Barrier, adhesion or liner layers

Industry

CPC
H01L2221/1073

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2221/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00

Current Industry

H01L2221/1073Barrier, adhesion or liner layers

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Metal contact structure and method of forming the same in a semicon...
- Patent number 11,854,874
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible and stretchable interconnects for flexible systems
- Patent number 11,538,764
- Issue date Dec 27, 2022
- The Regents of the University of California
- Subramanian S. Iyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pressurizing members for semiconductor package
- Patent number 11,362,021
- Issue date Jun 14, 2022
- JMJ KOREA CO., LTD.
- Yun Hwa Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for fabricating the same
- Patent number 11,133,248
- Issue date Sep 28, 2021
- XIA TAI XIN SEMICONDUCTOR (QING DAO) LTD.
- Hyunyoung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Treatment to interface between metal film and BARC or photoresist
- Patent number 11,081,365
- Issue date Aug 3, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chung-Hao Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices with conductive contacts to silicide region...
- Patent number 11,043,414
- Issue date Jun 22, 2021
- Micron Technology, Inc.
- Kenichi Kusumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for forming silicon oxide film on tungsten film
- Patent number 10,636,649
- Issue date Apr 28, 2020
- Tokyo Electron Limited
- Kyungseok Ko
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Package structure
- Patent number 9,728,498
- Issue date Aug 8, 2017
- Taiwan Semiconductor Manufacturing Co., Ltd
- An-Jhih Su
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Metal Contact Structure and Method of Forming the Same in a Semicon...
- Publication number 20240087953
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRESSURIZED SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20210280501
- Publication date Sep 9, 2021
- JMJ KOREA CO., LTD.
- Yun Hwa CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR FABRICATING THE SAME
- Publication number 20210143097
- Publication date May 13, 2021
- XIA TAI XIN SEMICONDUCTOR (QING DAO) LTD.
- HYUNYOUNG KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE AND STRETCHABLE INTERCONNECTS FOR FLEXIBLE SYSTEMS
- Publication number 20210074648
- Publication date Mar 11, 2021
- The Regents of the University of California
- Subramanian S. IYER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR FORMING SILICON OXIDE FILM ON TUNGSTEN FILM
- Publication number 20190043712
- Publication date Feb 7, 2019
- TOKYO ELECTRON LIMITED
- Kyungseok KO
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Barrier, adhesion or liner layers

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Metal contact structure and method of forming the same in a semicon...

Flexible and stretchable interconnects for flexible systems

Pressurizing members for semiconductor package

Semiconductor structure and method for fabricating the same

Treatment to interface between metal film and BARC or photoresist

Microelectronic devices with conductive contacts to silicide region...

Method and apparatus for forming silicon oxide film on tungsten film

Package structure

Patents Applicationslast 30 patents

Metal Contact Structure and Method of Forming the Same in a Semicon...

PRESSURIZED SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR STRUCTURE AND METHOD FOR FABRICATING THE SAME

FLEXIBLE AND STRETCHABLE INTERCONNECTS FOR FLEXIBLE SYSTEMS

METHOD AND APPARATUS FOR FORMING SILICON OXIDE FILM ON TUNGSTEN FILM