at least one device in the stack being rotated or offset

Industry

CPC
H01L2225/06562

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2225/00Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups

Current Industry

H01L2225/06562at least one device in the stack being rotated or offset

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package
- Patent number 12,166,007
- Issue date Dec 10, 2024
- Samsung Electronics Co., Ltd.
- Byeonguk Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method of semiconductor pac...
- Patent number 12,166,015
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Kang Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device
- Patent number 12,159,856
- Issue date Dec 3, 2024
- Kioxia Corporation
- Satoshi Tsukiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 12,159,858
- Issue date Dec 3, 2024
- Samsung Electronics Co., Ltd.
- Hyunsoo Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing same
- Patent number 12,154,859
- Issue date Nov 26, 2024
- Samsung Electronics Co., Ltd.
- Woonchun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a semiconductor device including vertical contact...
- Patent number 12,154,860
- Issue date Nov 26, 2024
- SanDisk Technologies, Inc.
- Zhongli Ji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Erase method for non-volatile memory with multiple tiers
- Patent number 12,148,478
- Issue date Nov 19, 2024
- SANDISK TECHNOLOGIES LLC
- Xiang Yang
- G11 - INFORMATION STORAGE
Information Patent Grant
Three-dimensional bonding scheme and associated systems and methods
- Patent number 12,148,736
- Issue date Nov 19, 2024
- Micron Technology, Inc.
- Kelvin Tan Aik Boo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fan-out package and the methods of manufacturing
- Patent number 12,142,597
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Separate inter-die connectors for data and error correction informa...
- Patent number 12,141,084
- Issue date Nov 12, 2024
- Lodestar Licensing Group LLC
- Vijayakrishna J. Vankayala
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Bonding apparatus and bonding method
- Patent number 12,136,604
- Issue date Nov 5, 2024
- Shinkawa Ltd.
- Hideharu Nihei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages
- Patent number 12,131,997
- Issue date Oct 29, 2024
- SK hynix Inc.
- Won Duck Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level stacked die structures and associated systems and methods
- Patent number 12,125,826
- Issue date Oct 22, 2024
- Micron Technology, Inc.
- Chih Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Non-volatile memory with zoned control for limiting programming for...
- Patent number 12,119,065
- Issue date Oct 15, 2024
- SanDisk Technoloiges LLC
- Xiaochen Zhu
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
- Patent number 12,119,323
- Issue date Oct 15, 2024
- Kioxia Corporation
- Soichi Homma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip package and method of providing die-to-die interconnects...
- Patent number 12,113,026
- Issue date Oct 8, 2024
- Intel Corporation
- Henning Braunisch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Command and address interface regions, and associated devices and s...
- Patent number 12,100,471
- Issue date Sep 24, 2024
- Kazuhiro Yoshida
- G11 - INFORMATION STORAGE
Information Patent Grant
Chip-middle type fan-out panel-level package and packaging method t...
- Patent number 12,094,809
- Issue date Sep 17, 2024
- Powertech Technology Inc.
- Hiroyuki Fujishima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fast search for leaky word line
- Patent number 12,094,550
- Issue date Sep 17, 2024
- SanDisk Technologies, Inc.
- Xingyan Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mold compound dispensing system and method
- Patent number 12,083,715
- Issue date Sep 10, 2024
- Morgan, Lewis & Bockius LLP
- Xianlu Cui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Techniques for positioning bond pads of microelectronic devices and...
- Patent number 12,087,716
- Issue date Sep 10, 2024
- Micron Technology, Inc.
- Ken Ota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Storage system for enhancing data valid windows of signals
- Patent number 12,087,370
- Issue date Sep 10, 2024
- Samsung Electronics Co., Ltd.
- TongSung Kim
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Preventing erase disturb in NAND
- Patent number 12,087,371
- Issue date Sep 10, 2024
- SanDisk Technologies LLC
- Yanli Zhang
- G11 - INFORMATION STORAGE
Information Patent Grant
Board unit and semiconductor device
- Patent number 12,080,677
- Issue date Sep 3, 2024
- Kioxia Corporation
- Katsuya Murakami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reinforced semiconductor device packaging and associated systems an...
- Patent number 12,080,616
- Issue date Sep 3, 2024
- Micron Technology, Inc.
- Suresh K. Upadhyayula
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor storage device with bonding electrodes
- Patent number 12,080,666
- Issue date Sep 3, 2024
- Kioxia Corporation
- Hideaki Murakami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having dolmen structure and manufacturing meth...
- Patent number 12,074,139
- Issue date Aug 27, 2024
- Tatsuya Yahata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die stack with cascade and vertical connections
- Patent number 12,068,283
- Issue date Aug 20, 2024
- Intel Corporation
- Min-Tih Ted Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory package, storage device including memory package, and storag...
- Patent number 12,057,191
- Issue date Aug 6, 2024
- Samsung Electronics Co., Ltd.
- Ji-Yeon Shin
