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Auxiliary members for strap connectors

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  • CPC
  • H01L2224/4099
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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/4099Auxiliary members for strap connectors
Industries

Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20240312875
    • Publication date Sep 19, 2024
    • Kabushiki Kaisha Toshiba
    • Rie ARIMA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR MODULE, SEMICONDUCTOR DEVICE, AND VEHICLE
    • Publication number 20240234360
    • Publication date Jul 11, 2024
    • Fuji Electric Co., Ltd.
    • Mai SAITO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR MODULE, SEMICONDUCTOR DEVICE, AND VEHICLE
    • Publication number 20240136319
    • Publication date Apr 25, 2024
    • Fuji Electric Co., Ltd.
    • Mai SAITO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE AND RELATED METHODS
    • Publication number 20240072009
    • Publication date Feb 29, 2024
    • SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
    • Chee Hiong CHEW
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20240006368
    • Publication date Jan 4, 2024
    • ROHM CO., LTD.
    • Takumi KANDA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CLIP DESIGN AND METHOD OF CONTROLLING CLIP POSITION
    • Publication number 20230326901
    • Publication date Oct 12, 2023
    • Semiconductor Components Industries, LLC
    • Atapol Prajuckamol
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR MODULE
    • Publication number 20230071827
    • Publication date Mar 9, 2023
    • Fuji Electric Co., Ltd.
    • Kousuke KOMATSU
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Semiconductor Package and Related Methods
    • Publication number 20200286865
    • Publication date Sep 10, 2020
    • Semiconductor Components Industries, LLC
    • Chee Hiong CHEW
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Multi-Clip Structure for Die Bonding
    • Publication number 20200105707
    • Publication date Apr 2, 2020
    • Balehithlu Manjappaiah Upendra
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20180047698
    • Publication date Feb 15, 2018
    • Rohm Co., Ltd.
    • Mamoru YAMAGAMI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME
    • Publication number 20140084438
    • Publication date Mar 27, 2014
    • FUJI ELECTRIC CO., LTD.
    • Shin Soyano
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20130069215
    • Publication date Mar 21, 2013
    • Kabushiki Kaisha Toshiba
    • Junichi Nakao
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Multiple Substrate Electrical Circuit Device
    • Publication number 20110037151
    • Publication date Feb 17, 2011
    • Raytheon Company
    • Premjeet Chahal
    • H01 - BASIC ELECTRIC ELEMENTS