at least one device in the stack being rotated or offset

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CPC
H01L2225/06562

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2225/00Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups

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H01L2225/06562at least one device in the stack being rotated or offset

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package comprising semiconductor chip with stepped po...
- Patent number 12,362,318
- Issue date Jul 15, 2025
- Samsung Electronics Co., Ltd.
- Seunghyun Baik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser ablation-based surface property modification and contaminatio...
- Patent number 12,362,340
- Issue date Jul 15, 2025
- Intel Corporation
- Denis Myasishchev
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cross stack bridge bonding devices and associated methods
- Patent number 12,362,319
- Issue date Jul 15, 2025
- Micron Technology, Inc.
- Seng Kim Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 12,354,999
- Issue date Jul 8, 2025
- Kioxia Corporation
- Masayuki Miura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-role semiconductor device substrates, semiconductor device as...
- Patent number 12,354,939
- Issue date Jul 8, 2025
- Micron Technology, Inc.
- Hong Wan Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer with step feature
- Patent number 12,347,784
- Issue date Jul 1, 2025
- SK Hynix NAND Product Solutions Corp.
- Florence Pon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stage based frequency optimization for area reduction of charge pumps
- Patent number 12,348,132
- Issue date Jul 1, 2025
- SanDisk Technologies, Inc.
- V. S. N. K. Chaitanya G
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor device package die stacking system and method
- Patent number 12,347,810
- Issue date Jul 1, 2025
- Western Digital Technologies, Inc.
- Yazhou Zhang
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor apparatus with an alignment moat
- Patent number 12,347,713
- Issue date Jul 1, 2025
- Micron Technology, Inc.
- Andrew D. Carswell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,347,808
- Issue date Jul 1, 2025
- Kioxia Corporation
- Yasuo Otsuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and substrate for semiconductor package
- Patent number 12,347,759
- Issue date Jul 1, 2025
- Samsung Electronics Co., Ltd.
- Jin Mo Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a bonding wire in a hole in the substrate
- Patent number 12,341,123
- Issue date Jun 24, 2025
- NANYA TECHNOLOGY CORPORATION
- Wu-Der Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,341,131
- Issue date Jun 24, 2025
- Samsung Electronics Co., Ltd.
- Hyunmog Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device including resin layers
- Patent number 12,341,024
- Issue date Jun 24, 2025
- Kioxia Corporation
- Eiji Takano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor dies for semiconductor device assemblies
- Patent number 12,341,128
- Issue date Jun 24, 2025
- Micron Technology, Inc.
- Jungbae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having chip stack
- Patent number 12,327,821
- Issue date Jun 10, 2025
- Samsung Electronics Co., Ltd.
- Won-young Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and manufacturing method thereof
- Patent number 12,322,705
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chuei-Tang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor storage device including staggered semiconductor memo...
- Patent number 12,324,102
- Issue date Jun 3, 2025
- SanDisk Technologies, Inc.
- Fu Xing Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,308,345
- Issue date May 20, 2025
- Samsung Electronics Co., Ltd.
- Seokgeun Ahn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device and electronic system including the same
- Patent number 12,302,576
- Issue date May 13, 2025
- Samsung Electronics Co., Ltd.
- Jeeyong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including differential height PCB
- Patent number 12,300,557
- Issue date May 13, 2025
- SanDisk Technologies, Inc.
- Nandha Kumar Mohanraj
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,300,668
- Issue date May 13, 2025
- Samsung Electronics Co., Ltd.
- Raehyung Do
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including shielding cover that covers molded...
- Patent number 12,293,977
- Issue date May 6, 2025
- Samsung Electronics Co., Ltd.
- Young-Woo Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor assemblies with systems and methods for managing high...
- Patent number 12,293,992
- Issue date May 6, 2025
- Micron Technology, Inc.
- Kelvin Tan Aik Boo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages
- Patent number 12,288,752
- Issue date Apr 29, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Non-volatile memory with sub-planes having individually biasable so...
- Patent number 12,288,586
- Issue date Apr 29, 2025
- SanDisk Technologies, Inc.
- Ramy Nashed Bassely Said
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Memory device interface and method
- Patent number 12,277,056
- Issue date Apr 15, 2025
- Micron Technology, Inc.
- Brent Keeth
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Stacking structure, package structure and method of fabricating the...
- Patent number 12,272,674
