at the periphery of the internal layers

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H01L2224/05095

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/05095at the periphery of the internal layers

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor chip with redundant thru-silicon-vias
- Patent number 12,094,853
- Issue date Sep 17, 2024
- Advanced Micro Devices, Inc.
- Bryan Black
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory
- Patent number 12,089,409
- Issue date Sep 10, 2024
- Kioxia Corporation
- Masayoshi Tagami
- G11 - INFORMATION STORAGE
Information Patent Grant
Bond pad layout including floating conductive sections
- Patent number 11,887,949
- Issue date Jan 30, 2024
- Macronix International Co., Ltd.
- Su-Chueh Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory
- Patent number 11,729,973
- Issue date Aug 15, 2023
- Kioxia Corporation
- Masayoshi Tagami
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor device with tilted insulating layers and method for f...
- Patent number 11,728,299
- Issue date Aug 15, 2023
- NANYA TECHNOLOGY CORPORATION
- Tse-Yao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip with redundant thru-silicon-vias
- Patent number 11,469,212
- Issue date Oct 11, 2022
- Advanced Micro Devices, Inc.
- Bryan Black
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with tilted insulating layers and method for f...
- Patent number 11,469,195
- Issue date Oct 11, 2022
- NANYA TECHNOLOGY CORPORATION
- Tse-Yao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding pad structure for memory device and method of manufacturing...
- Patent number 11,342,292
- Issue date May 24, 2022
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Chih Cheng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond pad structure for bonding improvement
- Patent number 11,158,591
- Issue date Oct 26, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Chan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level chip-size package with redistribution layer
- Patent number 10,998,267
- Issue date May 4, 2021
- Mediatek Inc.
- Yan-Liang Ji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory
- Patent number 10,950,630
- Issue date Mar 16, 2021
- TOSHIBA MEMORY CORPORATION
- Masayoshi Tagami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory
- Patent number 10,748,928
- Issue date Aug 18, 2020
- TOSHIBA MEMORY CORPORATION
- Masayoshi Tagami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond pad structure for bonding improvement
- Patent number 10,734,339
- Issue date Aug 4, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chia-Chan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Impedance matching circuit for RF devices and method therefor
- Patent number 10,707,180
- Issue date Jul 7, 2020
- NXP USA, INC.
- Ricardo Uscola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and ball bonder
- Patent number 10,497,662
- Issue date Dec 3, 2019
- ABLIC Inc.
- Tomomitsu Risaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond pad structure for bonding improvement
- Patent number 10,276,524
- Issue date Apr 30, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chia-Chan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device having pads structure formed thereon and...
- Patent number RE47171
- Issue date Dec 18, 2018
- Realtek Semiconductor Corporation
- Ying-Hsi Lin
Information Patent Grant
Waterproof structure of pad, waterproof pad, and method for forming...
- Patent number 10,069,236
- Issue date Sep 4, 2018
- Huawei Technologies Co., Ltd.
- Jun Wang
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Semiconductor device and manufacturing method of semiconductor device
- Patent number 10,024,907
- Issue date Jul 17, 2018
- TOSHIBA MEMORY CORPORATION
- Shinya Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device having pads structure formed thereon and...
- Patent number RE46784
- Issue date Apr 10, 2018
- Realtek Semiconductor Corporation
- Ying-Hsi Lin
Information Patent Grant
Integrated circuit device
- Patent number 9,881,892
- Issue date Jan 30, 2018
- Novatek Microelectronics Corp.
- Jung-Fu Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device
- Patent number 9,627,337
- Issue date Apr 18, 2017
- Novatek Microelectronics Corp.
- Jung-Fu Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump pad structure
- Patent number 9,536,847
- Issue date Jan 3, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiu-Ping Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip with redundant thru-silicon-vias
- Patent number 9,437,561
- Issue date Sep 6, 2016
- Advanced Micro Devices, Inc.
- Bryan Black
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming patterned repassivation...
- Patent number 9,397,058
- Issue date Jul 19, 2016
- STATS ChipPAC Pte. Ltd.
- Xusheng Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with output circuit and pad arrangements
- Patent number 9,343,460
- Issue date May 17, 2016
- Renesas Electronics Corporation
- Takahiro Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a reservoir capacitor
- Patent number 9,257,434
- Issue date Feb 9, 2016
- SK Hynix Inc.
- Seung Yeub Yang
- G01 - MEASURING TESTING
Information Patent Grant
Spot plated leadframe and IC bond pad via array design for copper wire
- Patent number 9,230,928
- Issue date Jan 5, 2016
- Conexant Systems, Inc.
- Robert W. Warren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump pad structure
- Patent number 9,171,811
- Issue date Oct 27, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao-Yi Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding contact area on a semiconductor substrate
- Patent number 9,064,707
