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CPC
H01L2224/83887

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/83887Auxiliary means therefor

Industries

Patents Grantslast 30 patents

Information Patent Grant
Anisotropic conductive adhesive with reduced migration
- Patent number 9,365,749
- Issue date Jun 14, 2016
- Sunray Scientific, LLC
- S. Kumar Khanna
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Flip-chip mounting resin composition and bump forming resin composi...
- Patent number 8,709,293
- Issue date Apr 29, 2014
- Panasonic Corporation
- Takashi Kitae
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor packages
- Patent number 8,587,134
- Issue date Nov 19, 2013
- Samsung Electronics Co., Ltd.
- Yun-hyeok Im
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip mounting method and bump forming method
- Patent number 8,283,246
- Issue date Oct 9, 2012
- Panasonic Corporation
- Takashi Kitae
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flip chip mounting method and bump forming method
- Patent number 7,951,700
- Issue date May 31, 2011
- Panasonic Corporation
- Takashi Kitae
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flip chip mounting method and method for connecting substrates
- Patent number 7,820,021
- Issue date Oct 26, 2010
- Panasonic Corporation
- Seiji Karashima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package equipped with semiconductor chip and method for producing same
- Patent number 7,649,267
- Issue date Jan 19, 2010
- Panasonic Corporation
- Tsukasa Shiraishi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flip chip mounting method and bump forming method
- Patent number 7,638,883
- Issue date Dec 29, 2009
- Panasonic Corporation
- Seiji Karashima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flip chip mounting method and method for connecting substrates
- Patent number 7,531,385
- Issue date May 12, 2009
- Panasonic Corporation
- Seiji Karashima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flip chip mounting method and bump forming method
- Patent number 7,531,387
- Issue date May 12, 2009
- Panasonic Corporation
- Seiji Karashima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
FEATURES FOR IMPROVING DIE SIZE AND ORIENTATION DIFFERENTIATION IN...
- Publication number 20220415847
- Publication date Dec 29, 2022
- Intel Corporation
- Feras Eid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANISOTROPIC CONDUCTIVE FILM (ACF), BONDING STRUCTURE, AND DISPLAY P...
- Publication number 20170271299
- Publication date Sep 21, 2017
- BOE TECHNOLOGY GROUP CO., LTD.
- HONG LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Anisotropic Conductive Adhesive with Reduced Migration
- Publication number 20140353540
- Publication date Dec 4, 2014
- SUNRAY SCIENTIFIC, LLC
- S. Kumar Khanna
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20130134606
- Publication date May 30, 2013
- Samsung Electronics Co., Ltd.
- Yun-hyeok IM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANISOTROPIC ELECTRICALLY AND THERMALLY CONDUCTIVE ADHESIVE WITH MAG...
- Publication number 20120106111
- Publication date May 3, 2012
- JOSEPH MAZZOCHETTE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLIP CHIP MOUNTING METHOD AND BUMP FORMING METHOD
- Publication number 20110201195
- Publication date Aug 18, 2011
- PANASONIC CORPORATION
- Takashi KITAE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Flip chip mounting method and method for connecting substrates
- Publication number 20090126876
- Publication date May 21, 2009
- Matsushita Electric Industrial Co., Ltd.
- Seiji Karashima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLIP CHIP MOUNTING METHOD AND METHOD FOR CONNECTING SUBSTRATES
- Publication number 20090115071
- Publication date May 7, 2009
- Seiji Karashima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLIP CHIP MOUNTING METHOD AND BUMP FORMING METHOD
- Publication number 20090117688
- Publication date May 7, 2009
- Seiji Karashima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLIP CHIP MOUNTING METHOD AND BUMP FORMING METHOD
- Publication number 20090023245
- Publication date Jan 22, 2009
- Matsushita Electric Industrial Co., Ltd.
- Takashi Kitae
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Flip chip mounting method and bump forming method
- Publication number 20080284046
- Publication date Nov 20, 2008
- Matsushita Electric Industrial Co., Ltd.
- Seiji Karashima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Package Equipped with Semiconductor Chip and Method for Producing Same
- Publication number 20080265437
- Publication date Oct 30, 2008
- Tsukasa Shiraishi
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Flip-Chip Mounting Resin Composition and Bump Forming Resin Composi...
- Publication number 20080128664
- Publication date Jun 5, 2008
- Takashi Kitae
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...

Auxiliary means therefor

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Anisotropic conductive adhesive with reduced migration

Flip-chip mounting resin composition and bump forming resin composi...

Semiconductor packages

Flip chip mounting method and bump forming method

Flip chip mounting method and bump forming method

Flip chip mounting method and method for connecting substrates

Package equipped with semiconductor chip and method for producing same

Flip chip mounting method and bump forming method

Flip chip mounting method and method for connecting substrates

Flip chip mounting method and bump forming method

Patents Applicationslast 30 patents

FEATURES FOR IMPROVING DIE SIZE AND ORIENTATION DIFFERENTIATION IN...

ANISOTROPIC CONDUCTIVE FILM (ACF), BONDING STRUCTURE, AND DISPLAY P...

Anisotropic Conductive Adhesive with Reduced Migration

SEMICONDUCTOR PACKAGES

ANISOTROPIC ELECTRICALLY AND THERMALLY CONDUCTIVE ADHESIVE WITH MAG...

FLIP CHIP MOUNTING METHOD AND BUMP FORMING METHOD

Flip chip mounting method and method for connecting substrates

FLIP CHIP MOUNTING METHOD AND METHOD FOR CONNECTING SUBSTRATES

FLIP CHIP MOUNTING METHOD AND BUMP FORMING METHOD

FLIP CHIP MOUNTING METHOD AND BUMP FORMING METHOD

Flip chip mounting method and bump forming method

Package Equipped with Semiconductor Chip and Method for Producing Same

Flip-Chip Mounting Resin Composition and Bump Forming Resin Composi...