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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

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H01L2924/10157at the active surface

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Patents Grantslast 30 patents

Information Patent Grant
Encapsulated light emitting diodes for selective fluidic assembly
- Patent number 12,119,432
- Issue date Oct 15, 2024
- eLux, Inc.
- Kenji Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure of micro light-emitting device and method of transferring...
- Patent number 12,113,150
- Issue date Oct 8, 2024
- Korea University Research and Business Foundation
- In Hwan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming protective layer around...
- Patent number 11,804,416
- Issue date Oct 31, 2023
- UTAC HEADQUARTERS PTE. LTD.
- Saravuth Sirinorakul
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Elastic wave device
- Patent number 11,764,752
- Issue date Sep 19, 2023
- Murata Manufacturing Co., Ltd.
- Masatoshi Nakagawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and method of manufacturing the same
- Patent number 11,694,990
- Issue date Jul 4, 2023
- Samsung Display Co., Ltd.
- Chan-Jae Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming embedded wafer level chi...
- Patent number 11,488,933
- Issue date Nov 1, 2022
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and method of manufacturing the same
- Patent number 11,410,967
- Issue date Aug 9, 2022
- Samsung Display Co., Ltd.
- Chan-Jae Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die singulation and structures formed thereby
- Patent number 11,367,658
- Issue date Jun 21, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Fu-Chen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic circuit connection method and electronic circuit
- Patent number 11,270,968
- Issue date Mar 8, 2022
- National Institute of Advanced Industrial Science and Technology
- Masaru Hashino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Terminal structure of a power semiconductor device
- Patent number 11,239,188
- Issue date Feb 1, 2022
- Infineon Technologies AG
- Markus Zundel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Negative fillet for mounting an integrated device die to a carrier
- Patent number 11,056,455
- Issue date Jul 6, 2021
- Analog Devices, Inc.
- Vikram Venkatadri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for transferring and placing a semiconductor device on a sub...
- Patent number 10,910,342
- Issue date Feb 2, 2021
- Imec VZW
- Maria Op de Beeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Encapsulated emissive element for fluidic assembly
- Patent number 10,777,714
- Issue date Sep 15, 2020
- eLux Inc.
- Kenji Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming embedded wafer level chi...
- Patent number 10,777,528
- Issue date Sep 15, 2020
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light-emitting diode and application therefor
- Patent number 10,749,080
- Issue date Aug 18, 2020
- Seoul Viosys Co., Ltd.
- Jong Hyeon Chae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for encapsulating emissive elements for fluidic assembly
- Patent number 10,749,083
- Issue date Aug 18, 2020
- eLux Inc.
- Kenji Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die singulation and structures formed thereby
- Patent number 10,720,360
- Issue date Jul 21, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Fu-Chen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages having an electric device with a recess
- Patent number 10,658,238
- Issue date May 19, 2020
- STMicroelectronics Pte Ltd
- Kim-Yong Goh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Encapsulated fluid assembly emissive elements
- Patent number 10,516,084
- Issue date Dec 24, 2019
- eLux, Inc.
- Kenji Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die singulation and structures formed thereby
- Patent number 10,510,605
- Issue date Dec 17, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Fu-Chen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-frequency circuit
- Patent number 10,290,603
- Issue date May 14, 2019
- Mitsubishi Electric Corporation
- Shin Chaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device that transfers an electric signal with a set o...
- Patent number 10,249,565
- Issue date Apr 2, 2019
- Renesas Electronics Corporation
- Yuichi Miyagawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Deformable closed-loop multi-layered microelectronic device
- Patent number 10,170,449
- Issue date Jan 1, 2019
- International Business Machines Corporation
- Bucknell C. Webb
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Housing for an infrared radiation micro device and method for fabri...
- Patent number 10,002,896
- Issue date Jun 19, 2018
- Fraunhofer-Gesellschaft zur Foerderung der angewandten Forschung e.V.
- Wolfgang Reinert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a transistor with an active area layout having bo...
- Patent number 9,899,364
- Issue date Feb 20, 2018
- Texas Instruments Incorporated
- James Walter Blatchford
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages having an electric device with a recess
- Patent number 9,824,924
- Issue date Nov 21, 2017
- STMicroelectronics Pte Ltd
- Kim-Yong Goh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device assembly including a chip carrier, semiconduct...
- Patent number 9,768,120
- Issue date Sep 19, 2017
- Infineon Technologies Austria AG
- Philipp Seng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming embedded wafer level chi...
- Patent number 9,704,824
- Issue date Jul 11, 2017
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming insulating layer dispose...
- Patent number 9,666,500
- Issue date May 30, 2017
