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Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
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CPC
H01L2225/00
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Parent Industries
H
ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
Current Industry
H01L2225/00
Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
Sub Industries
H01L2225/03
All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00
H01L2225/04
the devices not having separate containers
H01L2225/065
the devices being of a type provided for in group H01L27/00
H01L2225/06503
Stacked arrangements of devices
H01L2225/06506
Wire or wire-like electrical connections between devices
H01L2225/0651
Wire or wire-like electrical connections from device to substrate
H01L2225/06513
Bump or bump-like direct electrical connections between devices
H01L2225/06517
Bump or bump-like direct electrical connections from device to substrate
H01L2225/0652
Bump or bump-like direct electrical connections from substrate to substrate
H01L2225/06524
Electrical connections formed on device or on substrate
H01L2225/06527
Special adaptation of electrical connections
H01L2225/06531
Non-galvanic coupling
H01L2225/06534
Optical coupling
H01L2225/06537
Electromagnetic shielding
H01L2225/06541
Conductive via connections through the device
H01L2225/06544
Design considerations for via connections
H01L2225/06548
Conductive via connections through the substrate, container, or encapsulation
H01L2225/06551
Conductive connections on the side of the device
H01L2225/06555
Geometry of the stack
H01L2225/06558
the devices having passive surfaces facing each other
H01L2225/06562
at least one device in the stack being rotated or offset
H01L2225/06565
the devices having the same size and there being no auxiliary carrier between the devices
H01L2225/06568
the devices decreasing in size
H01L2225/06572
Auxiliary carrier between devices, the carrier having an electrical connection structure
H01L2225/06575
Auxiliary carrier between devices, the carrier having no electrical connection structure
H01L2225/06579
TAB carriers beam leads
H01L2225/06582
Housing for the assembly
H01L2225/06586
Housing with external bump or bump-like connectors
H01L2225/06589
Thermal management
H01L2225/06593
Mounting aids permanently on device arrangements for alignment
H01L2225/06596
Structural arrangements for testing
H01L2225/10
the devices having separate containers
H01L2225/1005
the devices being of a type provided for in group H01L27/00
H01L2225/1011
the containers being in a stacked arrangement
H01L2225/1017
the lowermost container comprising a device support
H01L2225/1023
the support being an insulating substrate
H01L2225/1029
the support being a lead frame
H01L2225/1035
the device being entirely enclosed by the support
H01L2225/1041
Special adaptations for top connections of the lowermost container
H01L2225/1047
Details of electrical connections between containers
H01L2225/1052
Wire or wire-like electrical connections
H01L2225/1058
Bump or bump-like electrical connections
H01L2225/1064
Electrical connections provided on a side surface of one or more of the containers
H01L2225/107
Indirect electrical connections
H01L2225/1076
Shape of the containers
H01L2225/1082
for improving alignment between containers
H01L2225/1088
Arrangements to limit the height of the assembly
H01L2225/1094
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