at least one of the workpieces being of silicium

Industry

CPC
B23K2035/008

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Parent Industries

BPERFORMING OPERATIONS TRANSPORTING B23Machine tools B23KSOLDERING OR UNSOLDERING WELDING CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY

Current Industry

B23K2035/008at least one of the workpieces being of silicium

Industries

Patents Grantslast 30 patents

Information Patent Grant
Transfer substrate for forming metal wiring and method for forming...
- Patent number 10,256,113
- Issue date Apr 9, 2019
- Tanaka Kikinzoku Kogyo K.K.
- Toshinori Ogashiwa
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Braze-based protective coating for silicon nitride
- Patent number 7,115,319
- Issue date Oct 3, 2006
- Honeywell International, Inc.
- Derek Raybould
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for the production of a holding device for semiconductor di...
- Patent number 6,276,592
- Issue date Aug 21, 2001
- Sico Jena GmbH Quarzschmelze
- Peter Jochmann
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor body with layer of solder material comprising chromium
- Patent number 6,268,659
- Issue date Jul 31, 2001
- Infineon Technologies AG
- Holger Huebner
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flip-Chip interconnections using lead-free solders
- Patent number 6,224,690
- Issue date May 1, 2001
- International Business Machines Corporation
- Panayotis Constantinou Andricacos
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of joining silicon nitride to carbon steel
- Patent number 6,170,734
- Issue date Jan 9, 2001
- Korea Research Institute of Chemical Technology
- Jae Do Lee
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of making cathode targets comprising silicon
- Patent number 5,965,278
- Issue date Oct 12, 1999
- PPG Industries Ohio, Inc.
- James J. Finley
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor electrical heater and method for making same
- Patent number 5,659,656
- Issue date Aug 19, 1997
- Philip Morris Incorporated
- Amitabh Das
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding scheme using group VB metallic layer
- Patent number 5,622,305
- Issue date Apr 22, 1997
- Lucent Technologies Inc.
- Donald D. Bacon
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor electrical heater and method for making same
- Patent number 5,498,850
- Issue date Mar 12, 1996
- Philip Morris Incorporated
- Amitabh Das
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Low temperature reactive bonding
- Patent number 5,381,944
- Issue date Jan 17, 1995
- The Regents of the University of California
- Daniel M. Makowiecki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder joint
- Patent number 5,380,598
- Issue date Jan 10, 1995
- Westinghouse Brake & Signal Holdings Ltd.
- Carlo Ferrando
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Permanent metallic bonding method
- Patent number 5,234,153
- Issue date Aug 10, 1993
- AT&T Bell Laboratories
- Donlad D. Bacon
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods of joining components
- Patent number 5,106,009
- Issue date Apr 21, 1992
- Marconi Electronic Devices Limited
- Giles Humpston
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device
- Patent number 4,954,870
- Issue date Sep 4, 1990
- Kabushiki Kaisha Toshiba
- Momoko Takemura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Brazing material
- Patent number 4,921,158
- Issue date May 1, 1990
- General Instrument Corporation
- Kuen-Shyang Hwang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of jointing titanium aluminide structures
- Patent number 4,869,421
- Issue date Sep 26, 1989
- Rohr Industries, Inc.
- Brian Norris
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for bonding die to substrate using a gold/silicon seed
- Patent number 4,810,671
- Issue date Mar 7, 1989
- Intel Corporation
- Bidyut K. Bhattacharyya
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process of attaching a die to a substrate using gold/silicon seed
- Patent number 4,771,018
- Issue date Sep 13, 1988
- Intel Corporation
- Bidyut K. Bhattacharyya
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Low stress heat sinking for semiconductors
- Patent number 4,757,934
- Issue date Jul 19, 1988
- Motorola, Inc.
- Bernard Greenstein
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Gold metallization process
- Patent number 4,702,941
- Issue date Oct 27, 1987
- Motorola Inc.
- Curtis W. Mitchell
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metallization process of a wafer back
- Patent number 4,517,226
- Issue date May 14, 1985
- SGS-ATES Componenti Elettronici S.p.A.
- Livio Baldi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and device for attaching disc-or plate-shaped target bodies...
- Patent number 4,476,151
- Issue date Oct 9, 1984
- Siemens Aktiengesellschaft
- Hartmut Keller
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming a solder interconnection capable of sustained hig...
- Patent number 4,360,142
- Issue date Nov 23, 1982
- International Business Machines Corporation
- Charles Carpenter
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for attaching disc- or plate-shaped targets to cooling plate...
- Patent number 4,341,816
- Issue date Jul 27, 1982
- Siemens Aktiengesellschaft
- Richard Lauterbach
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Improved solder interconnection between a semiconductor device and...
- Patent number 4,290,079
- Issue date Sep 15, 1981
- International Business Machines Corporation
- Charles Carpenter
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for low temperature bonding of silicon and silicon on sapphi...
- Patent number 4,278,195
- Issue date Jul 14, 1981
- Honeywell Inc.
- Gurnam Singh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lead bonding method
- Patent number 4,098,452
- Issue date Jul 4, 1978
- General Electric Company
- Harold F. Webster
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metallization system for semiconductive devices, devices utilizing...
- Patent number 4,077,045
- Issue date Feb 28, 1978
- Motorola, Inc.
- Richard L. Greeson
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of making gold-cobalt contact for silicon devices
- Patent number 4,065,588
- Issue date Dec 27, 1977
- RCA Corporation
- Anthony Francis Arnold
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR PERMANENTLY BONDING WAFERS BY A CONNECTING LAYER BY MEAN...
- Publication number 20140154867
- Publication date Jun 5, 2014
- EV Group E. Thallner GmbH
- Klaus Martinschitz
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Braze-based protective coating for silicon nitride
- Publication number 20050079343
- Publication date Apr 14, 2005
- Honeywell International Inc.
- Derek Raybould
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

at least one of the workpieces being of silicium

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Transfer substrate for forming metal wiring and method for forming...

Braze-based protective coating for silicon nitride

Process for the production of a holding device for semiconductor di...

Semiconductor body with layer of solder material comprising chromium

Flip-Chip interconnections using lead-free solders

Method of joining silicon nitride to carbon steel

Method of making cathode targets comprising silicon

Semiconductor electrical heater and method for making same

Bonding scheme using group VB metallic layer

Semiconductor electrical heater and method for making same

Low temperature reactive bonding

Solder joint

Permanent metallic bonding method

Methods of joining components

Semiconductor device

Brazing material

Method of jointing titanium aluminide structures

Process for bonding die to substrate using a gold/silicon seed

Process of attaching a die to a substrate using gold/silicon seed

Low stress heat sinking for semiconductors

Gold metallization process

Metallization process of a wafer back

Method and device for attaching disc-or plate-shaped target bodies...

Method of forming a solder interconnection capable of sustained hig...

Method for attaching disc- or plate-shaped targets to cooling plate...

Improved solder interconnection between a semiconductor device and...

Method for low temperature bonding of silicon and silicon on sapphi...

Lead bonding method

Metallization system for semiconductive devices, devices utilizing...

Method of making gold-cobalt contact for silicon devices

Patents Applicationslast 30 patents

METHOD FOR PERMANENTLY BONDING WAFERS BY A CONNECTING LAYER BY MEAN...

Braze-based protective coating for silicon nitride