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and method for forming the same
- Patent number 9,640,488
- Issue date May 2, 2017
- Xintec Inc.
- Yi-Min Lin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT PACKAGES AND METHODS
- Publication number 20240234210
- Publication date Jul 11, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jen-Chun Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240063160
- Publication date Feb 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hsin Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE, ELECTRONIC DEVICE, AND MANUFACTURE METHOD...
- Publication number 20230163043
- Publication date May 25, 2023
- Huawei Technologies Co., Ltd
- Ran HE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Embedded Wafer Level Chi...
- Publication number 20230012958
- Publication date Jan 19, 2023
- STATS ChipPAC Pte Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20220328451
- Publication date Oct 13, 2022
- SAMSUNG DISPLAY CO., LTD.
- Chan-Jae Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE OF MICRO LIGHT-EMITTING DEVICE AND METHOD OF TRANSFERRING...
- Publication number 20220149236
- Publication date May 12, 2022
- Korea University Research and Business Foundation
- In Hwan LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Protective Layer Around...
- Publication number 20220077019
- Publication date Mar 10, 2022
- UTAC Headquarters Pte. Ltd.
- Saravuth Sirinorakul
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC CIRCUIT CONNECTION METHOD AND ELECTRONIC CIRCUIT
- Publication number 20210249374
- Publication date Aug 12, 2021
- NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY
- Masaru HASHINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20210043600
- Publication date Feb 11, 2021
- SAMSUNG DISPLAY CO., LTD.
- Chan-Jae Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and Structure for Supporting Thin Semiconductor Chips with a...
- Publication number 20200395334
- Publication date Dec 17, 2020
- INFINEON TECHNOLOGIES AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Die Singulation and Structures Formed Thereby
- Publication number 20200350209
- Publication date Nov 5, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Fu-Chen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Embedded Wafer Level Chi...
- Publication number 20200335478
- Publication date Oct 22, 2020
- STATS ChipPAC Pte Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT-EMITTING DIODE AND APPLICATION THEREFOR
- Publication number 20200098949
- Publication date Mar 26, 2020
- Seoul Viosys Co., Ltd.
- Jong Hyeon Chae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NEGATIVE FILLET FOR MOUNTING AN INTEGRATED DEVICE DIE TO A CARRIER
- Publication number 20190043823
- Publication date Feb 7, 2019
- Analog Devices, Inc.
- Vikram Venkatadri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEFORMABLE CLOSED-LOOP MULTI-LAYERED MICROELECTRONIC DEVICE
- Publication number 20180323171
- Publication date Nov 8, 2018
- International Business Machines Corporation
- Bucknell C. Webb
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Embedded Wafer Level Chi...
- Publication number 20170271305
- Publication date Sep 21, 2017
- STATS ChipPAC Pte Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES HAVING AN ELECTRIC DEVICE WITH A RECESS
- Publication number 20140291812
- Publication date Oct 2, 2014
- STMicroelectronics Pte Ltd
- Kim-Yong Goh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CHIP PACKAGE AND METHOD FOR FORMING THE SAME
- Publication number 20140264785
- Publication date Sep 18, 2014
- Xintec Inc.
- Yi-Min LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT AND ELECTRONIC COMPONENT COOLING METHOD
- Publication number 20140254099
- Publication date Sep 11, 2014
- NEC Corporation
- TSUTOMU TAKEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Insulating Layer Dispose...
- Publication number 20140246779
- Publication date Sep 4, 2014
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PREPARING SEMICONDUCTOR DEVICES APPLIED IN FLIP CHIP TEC...
- Publication number 20140242756
- Publication date Aug 28, 2014
- ALPHA & OMEGA SEMICONDUCTOR INCORPORATED
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME
- Publication number 20140225230
- Publication date Aug 14, 2014
- Samsung Electronics Co., Ltd.
- WOOJAE KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Embedded Wafer Level Chi...
- Publication number 20140183761
- Publication date Jul 3, 2014
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Assembly Including a Chip Carrier, Semiconduct...
- Publication number 20140138833
- Publication date May 22, 2014
- Infineon Technologies Austria AG
- Philipp Seng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENCAPSULATING SHEET-COVERED SEMICONDUCTOR ELEMENT, PRODUCING METHOD...
- Publication number 20140091348
- Publication date Apr 3, 2014
- Nitto Denko Corporation
- Hiroyuki KATAYAMA
- B32 - LAYERED PRODUCTS
Information Patent Application
FLIP CHIP PACKAGE WITH SHELF AND METHOD OF MANUFACTURING THEREOF
- Publication number 20130277834
- Publication date Oct 24, 2013
- Naomi MASUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENTS ASSEMBLY
- Publication number 20130265729
- Publication date Oct 10, 2013
- PANASONIC CORPORATION
- Hiromitsu TAKASHITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20130221530
- Publication date Aug 29, 2013
- Rohm Co., Ltd.
- Osamu Miyata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Processes and structures for IC fabrication
- Publication number 20130193561
- Publication date Aug 1, 2013
- TEREPAC CORPORATION
- Jayna Sheats
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Insulating Layer Dispose...
- Publication number 20130175696
- Publication date Jul 11, 2013
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS