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,272,652
- Issue date Apr 8, 2025
- Samsung Electronics Co., Ltd.
- Jiwon Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wafer configured for single touch-down testing
- Patent number 12,270,853
- Issue date Apr 8, 2025
- SanDisk Technologies, Inc.
- Toru Miwa
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250233093
- Publication date Jul 17, 2025
- Samsung Electronics Co., Ltd.
- Jungmin Seo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20250218968
- Publication date Jul 3, 2025
- Samsung Electronics Co., Ltd.
- Buwon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MAKING THE SAME
- Publication number 20250219001
- Publication date Jul 3, 2025
- STATS ChipPAC Pte Ltd.
- JongTae KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE ATTACH FILM AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20250210448
- Publication date Jun 26, 2025
- Samsung Electronics Co., Ltd.
- Myoungchul Eum
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250210533
- Publication date Jun 26, 2025
- Samsung Electronics Co., Ltd.
- JIWON SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250210580
- Publication date Jun 26, 2025
- Samsung Electronics Co., Ltd.
- Hee Woo AN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ASIC INTEGRATED MEMS DEVICE WITH EXPOSED BOND PADS FROM BOTTOM ATTA...
- Publication number 20250210590
- Publication date Jun 26, 2025
- SD Optics, Inc.
- KYUNG PYO HONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250210589
- Publication date Jun 26, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzuan-Horng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250210592
- Publication date Jun 26, 2025
- KIOXIA Corporation
- Yasuo TAKEMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250210570
- Publication date Jun 26, 2025
- Samsung Electronics Co., Ltd.
- Hakmin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE INCLUDING THE SEMICONDU...
- Publication number 20250201744
- Publication date Jun 19, 2025
- Samsung Electronics Co., Ltd.
- Seokcheon BAEK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250201755
- Publication date Jun 19, 2025
- Samsung Electronics Co., Ltd.
- Kihong Jeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH STACK BRIDGE BONDING DEVICES AND ASSOCIATED METHODS
- Publication number 20250192102
- Publication date Jun 12, 2025
- Micron Technology, Inc.
- Chin Hui Chong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED DIE PACKAGE INCLUDING A MULTI-CONTACT INTERCONNECT
- Publication number 20250192111
- Publication date Jun 12, 2025
- STMicroelectronics Pte Ltd
- Jing-En LUAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STANDBY EXIT FOR MEMORY DIE STACK
- Publication number 20250191620
- Publication date Jun 12, 2025
- Micron Technology, Inc.
- Hari Giduturi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP WITH DUAL CHIP-PAD STRUCTURE AND SEMICONDUCTOR P...
- Publication number 20250192035
- Publication date Jun 12, 2025
- Samsung Electronics Co., Ltd.
- Keunyoung LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250192094
- Publication date Jun 12, 2025
- Samsung Electronics Co., Ltd.
- Wonil Seo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BYPASS CHIPLETS FOR MEMORY-LOGIC STACK
- Publication number 20250183229
- Publication date Jun 5, 2025
- ADVANCED MICRO DEVICES, INC.
- Gabriel LOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACK CHIP PACKAGE
- Publication number 20250183238
- Publication date Jun 5, 2025
- SK HYNIX INC.
- Dong Sop LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250183147
- Publication date Jun 5, 2025
- Samsung Electronics Co., Ltd.
- Hongjin KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-DENSITY SEMICONDUCTOR CHIP PACKAGE
- Publication number 20250183227
- Publication date Jun 5, 2025
- Micron Technology, Inc.
- Kelvin Aik Boo TAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250174556
- Publication date May 29, 2025
- Samsung Electronics Co., Ltd.
- Jitaek OH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STORAGE DEVICE HAVING BUFFER CHIP INCLUDING INPUT/OUTPUT MACROS
- Publication number 20250174598
- Publication date May 29, 2025
- SK HYNIX INC.
- Min Soon HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250174600
- Publication date May 29, 2025
- Samsung Electronics Co., Ltd.
- Donghoon WON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250174603
- Publication date May 29, 2025
- KIOXIA Corporation
- Akihito SAWANOBORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250174617
- Publication date May 29, 2025
- Samsung Electronics Co., Ltd.
- Junbyeong LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME
- Publication number 20250167115
- Publication date May 22, 2025
- Samsung Electronics Co., Ltd.
- Jimo GU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Edge structure of semiconductor wafer and manufacturing method thereof
- Publication number 20250166997
- Publication date May 22, 2025
- UNITED MICROELECTRONICS CORP.
- Yu-Ping Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked Semiconductor Device Assembly in Computer System
- Publication number 20250165420
- Publication date May 22, 2025
- Rambus Inc.
- Scott C. Best
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250167134
- Publication date May 22, 2025
- Samsung Electronics Co., Ltd.
- Huishu MA
- H01 - BASIC ELECTRIC ELEMENTS

