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at the periphery of the internal layers

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  • CPC
  • H01L2224/05092
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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/05092at the periphery of the internal layers
Industries

Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
    • Publication number 20200091097
    • Publication date Mar 19, 2020
    • Taiwan Semiconductor Manufacturing Co., Ltd.
    • Tuan-Yu Hung
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    FAN-OUT SEMICONDUCTOR PACKAGE
    • Publication number 20180331054
    • Publication date Nov 15, 2018
    • Samsung Electro-Mechanics Co., Ltd.
    • Han KIM
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    LIQUID EJECTION HEAD SUBSTRATE AND SEMICONDUCTOR SUBSTRATE
    • Publication number 20180277503
    • Publication date Sep 27, 2018
    • Canon Kabushiki Kaisha
    • Koji Sasaki
    • B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
  • Information Patent Application

    FAN-OUT SEMICONDUCTOR PACKAGE
    • Publication number 20180090458
    • Publication date Mar 29, 2018
    • Samsung Electro-Mechanics Co., Ltd.
    • Han KIM
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE CAPABLE OF DISPERSING STRESSES
    • Publication number 20170271286
    • Publication date Sep 21, 2017
    • Samsung Electronics Co., Ltd.
    • YOUNGBAE KIM
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20150340331
    • Publication date Nov 26, 2015
    • Hewlett-Packard Development Company, L.P.
    • Lawrence H. White
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Bump Pad Structure
    • Publication number 20150031200
    • Publication date Jan 29, 2015
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Hao-Yi Tsai
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Bump Pad Structure
    • Publication number 20130181347
    • Publication date Jul 18, 2013
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Hao-Yi Tsai
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    OFFSET OF CONTACT OPENING FOR COPPER PILLARS IN FLIP CHIP PACKAGES
    • Publication number 20130147052
    • Publication date Jun 13, 2013
    • STMicroelectronics Pte Ltd
    • Xueren Zhang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20120299186
    • Publication date Nov 29, 2012
    • Lawrence H. White
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHOD OF FABRICATING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
    • Publication number 20120119371
    • Publication date May 17, 2012
    • LAPIS Semiconductor Co., Ltd.
    • Yasuhiro MATSUMOTO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Bump Pad Structure
    • Publication number 20100283148
    • Publication date Nov 11, 2010
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Hao-Yi Tsai
    • H01 - BASIC ELECTRIC ELEMENTS