at the active surface

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Encapsulated light emitting diodes for selective fluidic assembly

Structure of micro light-emitting device and method of transferring...

Semiconductor device and method of forming protective layer around...

Elastic wave device

Display device and method of manufacturing the same

Semiconductor device and method of forming embedded wafer level chi...

Display device and method of manufacturing the same

Semiconductor die singulation and structures formed thereby

Electronic circuit connection method and electronic circuit

Terminal structure of a power semiconductor device

Negative fillet for mounting an integrated device die to a carrier

Method for transferring and placing a semiconductor device on a sub...

Encapsulated emissive element for fluidic assembly

Semiconductor device and method of forming embedded wafer level chi...

Light-emitting diode and application therefor

Method for encapsulating emissive elements for fluidic assembly

Semiconductor die singulation and structures formed thereby

Semiconductor packages having an electric device with a recess

Encapsulated fluid assembly emissive elements

Semiconductor die singulation and structures formed thereby

High-frequency circuit

Semiconductor device that transfers an electric signal with a set o...

Deformable closed-loop multi-layered microelectronic device

Housing for an infrared radiation micro device and method for fabri...

Method of forming a transistor with an active area layout having bo...

Semiconductor packages having an electric device with a recess

Semiconductor device assembly including a chip carrier, semiconduct...

Semiconductor device and method of forming embedded wafer level chi...

Semiconductor device and method of forming insulating layer dispose...

Chip package and method for forming the same

Patents Applicationslast 30 patents

INTEGRATED CIRCUIT PACKAGES AND METHODS

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR STRUCTURE, ELECTRONIC DEVICE, AND MANUFACTURE METHOD...

Semiconductor Device and Method of Forming Embedded Wafer Level Chi...

DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME

STRUCTURE OF MICRO LIGHT-EMITTING DEVICE AND METHOD OF TRANSFERRING...

Semiconductor Device and Method of Forming Protective Layer Around...

ELECTRONIC CIRCUIT CONNECTION METHOD AND ELECTRONIC CIRCUIT

DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME

Method and Structure for Supporting Thin Semiconductor Chips with a...

Semiconductor Die Singulation and Structures Formed Thereby

Semiconductor Device and Method of Forming Embedded Wafer Level Chi...

LIGHT-EMITTING DIODE AND APPLICATION THEREFOR

NEGATIVE FILLET FOR MOUNTING AN INTEGRATED DEVICE DIE TO A CARRIER

DEFORMABLE CLOSED-LOOP MULTI-LAYERED MICROELECTRONIC DEVICE

Semiconductor Device and Method of Forming Embedded Wafer Level Chi...

SEMICONDUCTOR PACKAGES HAVING AN ELECTRIC DEVICE WITH A RECESS

CHIP PACKAGE AND METHOD FOR FORMING THE SAME

ELECTRONIC COMPONENT AND ELECTRONIC COMPONENT COOLING METHOD

Semiconductor Device and Method of Forming Insulating Layer Dispose...

METHOD FOR PREPARING SEMICONDUCTOR DEVICES APPLIED IN FLIP CHIP TEC...

SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME

Semiconductor Device and Method of Forming Embedded Wafer Level Chi...

Semiconductor Device Assembly Including a Chip Carrier, Semiconduct...

ENCAPSULATING SHEET-COVERED SEMICONDUCTOR ELEMENT, PRODUCING METHOD...

FLIP CHIP PACKAGE WITH SHELF AND METHOD OF MANUFACTURING THEREOF

ELECTRONIC COMPONENTS ASSEMBLY

SEMICONDUCTOR DEVICE

Processes and structures for IC fabrication

Semiconductor Device and Method of Forming Insulating Layer Dispose...