at the bonding interface of the layer connector

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H01L2224/29553

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/29553at the bonding interface of the layer connector

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Patents Grantslast 30 patents

Information Patent Grant
Metallic interconnect, a method of manufacturing a metallic interco...
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- Issue date Aug 4, 2020
- Infineon Technologies AG
- Irmgard Escher-Poeppel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for forming contacts on an integrated circuit...
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- Issue date Jun 16, 2020
- CATLAM LLC
- Kenneth S. Bahl
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Information Patent Grant
Integrated circuit wafer integration with catalytic laminate or adh...
- Patent number 9,922,951
- Issue date Mar 20, 2018
- Sierra Circuits, Inc.
- Kenneth S. Bahl
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MULTI-LAYER SHEET FOR MOLD UNDERFILL ENCAPSULATION, METHOD FOR MOLD...
- Publication number 20220310546
- Publication date Sep 29, 2022
- NAGASE CHEMTEX CORPORATION
- Daisuke MORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metallic Interconnect, a Method of Manufacturing a Metallic Interco...
- Publication number 20190103378
- Publication date Apr 4, 2019
- INFINEON TECHNOLOGIES AG
- Irmgard Escher-Poeppel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and Apparatus for forming Contacts on an Integrated Circuit...
- Publication number 20180158793
- Publication date Jun 7, 2018
- SIERRA CIRCUITS, INC.
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