- Issue date Jun 23, 2015
- Micronas GmbH
- Hans-Guenter Zimmer
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR MEMORY
- Publication number 20240397722
- Publication date Nov 28, 2024
- KIOXIA Corporation
- Masayoshi TAGAMI
- G11 - INFORMATION STORAGE
Information Patent Application
BOND PAD LAYOUT INCLUDING FLOATING CONDUCTIVE SECTIONS
- Publication number 20230056520
- Publication date Feb 23, 2023
- Macronix International Co., Ltd.
- Su-Chueh LO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP WITH REDUNDANT THRU-SILICON-VIAS
- Publication number 20230031099
- Publication date Feb 2, 2023
- ADVANCED MICRO DEVICES, INC.
- BRYAN BLACK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH TILTED INSULATING LAYERS AND METHOD FOR F...
- Publication number 20220278025
- Publication date Sep 1, 2022
- NANYA TECHNOLOGY CORPORATION
- TSE-YAO HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH TILTED INSULATING LAYERS AND METHOD FOR F...
- Publication number 20220093490
- Publication date Mar 24, 2022
- NANYA TECHNOLOGY CORPORATION
- TSE-YAO HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING PAD STRUCTURE FOR MEMORY DEVICE AND METHOD OF MANUFACTURING...
- Publication number 20200411457
- Publication date Dec 31, 2020
- Changxin Memory Technologies, Inc.
- Chih Cheng LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND PAD STRUCTURE FOR BONDING IMPROVEMENT
- Publication number 20200357762
- Publication date Nov 12, 2020
- Taiwan Semiconductor Manufacturing Co., LTD
- Chia-Chan CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMPEDANCE MATCHING CIRCUIT FOR RF DEVICES AND METHOD THEREFOR
- Publication number 20190326233
- Publication date Oct 24, 2019
- NXP USA, Inc.
- Ricardo Uscola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND PAD STRUCTURE FOR BONDING IMPROVEMENT
- Publication number 20190221534
- Publication date Jul 18, 2019
- Taiwan Semiconductor Manufacturing Co., LTD
- Chia-Chan CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND BALL BONDER
- Publication number 20180294243
- Publication date Oct 11, 2018
- SII Semiconductor Corporation
- Tomomitsu RISAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND PAD STRUCTURE FOR BONDING IMPROVEMENT
- Publication number 20170330848
- Publication date Nov 16, 2017
- Taiwan Semiconductor Manufacturing Co., LTD
- Chia-Chan CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE CAPABLE OF DISPERSING STRESSES
- Publication number 20170271286
- Publication date Sep 21, 2017
- Samsung Electronics Co., Ltd.
- YOUNGBAE KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE
- Publication number 20170133343
- Publication date May 11, 2017
- NOVATEK MICROELECTRONICS CORP.
- Jung-Fu Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE
- Publication number 20140048935
- Publication date Feb 20, 2014
- NOVATEK MICROELECTRONICS CORP.
- Tai-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Waterproof Structure of Pad, Waterproof Pad, and Method for Forming...
- Publication number 20140045372
- Publication date Feb 13, 2014
- Huawei Technologies Co., Ltd
- Jun Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Double Solid Metal Pad with Reduced Area
- Publication number 20140045327
- Publication date Feb 13, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PAD STRUCTURE AND INTEGRATED CIRCUIT CHIP WITH SUCH PAD STRUCTURE
- Publication number 20140021619
- Publication date Jan 23, 2014
- MEDIATEK INC.
- Yu-Hua Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device
- Publication number 20130341728
- Publication date Dec 26, 2013
- RENESAS ELECTRONICS CORPORATION
- Takahiro HAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20130285057
- Publication date Oct 31, 2013
- Yasushi ISHII
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME
- Publication number 20130241067
- Publication date Sep 19, 2013
- RENESAS ELECTRONICS CORPORATION
- Takeshi FURUSAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bump Pad Structure
- Publication number 20130181347
- Publication date Jul 18, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao-Yi Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Patterned Repassivation...
- Publication number 20130140691
- Publication date Jun 6, 2013
- STATS ChipPAC, Ltd.
- Xusheng Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND PAD STRUCTURE
- Publication number 20130075931
- Publication date Mar 28, 2013
- SHANGHAI HUA HONG NEC ELECTRONICS CO., LTD.
- Qing Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING PAD STRUCTURE FOR SEMICONDUCTOR DEVICES
- Publication number 20130069235
- Publication date Mar 21, 2013
- Tse-Yao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING CONTACT AREA ON A SEMICONDUCTOR SUBSTRATE
- Publication number 20130062779
- Publication date Mar 14, 2013
- Hans-Guenter Zimmer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Spot Plated Leadframe and IC Bond Pad Via Array Design for Copper Wire
- Publication number 20130062742
- Publication date Mar 14, 2013
- Conexant Systems, Inc.
- Robert W. Warren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP PAD STRUCTURE
- Publication number 20130037937
- Publication date Feb 14, 2013
- MEDIATEK INC.
- Ming-Tzong Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
- Publication number 20130017669
- Publication date Jan 17, 2013
- Renesas Electronics Corporation
- Shoetsu KOGAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE
- Publication number 20120248606
- Publication date Oct 4, 2012
- NOVATEK MICROELECTRONICS CORP.
- Tai-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20120168961
- Publication date Jul 5, 2012
- PANASONIC CORPORATION
- Daisuke SAKURAI
- H01 - BASIC ELECTRIC ELEMENTS