at least one device in the stack being rotated or offset

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor package comprising semiconductor chip with stepped po...

Laser ablation-based surface property modification and contaminatio...

Cross stack bridge bonding devices and associated methods

Semiconductor device and method of manufacturing the same

Multi-role semiconductor device substrates, semiconductor device as...

Interposer with step feature

Stage based frequency optimization for area reduction of charge pumps

Semiconductor device package die stacking system and method

Semiconductor apparatus with an alignment moat

Semiconductor device

Semiconductor package and substrate for semiconductor package

Semiconductor device having a bonding wire in a hole in the substrate

Semiconductor package

Method for manufacturing semiconductor device including resin layers

Stacked semiconductor dies for semiconductor device assemblies

Semiconductor package having chip stack

Chip package and manufacturing method thereof

Semiconductor storage device including staggered semiconductor memo...

Semiconductor package

Integrated circuit device and electronic system including the same

Semiconductor device including differential height PCB

Semiconductor package

Semiconductor package including shielding cover that covers molded...

Semiconductor assemblies with systems and methods for managing high...

Semiconductor packages

Non-volatile memory with sub-planes having individually biasable so...

Memory device interface and method

Stacking structure, package structure and method of fabricating the...

Semiconductor package

Semiconductor wafer configured for single touch-down testing

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE

PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD FOR MAKING THE SAME

DIE ATTACH FILM AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

ASIC INTEGRATED MEMS DEVICE WITH EXPOSED BOND PADS FROM BOTTOM ATTA...

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE INCLUDING THE SEMICONDU...

SEMICONDUCTOR PACKAGE

THROUGH STACK BRIDGE BONDING DEVICES AND ASSOCIATED METHODS

STACKED DIE PACKAGE INCLUDING A MULTI-CONTACT INTERCONNECT

STANDBY EXIT FOR MEMORY DIE STACK

SEMICONDUCTOR CHIP WITH DUAL CHIP-PAD STRUCTURE AND SEMICONDUCTOR P...

SEMICONDUCTOR PACKAGE

BYPASS CHIPLETS FOR MEMORY-LOGIC STACK

STACK CHIP PACKAGE

SEMICONDUCTOR PACKAGE

HIGH-DENSITY SEMICONDUCTOR CHIP PACKAGE

SEMICONDUCTOR PACKAGE

STORAGE DEVICE HAVING BUFFER CHIP INCLUDING INPUT/OUTPUT MACROS

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME

Edge structure of semiconductor wafer and manufacturing method thereof

Stacked Semiconductor Device Assembly in Computer System

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME