Auxiliary support including a cavity for storing a finished device

Industry

CPC
H01L2221/68313

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2221/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00

Current Industry

H01L2221/68313Auxiliary support including a cavity for storing a finished device

Industries

Patents Grantslast 30 patents

Information Patent Grant
Apparatus and method for facilitating planar delayering of integrat...
- Patent number 11,810,808
- Issue date Nov 7, 2023
- Honeywell Federal Manufacturing & Technologies, LLC
- Joshua Joseph Trujillo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and structures for die-to-die bonding
- Patent number 11,798,914
- Issue date Oct 24, 2023
- Yangtze Memory Technologies Co., Ltd.
- Jun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor integrated circuit (IC) with opposite facing ambient light s...
- Patent number 11,790,816
- Issue date Oct 17, 2023
- QUALCOMM Incorporated
- Venkatesh Sadineni
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Wet alignment method for micro-semiconductor chip and display trans...
- Patent number 11,764,095
- Issue date Sep 19, 2023
- Samsung Electronics Co., Ltd.
- Kyungwook Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tape carrier assemblies having an integrated adhesive film
- Patent number 11,764,133
- Issue date Sep 19, 2023
- Daewon Semiconductor Packaging Industrial Company
- Sunna Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stack of dies
- Patent number 11,664,318
- Issue date May 30, 2023
- Nokia Solutions and Networks Oy
- Argishti Melikyan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier tray
- Patent number 11,521,877
- Issue date Dec 6, 2022
- Disco Corporation
- Kentaro Iizuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-row carrier tape with alternating, staggered dummy pockets
- Patent number 11,452,247
- Issue date Sep 20, 2022
- Advantek, Inc.
- Todd M. Oliverius
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sintering materials and attachment methods using same
- Patent number 11,389,865
- Issue date Jul 19, 2022
- Alpha Assembly Solutions Inc.
- Shamik Ghoshal
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Tape carrier assemblies having an integrated adhesive film
- Patent number 11,362,025
- Issue date Jun 14, 2022
- Daewon Semiconductor Packaging Industrial Company
- Sunna Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding and indexing apparatus
- Patent number 11,362,058
- Issue date Jun 14, 2022
- Nexperia B.V.
- Ralph Huybers
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chip package structure and manufacturing method thereof
- Patent number 11,217,551
- Issue date Jan 4, 2022
- Chung W. Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods related to preparation of a stencil to receive a plurality...
- Patent number 11,183,413
- Issue date Nov 23, 2021
- Rokko Systems Pte Ltd.
- Seung Ho Baek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic apparatus including antennas and directors
- Patent number 11,171,088
- Issue date Nov 9, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tzu-Chun Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier tape system and methods of using carrier tape system
- Patent number 11,164,763
- Issue date Nov 2, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tsung-Jen Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier tape system and methods of using carrier tape system
- Patent number 11,164,764
- Issue date Nov 2, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tsung-Jen Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to protect die during metal-embedded chip assembly (MECA) pr...
- Patent number 11,158,520
- Issue date Oct 26, 2021
- HRL Laboratories, LLC
- Florian G. Herrault
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Assembly of a carrier and a plurality of electrical circuits fixed...
- Patent number 11,075,093
- Issue date Jul 27, 2021
- CARDLAB APS
- Finn Nielsen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package for debonding substrate assembly from...
- Patent number 11,069,541
- Issue date Jul 20, 2021
- Samsung Electronics Co., Ltd.
- Yeong Kwon Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit controlled ejection system (ICCES) for massively...
- Patent number 10,964,561
- Issue date Mar 30, 2021
- Matrics2, Inc.
- Michael R. Arneson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip parts and method for manufacturing the same, circuit assembly...
- Patent number 10,867,945
- Issue date Dec 15, 2020
- Rohm Co., Ltd.
- Hiroki Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier tape system and methods of using carrier tape system
- Patent number 10,679,877
- Issue date Jun 9, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tsung-Jen Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Film formation apparatus
- Patent number 10,633,736
- Issue date Apr 28, 2020
- SHIBAURA MECHATRONICS CORPORATION
- Akihiko Ito
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Device, system and method for aligning electronic components
- Patent number 10,604,358
- Issue date Mar 31, 2020
- Muehlbauer GmbH & Co. KG
- Franz Brandl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for facilitating planar delayering of integrat...
- Patent number 10,573,547
- Issue date Feb 25, 2020
- Honeywell Federal Manufacturing & Technologies, LLC
- Joshua Joseph Trujillo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-die structure and method for forming same
- Patent number 10,553,569
- Issue date Feb 4, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Receiving system for components
- Patent number 10,529,601
- Issue date Jan 7, 2020
- Muehlbauer GmbH & Co. KG
- Konstantin Koch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for stacking devices in an integrated circuit...
- Patent number 10,515,838
- Issue date Dec 24, 2019
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Protective film forming film, protective film forming sheet and wor...
- Patent number 10,510,578
- Issue date Dec 17, 2019
- Lintec Corporation
- Naoya Saiki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chip parts and method for manufacturing the same, circuit assembly...