at the periphery of the internal layers

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor chip with redundant thru-silicon-vias

Semiconductor memory

Bond pad layout including floating conductive sections

Semiconductor memory

Semiconductor device with tilted insulating layers and method for f...

Semiconductor chip with redundant thru-silicon-vias

Semiconductor device with tilted insulating layers and method for f...

Bonding pad structure for memory device and method of manufacturing...

Bond pad structure for bonding improvement

Wafer-level chip-size package with redistribution layer

Semiconductor memory

Semiconductor memory

Bond pad structure for bonding improvement

Impedance matching circuit for RF devices and method therefor

Semiconductor device and ball bonder

Bond pad structure for bonding improvement

Integrated circuit device having pads structure formed thereon and...

Waterproof structure of pad, waterproof pad, and method for forming...

Semiconductor device and manufacturing method of semiconductor device

Integrated circuit device having pads structure formed thereon and...

Integrated circuit device

Integrated circuit device

Bump pad structure

Semiconductor chip with redundant thru-silicon-vias

Semiconductor device and method of forming patterned repassivation...

Semiconductor device with output circuit and pad arrangements

Semiconductor device including a reservoir capacitor

Spot plated leadframe and IC bond pad via array design for copper wire

Bump pad structure

Bonding contact area on a semiconductor substrate

Patents Applicationslast 30 patents

SEMICONDUCTOR MEMORY

BOND PAD LAYOUT INCLUDING FLOATING CONDUCTIVE SECTIONS

SEMICONDUCTOR CHIP WITH REDUNDANT THRU-SILICON-VIAS

SEMICONDUCTOR DEVICE WITH TILTED INSULATING LAYERS AND METHOD FOR F...

SEMICONDUCTOR DEVICE WITH TILTED INSULATING LAYERS AND METHOD FOR F...

BONDING PAD STRUCTURE FOR MEMORY DEVICE AND METHOD OF MANUFACTURING...

BOND PAD STRUCTURE FOR BONDING IMPROVEMENT

IMPEDANCE MATCHING CIRCUIT FOR RF DEVICES AND METHOD THEREFOR

BOND PAD STRUCTURE FOR BONDING IMPROVEMENT

SEMICONDUCTOR DEVICE AND BALL BONDER

BOND PAD STRUCTURE FOR BONDING IMPROVEMENT

SEMICONDUCTOR DEVICE CAPABLE OF DISPERSING STRESSES

INTEGRATED CIRCUIT DEVICE

INTEGRATED CIRCUIT DEVICE

Waterproof Structure of Pad, Waterproof Pad, and Method for Forming...

Double Solid Metal Pad with Reduced Area

PAD STRUCTURE AND INTEGRATED CIRCUIT CHIP WITH SUCH PAD STRUCTURE

Semiconductor Device

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME

Bump Pad Structure

Semiconductor Device and Method of Forming Patterned Repassivation...

BOND PAD STRUCTURE

BONDING PAD STRUCTURE FOR SEMICONDUCTOR DEVICES

BONDING CONTACT AREA ON A SEMICONDUCTOR SUBSTRATE

Spot Plated Leadframe and IC Bond Pad Via Array Design for Copper Wire

BUMP PAD STRUCTURE

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE

INTEGRATED CIRCUIT DEVICE

SEMICONDUCTOR DEVICE