- G11 - INFORMATION STORAGE
Information Patent Grant
Array of heat-sinked power semiconductors
- Patent number 12,046,529
- Issue date Jul 23, 2024
- American Axle & Manufacturing, Inc.
- Jeffrey J. Ronning
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20240421014
- Publication date Dec 19, 2024
- Samsung Electronics Co., Ltd.
- Injae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240421121
- Publication date Dec 19, 2024
- KIOXIA Corporation
- Masayuki MIURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERFACE REGIONS, AND ASSOCIATED DEVICES AND SYSTEMS
- Publication number 20240420747
- Publication date Dec 19, 2024
- Lodestar Licensing Group LLC
- KAZUHIRO YOSHIDA
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240413125
- Publication date Dec 12, 2024
- Samsung Electronics Co., Ltd.
- Seho You
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS INCLUDING SELECTABLE CIRCUIT PLACEMENT MECHANISM AND METH...
- Publication number 20240404995
- Publication date Dec 5, 2024
- Micron Technology, Inc.
- Chin Hui Chong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGES
- Publication number 20240404931
- Publication date Dec 5, 2024
- Samsung Electronics Co., Ltd.
- Hyejin LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURES, FABRICATING METHODS THEREOF, AND MEMORY SYSTEMS
- Publication number 20240404901
- Publication date Dec 5, 2024
- Yangtze Memory Technologies Co., Ltd.
- Qi Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-DIE MEMORY DEVICE
- Publication number 20240404580
- Publication date Dec 5, 2024
- Rambus Inc.
- Scott C. Best
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMALLY CONDUCTIVE SPACER
- Publication number 20240404994
- Publication date Dec 5, 2024
- Western Digital Technologies, Inc.
- Jayavel Pachamuthu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED MEMORY DEVICE WITH OVERHANG SUPPORT STRUCTURE
- Publication number 20240397735
- Publication date Nov 28, 2024
- Western Digital Technologies, Inc.
- Shujun Zheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Package with Die Stackup and Connection Platform
- Publication number 20240387461
- Publication date Nov 21, 2024
- Western Digital Technologies, Inc.
- Rajitha Indla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20240387460
- Publication date Nov 21, 2024
- Samsung Electronics Co., Ltd.
- Heejae NAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20240379620
- Publication date Nov 14, 2024
- Samsung Electronics Co., Ltd.
- Dahee PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNIQUES FOR POSITIONING BOND PADS OF MICROELECTRONIC DEVICES AND...
- Publication number 20240379599
- Publication date Nov 14, 2024
- Micron Technology, Inc.
- Ken Ota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING DOLMEN STRUCTURE AND MANUFACTURING METH...
- Publication number 20240371832
- Publication date Nov 7, 2024
- Resonac Corporation
- Tatsuya YAHATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20240371730
- Publication date Nov 7, 2024
- Samsung Electronics Co., Ltd.
- Ahreum LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND DATA STORAGE SYSTEM INCLUDING SEMICONDUCTO...
- Publication number 20240365543
- Publication date Oct 31, 2024
- Samsung Electronics Co., Ltd.
- Taegon LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED INTEGRATED CIRCUIT DEVICES WITH ENHANCED DAM STRUCTURES TH...
- Publication number 20240355777
- Publication date Oct 24, 2024
- Samsung Electronics Co., Ltd.
- SEUNGHYUN BAIK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED DEVICE COMPRISING AN OFFSET INTERCONNECT
- Publication number 20240355781
- Publication date Oct 24, 2024
- QUALCOMM Incorporated
- Yangyang SUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240347437
- Publication date Oct 17, 2024
- Samsung Electronics Co., Ltd.
- Jinho Chun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240347499
- Publication date Oct 17, 2024
- Samsung Electronics Co., Ltd.
- Hongjin KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ARRAY OF HEAT-SINKED POWER SEMICONDUCTORS
- Publication number 20240339374
- Publication date Oct 10, 2024
- American Axle & Manufacturing, Inc.
- Jeffrey J. RONNING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACK PACKAGES
- Publication number 20240339436
- Publication date Oct 10, 2024
- SK HYNIX INC.
- Eun Hye DO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE, FABRICATION METHOD AND MEMORY SYSTEM
- Publication number 20240332269
- Publication date Oct 3, 2024
- Yangtze Memory Technologies Co., Ltd.
- Xinru Zeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240332266
- Publication date Oct 3, 2024
- MEDIATEK INC.
- Che-Hung KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTRA-PACKAGE MEMORY DIE COMMUNICATION STRUCTURES
- Publication number 20240331757
- Publication date Oct 3, 2024
- Micron Technology, Inc.
- Hari Giduturi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING GLASS CORE SUBSTRATE AND METHOD OF...
- Publication number 20240321755
- Publication date Sep 26, 2024
- Samsung Electronics Co., Ltd.
- Myungsam KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADSORPTION DEVICE FOR REFLOW PROCESS AND METHOD OF ATTACHING CONNEC...
- Publication number 20240321622
- Publication date Sep 26, 2024
- Samsung Electronics Co., Ltd.
- YOUNG-JA KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STORAGE DEVICE
- Publication number 20240324112
- Publication date Sep 26, 2024
- KIOXIA Corporation
- Takuya OKISHIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE,...
- Publication number 20240321774
- Publication date Sep 26, 2024
- Samsung Electronics Co., Ltd.
- Kitae Park
- H01 - BASIC ELECTRIC ELEMENTS

