Backside treatment

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CPC
H01L21/02016

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/02016Backside treatment

Industries

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Patents Grantslast 30 patents

Information Patent Grant
SiC wafer and manufacturing method for SiC wafer
- Patent number 12,139,813
- Issue date Nov 12, 2024
- Toyota Tsusho Corporation
- Masatake Nagaya
- C30 - CRYSTAL GROWTH
Information Patent Grant
Method for wafer backside polishing
- Patent number 12,131,896
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Kei-Wei Chen
- B08 - CLEANING
Information Patent Grant
Semiconductor device and method of fabricating the same
- Patent number 12,094,704
- Issue date Sep 17, 2024
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Le Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of processing a substrate
- Patent number 12,094,751
- Issue date Sep 17, 2024
- Disco Corporation
- Karl Heinz Priewasser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of printing laser mark and method of producing laser-marked...
- Patent number 12,083,624
- Issue date Sep 10, 2024
- Sumco Corporation
- Yoichiro Hirakawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods and apparatus for forming backside power rails
- Patent number 12,002,705
- Issue date Jun 4, 2024
- Applied Materials, Inc.
- He Ren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and devices related to radio frequency devices
- Patent number 11,948,802
- Issue date Apr 2, 2024
- Infineon Technologies Dresden GmbH & Co. KG
- Hans Taddiken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for processing a wide band gap semiconductor wafer using a...
- Patent number 11,887,894
- Issue date Jan 30, 2024
- Infineon Technologies AG
- Francisco Javier Santos Rodriguez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer stress control using backside film deposition and laser anneal
- Patent number 11,842,911
- Issue date Dec 12, 2023
- Yangtze Memory Technologies Co., Ltd.
- Pengan Yin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside metallized compound semiconductor device and method for ma...
- Patent number 11,823,891
- Issue date Nov 21, 2023
- Xiamen Sanan Integrated Circuit Co., Ltd.
- Tsung-Te Chiu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for creating cavities in silicon carbide and other semicondu...
- Patent number 11,756,783
- Issue date Sep 12, 2023
- HRL Laboratories, LLC
- Eric Prophet
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of double-side polishing semiconductor wafer
- Patent number 11,731,234
- Issue date Aug 22, 2023
- Sumco Corporation
- Mami Kubota
- B24 - GRINDING POLISHING
Information Patent Grant
Semiconductor wafer with modified surface and fabrication method th...
- Patent number 11,682,549
- Issue date Jun 20, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yao-Wen Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method, control system, and system for machining a semiconductor wa...
- Patent number 11,658,022
- Issue date May 23, 2023
- Siltronic AG
- Axel Beyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of processing a wafer
- Patent number 11,626,324
- Issue date Apr 11, 2023
- Disco Corporation
- Karl Heinz Priewasser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of electrochemically processing a substrate and integrated c...
- Patent number 11,538,689
- Issue date Dec 27, 2022
- Universite Catholique De Louvain
- Gilles Scheen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing backside metalized compound semiconductor...
- Patent number 11,264,231
- Issue date Mar 1, 2022
- Xiamen Sanan Integrated Circuit Co., Ltd.
- Tsung-Te Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for removing a sacrificial layer on semiconductor wafers
- Patent number 11,257,679
- Issue date Feb 22, 2022
- STMicroelectronics Pte Ltd
- Tien Choy Loh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer thinning method and wafer structure
- Patent number 11,227,760
- Issue date Jan 18, 2022
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Hongsheng Yi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and devices related to radio frequency devices
- Patent number 11,217,453
- Issue date Jan 4, 2022
- Infineon Technologies Dresden GmbH & Co. KG
- Hans Taddiken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for a transducer in an EWLB package
- Patent number 11,211,298
- Issue date Dec 28, 2021
- Infineon Technologies AG
- Stephan Pindl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of processing a semiconductor wafer
- Patent number 11,189,518
- Issue date Nov 30, 2021
- Advanced Semiconductor Engineering, Inc.
- Yan Ting Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of processing a wafer
- Patent number 11,133,219
- Issue date Sep 28, 2021
- Disco Corporation
- Karl Heinz Priewasser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing carrier and method of polishing wafer
- Patent number 11,127,584
- Issue date Sep 21, 2021
- Sumco Corporation
- Shunsuke Mikuriya
- B24 - GRINDING POLISHING
Information Patent Grant
Method of treating semiconductor substrate
- Patent number 11,127,583
- Issue date Sep 21, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chung-Hao Chang
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Multi-chip package structures formed by joining chips to pre-positi...
- Patent number 11,114,410
- Issue date Sep 7, 2021
- International Business Machines Corporation
- Joshua M. Rubin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for processing a wide band gap semiconductor wafer, methods...
- Patent number 11,107,732
- Issue date Aug 31, 2021
- Infineon Technologies AG
- Francisco Javier Santos Rodriguez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Processing method for wafer
- Patent number 11,094,523
- Issue date Aug 17, 2021
- Disco Corporation
- Xin Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Monocrystalline semiconductor wafer and method for producing a semi...
- Patent number 11,075,070
- Issue date Jul 27, 2021
- Siltronic AG
- Klaus Roettger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thinned semiconductor wafer
- Patent number 11,018,092
- Issue date May 25, 2021
- Semiconductor Components Industries, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