- Patent number 10,468,362
- Issue date Nov 5, 2019
- Rohm Co., Ltd.
- Hiroki Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
APPARATUS FOR PROCESSING OF SINGULATED DIES AND METHODS FOR USING T...
- Publication number 20240096683
- Publication date Mar 21, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WET ALIGNMENT METHOD FOR MICRO-SEMICONDUCTOR CHIP AND DISPLAY TRANS...
- Publication number 20230274970
- Publication date Aug 31, 2023
- Samsung Electronics Co., Ltd.
- Kyungwook HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WET ALIGNMENT METHOD FOR MICRO-SEMICONDUCTOR CHIP AND DISPLAY TRANS...
- Publication number 20230274969
- Publication date Aug 31, 2023
- Samsung Electronics Co., Ltd.
- Kyungwook HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY MODULE AND MANUFACTURING METHOD THEREOF
- Publication number 20230275071
- Publication date Aug 31, 2023
- Samsung Electronics Co., Ltd.
- Myunghee KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER JIG, WAFER STRUCTURE AND WAFER PROCESSING METHOD
- Publication number 20230126487
- Publication date Apr 27, 2023
- GLOBALWAFERS CO., LTD.
- Chan-Ju Wen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT-EMITTING STRUCTURE AND LIGHT-EMITTING DEVICE INCLUDING THE SAME
- Publication number 20230006097
- Publication date Jan 5, 2023
- XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD
- Zheng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE FOR MANUFACTURING DISPLAY DEVICE AND METHOD FOR MANUFACTU...
- Publication number 20220359257
- Publication date Nov 10, 2022
- LG ELECTRONICS INC.
- Donghae OH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING AND INDEXING METHOD
- Publication number 20220310553
- Publication date Sep 29, 2022
- NEXPERIA B.V.
- Ralph HUYBERS
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WET ALIGNMENT METHOD FOR MICRO-SEMICONDUCTOR CHIP AND DISPLAY TRANS...
- Publication number 20220013400
- Publication date Jan 13, 2022
- Samsung Electronics Co., Ltd.
- Kyungwook HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARRIER TRAY
- Publication number 20210265186
- Publication date Aug 26, 2021
- Disco Corporation
- Kentaro IIZUKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD TO PROTECT DIE DURING METAL-EMBEDDED CHIP ASSEMBLY (MECA) PR...
- Publication number 20200294816
- Publication date Sep 17, 2020
- HRL LABORATORIES, LLC
- Florian G. HERRAULT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Row Carrier Tape with Alternating, Staggered Dummy Pockets
- Publication number 20200163262
- Publication date May 21, 2020
- Advantek, Inc.
- Todd M. Oliverius
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING SAME
- Publication number 20200126814
- Publication date Apr 23, 2020
- Samsung Electronics Co., Ltd.
- YEONG KWON KO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ASSEMBLY OF A CARRIER AND A PLURALITY OF ELECTRICAL CIRCUITS FIXED...
- Publication number 20200027753
- Publication date Jan 23, 2020
- CARDLAB APS
- Finn NIELSEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARRIER TAPE SYSTEM AND METHODS OF USING CARRIER TAPE SYSTEM
- Publication number 20200006098
- Publication date Jan 2, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tsung-Jen LIAO
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
METHOD AND APPARATUS FOR STACKING DEVICES IN AN INTEGRATED CIRCUIT...
- Publication number 20190088527
- Publication date Mar 21, 2019
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PACKAGING CHIP AND CHIP PACKAGE STRUCTURE
- Publication number 20190006219
- Publication date Jan 3, 2019
- BOE TECHNOLOGY GROUP CO., LTD.
- Yonglian QI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE AND METHOD FOR SELF-ADJUSTMENT OF A COMPONENT-HANDLING DEVIC...
- Publication number 20180303015
- Publication date Oct 18, 2018
- Muehlbauer GmbH & Co., KG
- Konstantin Koch
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DIE CARRIER DEVICE AND METHOD
- Publication number 20180286733
- Publication date Oct 4, 2018
- Intel Corporation
- Mingzhi Mindy Dai
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Method and Apparatus for Stacking Devices in an Integrated Circuit...
- Publication number 20180130691
- Publication date May 10, 2018
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR PICKING SEMICONDUCTOR DEVICES
- Publication number 20180122682
- Publication date May 3, 2018
- Samsung Electronics Co., Ltd.
- Jong-An LEE
- G01 - MEASURING TESTING
Information Patent Application
CHIP PARTS AND METHOD FOR MANUFACTURING THE SAME, CIRCUIT ASSEMBLY...
- Publication number 20180108628
- Publication date Apr 19, 2018
- Rohm Co., Ltd.
- Hiroki Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING AND APPARATUS
- Publication number 20170162412
- Publication date Jun 8, 2017
- ROKKO SYSTEMS PTE LTD
- Seung Ho BAEK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARRIER TAPE
- Publication number 20170062262
- Publication date Mar 2, 2017
- QUALCOMM Incorporated
- Anthony Thomas NEWMAN
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Application
PROTECTIVE FILM FORMING FILM, PROTECTIVE FILM FORMING SHEET AND WOR...
- Publication number 20170011949
- Publication date Jan 12, 2017
- LINTEC CORPORATION
- Naoya Saiki
- B32 - LAYERED PRODUCTS
Information Patent Application
PROCESS FOR TRANSFERRING LAYERS
- Publication number 20160141198
- Publication date May 19, 2016
- SOITEC
- Marcel BROEKAART
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT CONVEYING APPARATUS
- Publication number 20140360846
- Publication date Dec 11, 2014
- SYNAX CO., LTD.
- Takamitsu AIHARA
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Application
METHODS FOR HIGH PRECISION MICROELECTRONIC DIE INTEGRATION
- Publication number 20140357020
- Publication date Dec 4, 2014
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COVER TAPE FOR CARRIER TAPE
- Publication number 20140329036
- Publication date Nov 6, 2014
- Kwang Suck Suh
- B32 - LAYERED PRODUCTS
Information Patent Application
COVER TAPE
- Publication number 20140248487
- Publication date Sep 4, 2014
- Kazuya Sugimoto
- B32 - LAYERED PRODUCTS

