor bonding and related sys...

Semiconductor memory device and memory system

Semiconductor device including stopper layer and electronic system...

Dicing die attach film, and semiconductor package using the same an...

3D chip package based on vertical-through-via connector

Semiconductor package

Semiconductor package and manufacturing method of semiconductor pac...

Method for manufacturing semiconductor device

Semiconductor package and method of fabricating the same

Semiconductor package and method of manufacturing same

Method of forming a semiconductor device including vertical contact...

Erase method for non-volatile memory with multiple tiers

Three-dimensional bonding scheme and associated systems and methods

Integrated fan-out package and the methods of manufacturing

Separate inter-die connectors for data and error correction informa...

Bonding apparatus and bonding method

Semiconductor packages

Wafer-level stacked die structures and associated systems and methods

Non-volatile memory with zoned control for limiting programming for...

Semiconductor device and method of manufacturing semiconductor device

Multi-chip package and method of providing die-to-die interconnects...

Command and address interface regions, and associated devices and s...

Chip-middle type fan-out panel-level package and packaging method t...

Patents Applicationslast 30 patents

ADAPTIVE ERASE PULSE TO IMPROVE MEMORY CELL ENDURANCE AND ERASE TIM...

SEMICONDUCTOR PACKAGE

WAFER-LEVEL STACKED DIE STRUCTURES AND ASSOCIATED SYSTEMS AND METHODS

SEMICONDUCTOR PACKAGE COMPRISING ADHESION ENHANCER LAYER AND METHOD...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME, AND ELEC...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE HAVING MEMORY DEVICES STACKED IN STAIRCASE

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

SEMICONDUCTOR PACKAGES

FIDUCIALS WITH UNDERLYING DUMMY METALLIZATION FOR INTEGRATED CIRCUI...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

SEMICONDUCTOR DEVICE

MULTI-CHIP PACKAGE AND METHOD OF PROVIDING DIE-TO-DIE INTERCONNECTS...

SELECTIVE WIRE COATING DURING WIRE BONDING

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

INTERFACE REGIONS, AND ASSOCIATED DEVICES AND SYSTEMS

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE

APPARATUS INCLUDING SELECTABLE CIRCUIT PLACEMENT MECHANISM AND METH...

METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGES

PACKAGE STRUCTURES, FABRICATING METHODS THEREOF, AND MEMORY SYSTEMS

MULTI-DIE MEMORY DEVICE

THERMALLY CONDUCTIVE SPACER

PACKAGED MEMORY DEVICE WITH OVERHANG SUPPORT STRUCTURE

Semiconductor Device Package with Die Stackup and Connection Platform

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

TECHNIQUES FOR POSITIONING BOND PADS OF MICROELECTRONIC DEVICES AND...

SEMICONDUCTOR DEVICE HAVING DOLMEN STRUCTURE AND MANUFACTURING METH...