at the bonding interface

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H01L2224/40505

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/40505at the bonding interface

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Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 11,664,288
- Issue date May 30, 2023
- Mitsubishi Electric Corporation
- Kenta Nakahara
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method of manufacturing semiconductor device, semiconductor device,...
- Patent number 11,195,770
- Issue date Dec 7, 2021
- Mitsubishi Electric Corporation
- Kenta Nakahara
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method of manufacturing semiconductor device, semiconductor device,...
- Patent number 11,171,068
- Issue date Nov 9, 2021
- Mitsubishi Electric Corporation
- Kenta Nakahara
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230411338
- Publication date Dec 21, 2023
- Rohm Co., Ltd.
- Takukazu OTSUKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SEM...
- Publication number 20230245994
- Publication date Aug 3, 2023
- STMicroelectronics S.r.l
- Mauro MAZZOLA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE,...
- Publication number 20200168519
- Publication date May 28, 2020
- Mitsubishi Electric Corporation
- Kenta NAKAHARA
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER