Auxiliary support including means facilitating the selective separation of some of a plurality of devices from the auxiliary support

Industry

CPC
H01L2221/68322

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2221/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00

Current Industry

H01L2221/68322Auxiliary support including means facilitating the selective separation of some of a plurality of devices from the auxiliary support

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device package and manufacturing method thereof
- Patent number 12,136,565
- Issue date Nov 5, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Michael G. Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of placing a micro device to a receiver substrate
- Patent number 12,080,685
- Issue date Sep 3, 2024
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective transfer of micro devices
- Patent number 12,075,565
- Issue date Aug 27, 2024
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interbonded components, method for detaching components from interb...
- Patent number 12,059,881
- Issue date Aug 13, 2024
- Osram Opto Semiconductors GmbH
- Alexander Pfeuffer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die ejector
- Patent number 12,062,566
- Issue date Aug 13, 2024
- BESI Switzerland AG
- Fabian Hurschler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microdevice transfer setup and integration of micro-devices into sy...
- Patent number 12,062,638
- Issue date Aug 13, 2024
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid tethers for micro-transfer printing
- Patent number 12,057,340
- Issue date Aug 6, 2024
- X-CELEPRINT LIMITED
- Ruggero Loi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip transferring method and the apparatus thereof
- Patent number 12,057,337
- Issue date Aug 6, 2024
- Epistar Corporation
- Min-Hsun Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Positional error compensation in assembly of discrete components by...
- Patent number 12,046,504
- Issue date Jul 23, 2024
- KULICKE & SOFFA NETHERLANDS B.V.
- Matthew R. Semler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heterogeneous integration of components onto compact devices using...
- Patent number 12,009,247
- Issue date Jun 11, 2024
- Board of Regents, The University of Texas System
- Sidlgata V. Sreenivasan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Dynamic release tapes for assembly of discrete components
- Patent number 11,942,354
- Issue date Mar 26, 2024
- Uniqarta, Inc.
- Val Marinov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mask design for improved attach position
- Patent number 11,862,478
- Issue date Jan 2, 2024
- STATS ChipPAC Pte. Ltd.
- ChangOh Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display apparatus having a semiconductor light emitting source
- Patent number 11,848,316
- Issue date Dec 19, 2023
- Seoul Semiconductor Co., Ltd.
- Motonobu Takeya
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Display apparatus and manufacturing method thereof
- Patent number 11,817,440
- Issue date Nov 14, 2023
- Seoul Semiconductor Co., Ltd.
- Motonobu Takeya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin die release for semiconductor device assembly
- Patent number 11,791,212
- Issue date Oct 17, 2023
- Micron Technology, Inc.
- Andrew M. Bayless
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of parallel transfer of micro-devices using treatment
- Patent number 11,776,989
- Issue date Oct 3, 2023
- Applied Materials, Inc.
- Manivannan Thothadri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer manufacturing method and laminated device chip manufacturing...
- Patent number 11,764,115
- Issue date Sep 19, 2023
- Disco Corporation
- Youngsuk Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer manufacturing method and laminated device chip manufacturing...
- Patent number 11,764,114
- Issue date Sep 19, 2023
- Disco Corporation
- Youngsuk Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of parallel transfer of micro-devices using mask layer
- Patent number 11,756,982
- Issue date Sep 12, 2023
- Applied Materials, Inc.
- Manivannan Thothadri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die processing
- Patent number 11,742,315
- Issue date Aug 29, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro device integration into system substrate
- Patent number 11,735,623
- Issue date Aug 22, 2023
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective micro device transfer to receiver substrate
- Patent number 11,735,545
- Issue date Aug 22, 2023
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective micro device transfer to receiver substrate
- Patent number 11,735,547
- Issue date Aug 22, 2023
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective micro device transfer to receiver substrate
- Patent number 11,735,546
- Issue date Aug 22, 2023
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective micro device transfer to receiver substrate
- Patent number 11,728,302
- Issue date Aug 15, 2023
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective micro device transfer to receiver substrate
- Patent number 11,728,306
- Issue date Aug 15, 2023
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip transferring method and the apparatus thereof
- Patent number 11,658,052
- Issue date May 23, 2023
- Epistar Corporation
- Min-Hsun Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photoelectric device
- Patent number 11,640,913
- Issue date May 2, 2023
- Ultra Display Technology Corp.
- Hsien-Te Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for controlling flatness, method for forming coating film, a...
- Patent number 11,615,978
- Issue date Mar 28, 2023
- Shin-Etsu Chemical Co., Ltd.
- Tsutomu Ogihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die ejector height adjustment
- Patent number 11,600,516
- Issue date Mar 7, 2023
- ASMPT SINGAPORE PTE. LTD.
- Chi Wah Cheng
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
TRANSFER SUBSTRATE AND LIGHT EMITTING DIODE TRANSFER METHOD USING T...
- Publication number 20240413129
- Publication date Dec 12, 2024
- Samsung Electronics Co., Ltd.
- Wonsik CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND DEVICE FOR PRODUCING AND PREPARING ELECTRONIC COMPONENTS
- Publication number 20240387270
- Publication date Nov 21, 2024
- EV GROUP E. THALLNER GMBH
- Jurgen Burggraf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER PROCESSING METHOD
- Publication number 20240379402
- Publication date Nov 14, 2024
- Disco Corporation
- Tomoharu TAKITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE TRANSFER OF MICRO DEVICES
- Publication number 20240381531
- Publication date Nov 14, 2024
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRODEVICE TRANSFER SETUP AND INTEGRATION OF MICRO-DEVICES INTO SY...
- Publication number 20240363585
- Publication date Oct 31, 2024
- VueReal Inc.
- Gholamreza CHAJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Die Ejector
- Publication number 20240363386
- Publication date Oct 31, 2024
- BESI Switzerland AG
- Fabian Hurschler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP TRANSFERRING METHOD AND THE APPARATUS THEREOF
- Publication number 20240339345
- Publication date Oct 10, 2024
- EPISTAR CORPORATION
- Min-Hsun HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HETEROGENEOUS INTEGRATION OF COMPONENTS ONTO COMPACT DEVICES USING...
- Publication number 20240332056
- Publication date Oct 3, 2024
- Board of Regents, The University of Texas System
- Sidlgata V. Sreenivasan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Selective photo-induced transfer of good micro leds
- Publication number 20240290647
- Publication date Aug 29, 2024
- Aledia
- Christophe LINCHENEAU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSFER OF MICRO DEVICES
- Publication number 20240234190
- Publication date Jul 11, 2024
- VueReal Inc.
- Gholamreza CHAJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY APPARATUS AND MANUFACTURING METHOD THEREOF
- Publication number 20240153936
- Publication date May 9, 2024
- SEOUL SEMICONDUCTOR CO., LTD.
- Motonobu TAKEYA
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
TRANSFER OF MICRO DEVICES
- Publication number 20240136215
- Publication date Apr 25, 2024
- VueReal Inc.
- Gholamreza CHAJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO DEVICE, MICRO DEVICE ALIGNMENT APPARATUS, AND ALIGNMENT METHO...
- Publication number 20240038569
- Publication date Feb 1, 2024
- POINT ENGINEERING CO., LTD.
- Bum Mo AHN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE PROCESSING
- Publication number 20240021572
- Publication date Jan 18, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN DIE RELEASE FOR SEMICONDUCTOR DEVICE ASSEMBLY
- Publication number 20230420300
- Publication date Dec 28, 2023
- Micron Technology, Inc.
- Andrew M. Bayless
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY APPARATUS AND MANUFACTURING METHOD THEREOF
- Publication number 20230387098
- Publication date Nov 30, 2023
- SEOUL SEMICONDUCTOR CO., LTD.
- Motonobu TAKEYA
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
INTEGRATION OF MICRODEVICES INTO SYSTEM SUBSTRATE
- Publication number 20230326937
- Publication date Oct 12, 2023
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP TRANSFERRING METHOD AND THE APPARATUS THEREOF
- Publication number 20230274962
- Publication date Aug 31, 2023
- EPISTAR CORPORATION
- Min-Hsun HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Transfer System and Transfer Method
- Publication number 20230215757
- Publication date Jul 6, 2023
- CHONGQING KONKA PHOTOELECTRIC TECHNOLOGY RESEARCH INSTITUTE CO., LTD.
- CHIA-HSIU CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO DEVICE INTEGRATION INTO SYSTEM SUBSTRATE
- Publication number 20230207611
- Publication date Jun 29, 2023
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATION OF MICRODEVICES INTO SYSTEM SUBSTRATE
- Publication number 20230078708
- Publication date Mar 16, 2023
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Selecting Semiconductor Components
- Publication number 20230058398
- Publication date Feb 23, 2023
- ams-OSRAM International GmbH
- Alexander Pfeuffer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR TRANSFERRING ELECTRONIC ELEMENTS
- Publication number 20220384234
- Publication date Dec 1, 2022
- ASTI GLOBAL INC., TAIWAN
- YING-CHIEH CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY APPARATUS AND MANUFACTURING METHOD THEREOF
- Publication number 20220384406
- Publication date Dec 1, 2022
- SEOUL SEMICONDUCTOR CO., LTD.
- Motonobu TAKEYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HETEROGENEOUS STRUCTURES AND PROCESSING METHODS
- Publication number 20220328339
- Publication date Oct 13, 2022
- X-CELEPRINT LIMITED
- Ronald S. Cok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Mask Design for Improved Attach Position
- Publication number 20220310408
- Publication date Sep 29, 2022
- STATS ChipPAC Pte Ltd.
- ChangOh Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
A PHOTOSENSITIVE TRANSFER RESIN FOR TRANSFERRING AN LED CHIP, A MET...
- Publication number 20220254673
- Publication date Aug 11, 2022
- Lightizer Co., Ltd.
- Jae Sik MIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MATERIAL FOR POSITIONAL ERROR COMPENSATION IN ASSEMBLY OF DISCRETE...
- Publication number 20220238366
- Publication date Jul 28, 2022
- KULICKE & SOFFA NETHERLANDS B.V.
- Matthew R. Semler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Mask Design for Improved Attach Position
- Publication number 20220199423
- Publication date Jun 23, 2022
- STATS ChipPAC Pte Ltd.
- ChangOh Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARRIER FOR MICROELECTRONIC ASSEMBLIES HAVING DIRECT BONDING
- Publication number 20220199453
- Publication date Jun 23, 2022
- Intel Corporation
- Michael J. Baker
- H01 - BASIC ELECTRIC ELEMENTS