Auxiliary support including a cavity for storing a finished device

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Apparatus and method for facilitating planar delayering of integrat...

Methods and structures for die-to-die bonding

Sensor integrated circuit (IC) with opposite facing ambient light s...

Wet alignment method for micro-semiconductor chip and display trans...

Tape carrier assemblies having an integrated adhesive film

Stack of dies

Carrier tray

Multi-row carrier tape with alternating, staggered dummy pockets

Sintering materials and attachment methods using same

Tape carrier assemblies having an integrated adhesive film

Bonding and indexing apparatus

Chip package structure and manufacturing method thereof

Methods related to preparation of a stencil to receive a plurality...

Electronic apparatus including antennas and directors

Carrier tape system and methods of using carrier tape system

Carrier tape system and methods of using carrier tape system

Method to protect die during metal-embedded chip assembly (MECA) pr...

Assembly of a carrier and a plurality of electrical circuits fixed...

Semiconductor device package for debonding substrate assembly from...

Integrated circuit controlled ejection system (ICCES) for massively...

Chip parts and method for manufacturing the same, circuit assembly...

Carrier tape system and methods of using carrier tape system

Film formation apparatus

Device, system and method for aligning electronic components

Apparatus and method for facilitating planar delayering of integrat...

Multi-die structure and method for forming same

Receiving system for components

Method and apparatus for stacking devices in an integrated circuit...

Protective film forming film, protective film forming sheet and wor...

Chip parts and method for manufacturing the same, circuit assembly...

Patents Applicationslast 30 patents

APPARATUS FOR PROCESSING OF SINGULATED DIES AND METHODS FOR USING T...

WET ALIGNMENT METHOD FOR MICRO-SEMICONDUCTOR CHIP AND DISPLAY TRANS...

WET ALIGNMENT METHOD FOR MICRO-SEMICONDUCTOR CHIP AND DISPLAY TRANS...

DISPLAY MODULE AND MANUFACTURING METHOD THEREOF

WAFER JIG, WAFER STRUCTURE AND WAFER PROCESSING METHOD

LIGHT-EMITTING STRUCTURE AND LIGHT-EMITTING DEVICE INCLUDING THE SAME

SUBSTRATE FOR MANUFACTURING DISPLAY DEVICE AND METHOD FOR MANUFACTU...

BONDING AND INDEXING METHOD

WET ALIGNMENT METHOD FOR MICRO-SEMICONDUCTOR CHIP AND DISPLAY TRANS...

CARRIER TRAY

METHOD TO PROTECT DIE DURING METAL-EMBEDDED CHIP ASSEMBLY (MECA) PR...

Multi-Row Carrier Tape with Alternating, Staggered Dummy Pockets

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING SAME

ASSEMBLY OF A CARRIER AND A PLURALITY OF ELECTRICAL CIRCUITS FIXED...

CARRIER TAPE SYSTEM AND METHODS OF USING CARRIER TAPE SYSTEM

METHOD AND APPARATUS FOR STACKING DEVICES IN AN INTEGRATED CIRCUIT...

METHOD OF PACKAGING CHIP AND CHIP PACKAGE STRUCTURE

DEVICE AND METHOD FOR SELF-ADJUSTMENT OF A COMPONENT-HANDLING DEVIC...

DIE CARRIER DEVICE AND METHOD

Method and Apparatus for Stacking Devices in an Integrated Circuit...

APPARATUS FOR PICKING SEMICONDUCTOR DEVICES

CHIP PARTS AND METHOD FOR MANUFACTURING THE SAME, CIRCUIT ASSEMBLY...

SUBSTRATE PROCESSING AND APPARATUS

CARRIER TAPE

PROTECTIVE FILM FORMING FILM, PROTECTIVE FILM FORMING SHEET AND WOR...

PROCESS FOR TRANSFERRING LAYERS

ELECTRONIC COMPONENT CONVEYING APPARATUS

METHODS FOR HIGH PRECISION MICROELECTRONIC DIE INTEGRATION

COVER TAPE FOR CARRIER TAPE

COVER TAPE