N-TYPE DOUBLE-SIDED SOLAR CELL PREPARATION METHOD
- Publication number 20240405151
- Publication date Dec 5, 2024
- Tongwei Solar (Meishan) Co., Ltd.
- Wenzhou XU
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR WAFER BACKSIDE POLISHING
- Publication number 20240387162
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- KEI-WEI CHEN
- B24 - GRINDING POLISHING
Information Patent Application
CARRIER STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20240282761
- Publication date Aug 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Zheng Yong Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE COMPRISING AN ELECTRICALLY CONDUCTIVE BONDI...
- Publication number 20240266172
- Publication date Aug 8, 2024
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Frédéric Allibert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRE-STACKING MECHANICAL STRENGTH ENHANCEMENT OF POWER DEVICE STRUCT...
- Publication number 20240186285
- Publication date Jun 6, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Yusheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND DEVICES RELATED TO RADIO FREQUENCY DEVICES
- Publication number 20240145253
- Publication date May 2, 2024
- Infineon Technologies Dresden GmbH & Co., KG
- Hans Taddiken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESSING METHOD OF BONDED WAFER AND PROCESSING APPARATUS
- Publication number 20240112902
- Publication date Apr 4, 2024
- Disco Corporation
- Hayato IGA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BACKSIDE METALLIZED COMPOUND SEMICONDUCTOR DEVICE AND METHOD FOR MA...
- Publication number 20240087877
- Publication date Mar 14, 2024
- XIAMEN SANAN INTEGRATED CIRCUIT CO., LTD.
- Tsung-Te CHIU
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
A METHOD FOR FABRICATING SEMICONDUCTOR ARTICLES AND SYSTEM THEREOF
- Publication number 20240038525
- Publication date Feb 1, 2024
- Inari Technology Sdn Bhd
- BOON SENG TEOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COATING COMPOSITION FOR WAFER PROTECTION AND METHOD OF MANUFACTURIN...
- Publication number 20240038551
- Publication date Feb 1, 2024
- Samsung Electronics Co., Ltd.
- Woojung PARK
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20230377885
- Publication date Nov 23, 2023
- NANYA TECHNOLOGY CORPORATION
- Shing-Yih SHIH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING WAFER HAVING FUNCTIONAL FILM
- Publication number 20230369037
- Publication date Nov 16, 2023
- NISSAN CHEMICAL CORPORATION
- Tomoya OHASHI
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
METHODS AND APPARATUS FOR FORMING BACKSIDE POWER RAILS
- Publication number 20230260825
- Publication date Aug 17, 2023
- He REN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGING METHOD
- Publication number 20230207303
- Publication date Jun 29, 2023
- Semiconductor Manufacturing International (Beijing) Corporation
- Qingzhao LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD, CONTROL SYSTEM, AND SYSTEM FOR MACHINING A SEMICONDUCTOR WA...
- Publication number 20230170206
- Publication date Jun 1, 2023
- Siltronic AG
- Axel BEYER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CMP PROCESS APPLIED TO A THIN SIC WAFER FOR STRESS RELEASE AND DAMA...
- Publication number 20230128739
- Publication date Apr 27, 2023
- STMicroelectronics S.r.l.
- Agata GRASSO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PROCESSING A SUBSTRATE
- Publication number 20230072652
- Publication date Mar 9, 2023
- Disco Corporation
- Karl Heinz Priewasser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR WAFER BACKSIDE POLISHING
- Publication number 20230064958
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing company Ltd.
- KEI-WEI CHEN
- B08 - CLEANING
Information Patent Application
WAFER STRESS CONTROL USING BACKSIDE FILM DEPOSITION AND LASER ANNEAL
- Publication number 20230062866
- Publication date Mar 2, 2023
- YANGTZE MEMORY TECHNOLOGIES CO., LTD.
- Pengan Yin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING A SEMICONDUCTOR DE...
- Publication number 20230005756
- Publication date Jan 5, 2023
- Qorvo US, Inc.
- Krishna Chetry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20220415644
- Publication date Dec 29, 2022
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Le LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PRINTING LASER MARK AND METHOD OF PRODUCING LASER-MARKED...
- Publication number 20220331906
- Publication date Oct 20, 2022
- SUMCO CORPORATION
- Yoichiro HIRAKAWA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
INDIUM PHOSPHIDE SUBSTRATE
- Publication number 20220208549
- Publication date Jun 30, 2022
- JX NIPPON MINING & METALS CORPORATION
- Shunsuke OKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACK GRINDING ADHESIVE SHEET, AND METHOD FOR MANUFACTURING SEMICOND...
- Publication number 20220148905
- Publication date May 12, 2022
- DISCO CORPORATION
- Karl Heinz Priewasser
- B24 - GRINDING POLISHING
Information Patent Application
SUBSTRATE HANDLING SYSTEMS AND METHODS FOR CMP PROCESSING
- Publication number 20220072682
- Publication date Mar 10, 2022
- Applied Materials, Inc.
- Jeonghoon OH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Cleaning Fluid, Method of Cleaning Semiconductor Wafer, and Method...
- Publication number 20220028681
- Publication date Jan 27, 2022
- MITSUBISHI CHEMICAL CORPORATION
- Toshiaki Shibata
- C11 - ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES FATTY ACIDS...
Information Patent Application
METHOD, CONTROL SYSTEM, AND SYSTEM FOR MACHINING A SEMICONDUCTOR WA...
- Publication number 20210358737
- Publication date Nov 18, 2021
- Siltronic AG
- Axel BEYER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for Processing a Wide Band Gap Semiconductor Wafer Using a...
- Publication number 20210351077
- Publication date Nov 11, 2021
- Francisco Javier Santos Rodriguez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SiC WAFER AND MANUFACTURING METHOD FOR SiC WAFER
- Publication number 20210301421
- Publication date Sep 30, 2021
- Denso Corporation
- Masatake NAGAYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PROCESSING A WAFER
- Publication number 20210183704
- Publication date Jun 17, 2021
- Disco Corporation
- Karl Heinz PRIEWASSER
- H01 - BASIC ELECTRIC ELEMENTS

