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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/05091at the center of the internal layers

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor bonding structure
- Patent number 11,837,564
- Issue date Dec 5, 2023
- Powerchip Semiconductor Manufacturing Corporation
- Chun-Lin Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus including integrated pads and methods of manufacturing th...
- Patent number 11,824,025
- Issue date Nov 21, 2023
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 11,189,583
- Issue date Nov 30, 2021
- Taiwan Semiconductor Manufacturing Company Ltd.
- Sheng-Chau Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond pad structure for bonding improvement
- Patent number 11,158,591
- Issue date Oct 26, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Chan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of forming the same
- Patent number 11,004,812
- Issue date May 11, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tuan-Yu Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metallisation for semiconductor device
- Patent number 10,748,847
- Issue date Aug 18, 2020
- Nexperia B.V.
- Paul Huiskamp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond pad structure for bonding improvement
- Patent number 10,734,339
- Issue date Aug 4, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chia-Chan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out semiconductor package
- Patent number 10,714,440
- Issue date Jul 14, 2020
- Samsung Electronics Co., Ltd.
- Han Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 10,522,487
- Issue date Dec 31, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sheng-Chau Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out semiconductor package
- Patent number 10,403,588
- Issue date Sep 3, 2019
- Samsung Electronics Co., Ltd.
- Han Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sacrificial alignment ring and self-soldering vias for wafer bonding
- Patent number 10,381,330
- Issue date Aug 13, 2019
- Silicon Storage Technology, Inc.
- Justin Hiroki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond pad structure for bonding improvement
- Patent number 10,276,524
- Issue date Apr 30, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chia-Chan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of making a semiconductor device
- Patent number 9,947,632
- Issue date Apr 17, 2018
- Nexperia B.V.
- Chi Ho Leung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 9,786,619
- Issue date Oct 10, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sheng-Chau Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor arrangement and formation thereof
- Patent number 9,646,928
- Issue date May 9, 2017
- Taiwan Semiconductor Manufacturing Company Limited
- Jiun Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical connection structure
- Patent number 8,883,628
- Issue date Nov 11, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yao-Chun Chuang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Electrical connection structure
- Patent number 8,476,759
- Issue date Jul 2, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yao-Chun Chuang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
APPARATUS INCLUDING INTEGRATED PADS AND METHODS OF MANUFACTURING TH...
- Publication number 20240063156
- Publication date Feb 22, 2024
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Devices and Methods of Manufacture
- Publication number 20230317648
- Publication date Oct 5, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Yu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS INCLUDING INTEGRATED PADS AND METHODS OF MANUFACTURING TH...
- Publication number 20230056579
- Publication date Feb 23, 2023
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor bonding structure
- Publication number 20230018214
- Publication date Jan 19, 2023
- Powerchip Semiconductor Manufacturing Corporation
- Chun-Lin Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND PAD STRUCTURE FOR BONDING IMPROVEMENT
- Publication number 20200357762
- Publication date Nov 12, 2020
- Taiwan Semiconductor Manufacturing Co., LTD
- Chia-Chan CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20200144207
- Publication date May 7, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Sheng-Chau CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20200091097
- Publication date Mar 19, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tuan-Yu Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND PAD STRUCTURE FOR BONDING IMPROVEMENT
- Publication number 20190221534
- Publication date Jul 18, 2019
- Taiwan Semiconductor Manufacturing Co., LTD
- Chia-Chan CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT SEMICONDUCTOR PACKAGE
- Publication number 20180331054
- Publication date Nov 15, 2018
- Samsung Electro-Mechanics Co., Ltd.
- Han KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Sacrificial Alignment Ring And Self-Soldering Vias For Wafer Bonding
- Publication number 20180286836
- Publication date Oct 4, 2018
- Silicon Storage Technology, Inc.
- Justin Hiroki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT SEMICONDUCTOR PACKAGE
- Publication number 20180090458
- Publication date Mar 29, 2018
- Samsung Electro-Mechanics Co., Ltd.
- Han KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20180033749
- Publication date Feb 1, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sheng-Chau CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND PAD STRUCTURE FOR BONDING IMPROVEMENT
- Publication number 20170330848
- Publication date Nov 16, 2017
- Taiwan Semiconductor Manufacturing Co., LTD
- Chia-Chan CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20170194273
- Publication date Jul 6, 2017
- Taiwan Semiconductor Manufacturing company Ltd.
- SHENG-CHAU CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electrical Connection Structure
- Publication number 20130288473
- Publication date Oct 31, 2013
- Yao-Chun Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electrical Connection Structure
- Publication number 20130134563
- Publication date May 30, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yao-Chun Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20120199969
- Publication date Aug 9, 2012
- Kenji Yokoyama
- H01 - BASIC ELECTRIC ELEMENTS

at the center of the internal layers

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor bonding structure

Apparatus including integrated pads and methods of manufacturing th...

Semiconductor structure and manufacturing method thereof

Bond pad structure for bonding improvement

Package structure and method of forming the same

Metallisation for semiconductor device

Bond pad structure for bonding improvement

Fan-out semiconductor package

Semiconductor structure and manufacturing method thereof

Fan-out semiconductor package

Sacrificial alignment ring and self-soldering vias for wafer bonding

Bond pad structure for bonding improvement

Semiconductor device and method of making a semiconductor device

Semiconductor structure and manufacturing method thereof

Semiconductor arrangement and formation thereof

Electrical connection structure

Electrical connection structure

Patents Applicationslast 30 patents

APPARATUS INCLUDING INTEGRATED PADS AND METHODS OF MANUFACTURING TH...

Semiconductor Devices and Methods of Manufacture

APPARATUS INCLUDING INTEGRATED PADS AND METHODS OF MANUFACTURING TH...

Semiconductor bonding structure

BOND PAD STRUCTURE FOR BONDING IMPROVEMENT

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME

BOND PAD STRUCTURE FOR BONDING IMPROVEMENT

FAN-OUT SEMICONDUCTOR PACKAGE

Sacrificial Alignment Ring And Self-Soldering Vias For Wafer Bonding

FAN-OUT SEMICONDUCTOR PACKAGE

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

BOND PAD STRUCTURE FOR BONDING IMPROVEMENT

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

Electrical Connection Structure

Electrical Connection Structure

SEMICONDUCTOR DEVICE