Barrier, adhesion or liner layers

Industry

CPC
H01L21/76841

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/76841Barrier, adhesion or liner layers

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device with contact structure
- Patent number 12,170,246
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chung-Liang Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gate structure and semiconductor device having the same
- Patent number 12,166,126
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Chieh Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,165,916
- Issue date Dec 10, 2024
- Samsung Electronics Co., Ltd.
- Won Keun Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for fabricating a semiconductor...
- Patent number 12,159,836
- Issue date Dec 3, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Chih-Cheng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method of manufacturing the same
- Patent number 12,154,823
- Issue date Nov 26, 2024
- Renesas Electronics Corporation
- Katsuhiko Hotta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shutter disk
- Patent number 12,148,629
- Issue date Nov 19, 2024
- Applied Materials, Inc.
- Kang Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing electronic device
- Patent number 12,142,522
- Issue date Nov 12, 2024
- Mitsui Chemicals Tohcello, Inc.
- Toru Miura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method of semiconductor device
- Patent number 12,125,794
- Issue date Oct 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Hang Tung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing memory using pseudo bit line structures an...
- Patent number 12,127,398
- Issue date Oct 22, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Er-Xuan Ping
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with composite conductive features and method...
- Patent number 12,125,744
- Issue date Oct 22, 2024
- NANYA TECHNOLOGY CORPORATION
- Tzu-Ching Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device, method and system to prevent pattern collapse in a semicond...
- Patent number 12,113,012
- Issue date Oct 8, 2024
- Intel Corporation
- Errol Todd Ryan
- G11 - INFORMATION STORAGE
Information Patent Grant
Atomic layer deposition of barrier metal layer for electrode of gal...
- Patent number 12,112,983
- Issue date Oct 8, 2024
- MACOM Technology Solutions Holdings, Inc.
- Timothy E. Boles
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ruthenium-based liner for a copper interconnect
- Patent number 12,094,770
- Issue date Sep 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yao-Min Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out interconnect integration processes and structures
- Patent number 12,074,106
- Issue date Aug 27, 2024
- Applied Materials, Inc.
- Richard W. Plavidal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of active device substrate
- Patent number 12,057,347
- Issue date Aug 6, 2024
- Au Optronics Corporation
- Yi-Yueh Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid via interconnect structure
- Patent number 12,051,643
- Issue date Jul 30, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Chin-Lung Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device
- Patent number 12,040,308
- Issue date Jul 16, 2024
- SK hynix Inc.
- Jin Woong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for manufacturing same
- Patent number 12,040,227
- Issue date Jul 16, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Jingwen Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure and methods of forming the same
- Patent number 12,033,889
- Issue date Jul 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsin-Yen Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
BEOL etch stop layer without capacitance penalty
- Patent number 12,027,416
- Issue date Jul 2, 2024
- International Business Machines Corporation
- Chanro Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, stacked semiconductor device and manufacturin...
- Patent number 12,002,761
- Issue date Jun 4, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Hang Tung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Controlling threshold voltages through blocking layers
- Patent number 11,961,732
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Ching Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-region diffusion barrier containing titanium, silicon and nit...
- Patent number 11,942,365
- Issue date Mar 26, 2024
- Eugenus, Inc.
- Vinayak Veer Vats
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor device with programmable unit
- Patent number 11,916,019
- Issue date Feb 27, 2024
- NANYA TECHNOLOGY CORPORATION
- Te-Yin Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Protection liner on interconnect wire to enlarge processing window...
- Patent number 11,908,794
- Issue date Feb 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shin-Yi Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned contact air gap formation
- Patent number 11,901,408
- Issue date Feb 13, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kai-Hsuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through silicon via structure for three-dimensional integrated circ...
- Patent number 11,887,912
- Issue date Jan 30, 2024
- Fudan University
- Bao Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
SOI active transfer board for three-dimensional packaging and prepa...
- Patent number 11,881,442
- Issue date Jan 23, 2024
- Shanghai Integrated Circuit Manufacturing Innovation Center Co., Ltd.
- Bao Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shutter disk
- Patent number 11,862,480
- Issue date Jan 2, 2024
- Applied Materials, Inc.
- Kang Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for forming a semiconductor device
- Patent number 11,842,938
- Issue date Dec 12, 2023
- Infineon Technologies AG
- Jens Peter Konrath
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ATOMIC LAYER DEPOSITION OF BARRIER METAL LAYER FOR ELECTRODE OF GAL...