Auxiliary support including means facilitating the selective separation of some of a plurality of devices from the auxiliary support

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device package and manufacturing method thereof

Method of placing a micro device to a receiver substrate

Selective transfer of micro devices

Interbonded components, method for detaching components from interb...

Die ejector

Microdevice transfer setup and integration of micro-devices into sy...

Hybrid tethers for micro-transfer printing

Chip transferring method and the apparatus thereof

Positional error compensation in assembly of discrete components by...

Heterogeneous integration of components onto compact devices using...

Dynamic release tapes for assembly of discrete components

Mask design for improved attach position

Display apparatus having a semiconductor light emitting source

Display apparatus and manufacturing method thereof

Thin die release for semiconductor device assembly

Methods of parallel transfer of micro-devices using treatment

Wafer manufacturing method and laminated device chip manufacturing...

Wafer manufacturing method and laminated device chip manufacturing...

Methods of parallel transfer of micro-devices using mask layer

Die processing

Micro device integration into system substrate

Selective micro device transfer to receiver substrate

Selective micro device transfer to receiver substrate

Selective micro device transfer to receiver substrate

Selective micro device transfer to receiver substrate

Selective micro device transfer to receiver substrate

Chip transferring method and the apparatus thereof

Photoelectric device

Method for controlling flatness, method for forming coating film, a...

Die ejector height adjustment

Patents Applicationslast 30 patents

TRANSFER SUBSTRATE AND LIGHT EMITTING DIODE TRANSFER METHOD USING T...

METHOD AND DEVICE FOR PRODUCING AND PREPARING ELECTRONIC COMPONENTS

WAFER PROCESSING METHOD

SELECTIVE TRANSFER OF MICRO DEVICES

MICRODEVICE TRANSFER SETUP AND INTEGRATION OF MICRO-DEVICES INTO SY...

Die Ejector

CHIP TRANSFERRING METHOD AND THE APPARATUS THEREOF

HETEROGENEOUS INTEGRATION OF COMPONENTS ONTO COMPACT DEVICES USING...

Selective photo-induced transfer of good micro leds

TRANSFER OF MICRO DEVICES

DISPLAY APPARATUS AND MANUFACTURING METHOD THEREOF

TRANSFER OF MICRO DEVICES

MICRO DEVICE, MICRO DEVICE ALIGNMENT APPARATUS, AND ALIGNMENT METHO...

DIE PROCESSING

THIN DIE RELEASE FOR SEMICONDUCTOR DEVICE ASSEMBLY

DISPLAY APPARATUS AND MANUFACTURING METHOD THEREOF

INTEGRATION OF MICRODEVICES INTO SYSTEM SUBSTRATE

CHIP TRANSFERRING METHOD AND THE APPARATUS THEREOF

Transfer System and Transfer Method

MICRO DEVICE INTEGRATION INTO SYSTEM SUBSTRATE

INTEGRATION OF MICRODEVICES INTO SYSTEM SUBSTRATE

Method for Selecting Semiconductor Components

METHOD FOR TRANSFERRING ELECTRONIC ELEMENTS

DISPLAY APPARATUS AND MANUFACTURING METHOD THEREOF

HETEROGENEOUS STRUCTURES AND PROCESSING METHODS

Mask Design for Improved Attach Position

A PHOTOSENSITIVE TRANSFER RESIN FOR TRANSFERRING AN LED CHIP, A MET...

MATERIAL FOR POSITIONAL ERROR COMPENSATION IN ASSEMBLY OF DISCRETE...

Mask Design for Improved Attach Position

CARRIER FOR MICROELECTRONIC ASSEMBLIES HAVING DIRECT BONDING