at least one device in the stack being rotated or offset

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor package

Semiconductor package and manufacturing method of semiconductor pac...

Method for manufacturing semiconductor device

Semiconductor package and method of fabricating the same

Semiconductor package and method of manufacturing same

Method of forming a semiconductor device including vertical contact...

Erase method for non-volatile memory with multiple tiers

Three-dimensional bonding scheme and associated systems and methods

Integrated fan-out package and the methods of manufacturing

Separate inter-die connectors for data and error correction informa...

Bonding apparatus and bonding method

Semiconductor packages

Wafer-level stacked die structures and associated systems and methods

Non-volatile memory with zoned control for limiting programming for...

Semiconductor device and method of manufacturing semiconductor device

Multi-chip package and method of providing die-to-die interconnects...

Command and address interface regions, and associated devices and s...

Chip-middle type fan-out panel-level package and packaging method t...

Fast search for leaky word line

Mold compound dispensing system and method

Techniques for positioning bond pads of microelectronic devices and...

Storage system for enhancing data valid windows of signals

Preventing erase disturb in NAND

Board unit and semiconductor device

Reinforced semiconductor device packaging and associated systems an...

Semiconductor storage device with bonding electrodes

Semiconductor device having dolmen structure and manufacturing meth...

Die stack with cascade and vertical connections

Memory package, storage device including memory package, and storag...

Array of heat-sinked power semiconductors

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

SEMICONDUCTOR DEVICE

INTERFACE REGIONS, AND ASSOCIATED DEVICES AND SYSTEMS

SEMICONDUCTOR PACKAGE

APPARATUS INCLUDING SELECTABLE CIRCUIT PLACEMENT MECHANISM AND METH...

METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGES

PACKAGE STRUCTURES, FABRICATING METHODS THEREOF, AND MEMORY SYSTEMS

MULTI-DIE MEMORY DEVICE

THERMALLY CONDUCTIVE SPACER

PACKAGED MEMORY DEVICE WITH OVERHANG SUPPORT STRUCTURE

Semiconductor Device Package with Die Stackup and Connection Platform

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

TECHNIQUES FOR POSITIONING BOND PADS OF MICROELECTRONIC DEVICES AND...

SEMICONDUCTOR DEVICE HAVING DOLMEN STRUCTURE AND MANUFACTURING METH...

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

SEMICONDUCTOR DEVICE AND DATA STORAGE SYSTEM INCLUDING SEMICONDUCTO...

PACKAGED INTEGRATED CIRCUIT DEVICES WITH ENHANCED DAM STRUCTURES TH...

INTEGRATED DEVICE COMPRISING AN OFFSET INTERCONNECT

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

ARRAY OF HEAT-SINKED POWER SEMICONDUCTORS

STACK PACKAGES

SEMICONDUCTOR PACKAGE STRUCTURE, FABRICATION METHOD AND MEMORY SYSTEM

SEMICONDUCTOR DEVICE

INTRA-PACKAGE MEMORY DIE COMMUNICATION STRUCTURES

SEMICONDUCTOR PACKAGE INCLUDING GLASS CORE SUBSTRATE AND METHOD OF...

ADSORPTION DEVICE FOR REFLOW PROCESS AND METHOD OF ATTACHING CONNEC...

SEMICONDUCTOR STORAGE DEVICE

SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE,...