- Publication number 20240420995
- Publication date Dec 19, 2024
- MACOM Technology Solutions Holdings, Inc.
- Timothy E. Boles
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH CONTACT STRUCTURE
- Publication number 20240387356
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chung-Liang Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RUTHENIUM-BASED LINER FOR A COPPER INTERCONNECT
- Publication number 20240387256
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yao-Min LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20240379569
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hang TUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE PROCESSING...
- Publication number 20240344194
- Publication date Oct 17, 2024
- Kokusai Electric Corporation
- Atsuhiko ASHITANI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
TiN ETCHANT COMPOSITION AND METHOD OF FORMING SEMICONDUCTOR DEVICE
- Publication number 20240336839
- Publication date Oct 10, 2024
- SAMSUNG ELECTRONICS CO,. LTD.
- GAYOUNG SONG
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SELECTIVE CONTACT ON SOURCE AND DRAIN
- Publication number 20240321965
- Publication date Sep 26, 2024
- QUALCOMM Incorporated
- Junjing BAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20240312835
- Publication date Sep 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsin-Yen HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUPER VIA WITHIN BACKSIDE LEVEL
- Publication number 20240290688
- Publication date Aug 29, 2024
- International Business Machines Corporation
- Tsung-Sheng Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH COMPOSITE CONDUCTIVE FEATURES AND METHOD...
- Publication number 20240258159
- Publication date Aug 1, 2024
- NANYA TECHNOLOGY CORPORATION
- TZU-CHING TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH COMPOSITE CONDUCTIVE FEATURES AND METHOD...
- Publication number 20240249975
- Publication date Jul 25, 2024
- NANYA TECHNOLOGY CORPORATION
- TZU-CHING TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRON-ENHANCED ATOMIC LAYER DEPOSITION (EE-ALD) METHODS AND DEVI...
- Publication number 20240240317
- Publication date Jul 18, 2024
- The Regents of the University of Colorado, a Body Corporate
- Steven George
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Ru Liner above a Barrier Layer
- Publication number 20240234204
- Publication date Jul 11, 2024
- Zhaoxuan WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GRAPHENE COATED INTERCONNECTS WITH AIRGAP STRUCTURES
- Publication number 20240222278
- Publication date Jul 4, 2024
- International Business Machines Corporation
- Takeshi Nogami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTROLLING THRESHOLD VOLTAGES THROUGH BLOCKING LAYERS
- Publication number 20240222108
- Publication date Jul 4, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chia-Ching Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED CONTACT AIR GAP FORMATION
- Publication number 20240186372
- Publication date Jun 6, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kai-Hsuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240178138
- Publication date May 30, 2024
- Samsung Electronics Co., Ltd.
- Yong Jin SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL THIN-FILM PRECURSOR COMPOSITION, METHOD OF FORMING THIN FILM...
- Publication number 20240145301
- Publication date May 2, 2024
- Soulbrain Co., LTD
- Chang Bong YEON
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Buffer Layer for Dielectric Protection in Physical Vapor Deposition...
- Publication number 20240145300
- Publication date May 2, 2024
- Sahil PATEL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROTECTION LINER ON INTERCONNECT WIRE TO ENLARGE PROCESSING WINDOW...
- Publication number 20240145381
- Publication date May 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shin-Yi Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Ru Liner above a Barrier Layer
- Publication number 20240136223
- Publication date Apr 25, 2024
- Zhaoxuan WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Shutter Disk
- Publication number 20240087913
- Publication date Mar 14, 2024
- Applied Materials, Inc.
- Kang Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH REDISTRIBUTION STRUCTURE AND METHOD FOR F...
- Publication number 20240047448
- Publication date Feb 8, 2024
- NANYA TECHNOLOGY CORPORATION
- TSE-YAO HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SURFACE FINISH STRUCTURE OF MULTI-LAYER SUBSTRATE AND METHOD FOR MA...
- Publication number 20240047392
- Publication date Feb 8, 2024
- Princo Corp.
- Pei-Liang CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING SEMICONDUCTOR DEVICE WITH REDISTRIBUTION STR...
- Publication number 20240047447
- Publication date Feb 8, 2024
- NANYA TECHNOLOGY CORPORATION
- TSE-YAO HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH POROUS DIELECTRIC LAYERS AND METHOD FOR F...
- Publication number 20240030133
- Publication date Jan 25, 2024
- NANYA TECHNOLOGY CORPORATION
- TSE-YAO HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH POROUS DIELECTRIC LAYERS AND METHOD FOR F...
- Publication number 20240030132
- Publication date Jan 25, 2024
- NANYA TECHNOLOGY CORPORATION
- TSE-YAO HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of Performing Chemical-Mechanical Polishing Process in Semi...
- Publication number 20230386910
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Co., LTD
- Shih-Kang Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND A SEMICONDUCTOR...
- Publication number 20230387306
- Publication date Nov 30, 2023
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPNAY, LTD.
- Blandine DURIEZ
- B82 - NANO-TECHNOLOGY
Information Patent Application
Semiconductor Device Having Backside Interconnect Structure on Thr...
- Publication number 20230386976
- Publication date Nov 30, 2023
- Yung-Chi Lin
- H01 - BASIC ELECTRIC ELEMENTS