Backside treatment

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

SiC wafer and manufacturing method for SiC wafer

Method for wafer backside polishing

Semiconductor device and method of fabricating the same

Method of processing a substrate

Method of printing laser mark and method of producing laser-marked...

Methods and apparatus for forming backside power rails

Methods and devices related to radio frequency devices

Methods for processing a wide band gap semiconductor wafer using a...

Wafer stress control using backside film deposition and laser anneal

Backside metallized compound semiconductor device and method for ma...

Method for creating cavities in silicon carbide and other semicondu...

Method of double-side polishing semiconductor wafer

Semiconductor wafer with modified surface and fabrication method th...

Method, control system, and system for machining a semiconductor wa...

Method of processing a wafer

Method of electrochemically processing a substrate and integrated c...

Method for manufacturing backside metalized compound semiconductor...

Method for removing a sacrificial layer on semiconductor wafers

Wafer thinning method and wafer structure

Methods and devices related to radio frequency devices

System and method for a transducer in an EWLB package

Method of processing a semiconductor wafer

Method of processing a wafer

Method of producing carrier and method of polishing wafer

Method of treating semiconductor substrate

Multi-chip package structures formed by joining chips to pre-positi...

Methods for processing a wide band gap semiconductor wafer, methods...

Processing method for wafer

Monocrystalline semiconductor wafer and method for producing a semi...

Thinned semiconductor wafer

Patents Applicationslast 30 patents

N-TYPE DOUBLE-SIDED SOLAR CELL PREPARATION METHOD

METHOD FOR WAFER BACKSIDE POLISHING

CARRIER STRUCTURE AND METHODS OF FORMING THE SAME

SEMICONDUCTOR STRUCTURE COMPRISING AN ELECTRICALLY CONDUCTIVE BONDI...

PRE-STACKING MECHANICAL STRENGTH ENHANCEMENT OF POWER DEVICE STRUCT...

METHODS AND DEVICES RELATED TO RADIO FREQUENCY DEVICES

PROCESSING METHOD OF BONDED WAFER AND PROCESSING APPARATUS

BACKSIDE METALLIZED COMPOUND SEMICONDUCTOR DEVICE AND METHOD FOR MA...

A METHOD FOR FABRICATING SEMICONDUCTOR ARTICLES AND SYSTEM THEREOF

COATING COMPOSITION FOR WAFER PROTECTION AND METHOD OF MANUFACTURIN...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

METHOD FOR MANUFACTURING WAFER HAVING FUNCTIONAL FILM

METHODS AND APPARATUS FOR FORMING BACKSIDE POWER RAILS

SEMICONDUCTOR PACKAGING METHOD

METHOD, CONTROL SYSTEM, AND SYSTEM FOR MACHINING A SEMICONDUCTOR WA...

CMP PROCESS APPLIED TO A THIN SIC WAFER FOR STRESS RELEASE AND DAMA...

METHOD OF PROCESSING A SUBSTRATE

METHOD FOR WAFER BACKSIDE POLISHING

WAFER STRESS CONTROL USING BACKSIDE FILM DEPOSITION AND LASER ANNEAL

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING A SEMICONDUCTOR DE...

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

METHOD OF PRINTING LASER MARK AND METHOD OF PRODUCING LASER-MARKED...

INDIUM PHOSPHIDE SUBSTRATE

BACK GRINDING ADHESIVE SHEET, AND METHOD FOR MANUFACTURING SEMICOND...

SUBSTRATE HANDLING SYSTEMS AND METHODS FOR CMP PROCESSING

Cleaning Fluid, Method of Cleaning Semiconductor Wafer, and Method...

METHOD, CONTROL SYSTEM, AND SYSTEM FOR MACHINING A SEMICONDUCTOR WA...

Methods for Processing a Wide Band Gap Semiconductor Wafer Using a...

SiC WAFER AND MANUFACTURING METHOD FOR SiC WAFER

METHOD OF PROCESSING A WAFER