Barrier, adhesion or liner layers

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device with contact structure

Gate structure and semiconductor device having the same

Semiconductor device

Semiconductor structure and method for fabricating a semiconductor...

Semiconductor device and a method of manufacturing the same

Shutter disk

Method for manufacturing electronic device

Semiconductor device and manufacturing method of semiconductor device

Method for manufacturing memory using pseudo bit line structures an...

Semiconductor device with composite conductive features and method...

Device, method and system to prevent pattern collapse in a semicond...

Atomic layer deposition of barrier metal layer for electrode of gal...

Ruthenium-based liner for a copper interconnect

Fan-out interconnect integration processes and structures

Manufacturing method of active device substrate

Hybrid via interconnect structure

Method of manufacturing a semiconductor device

Semiconductor structure and method for manufacturing same

Semiconductor device structure and methods of forming the same

BEOL etch stop layer without capacitance penalty

Semiconductor device, stacked semiconductor device and manufacturin...

Controlling threshold voltages through blocking layers

Multi-region diffusion barrier containing titanium, silicon and nit...

Method for fabricating semiconductor device with programmable unit

Protection liner on interconnect wire to enlarge processing window...

Self-aligned contact air gap formation

Through silicon via structure for three-dimensional integrated circ...

SOI active transfer board for three-dimensional packaging and prepa...

Shutter disk

Semiconductor device and method for forming a semiconductor device

Patents Applicationslast 30 patents

ATOMIC LAYER DEPOSITION OF BARRIER METAL LAYER FOR ELECTRODE OF GAL...

SEMICONDUCTOR DEVICE WITH CONTACT STRUCTURE

RUTHENIUM-BASED LINER FOR A COPPER INTERCONNECT

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE PROCESSING...

TiN ETCHANT COMPOSITION AND METHOD OF FORMING SEMICONDUCTOR DEVICE

SELECTIVE CONTACT ON SOURCE AND DRAIN

SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME

SUPER VIA WITHIN BACKSIDE LEVEL

SEMICONDUCTOR DEVICE WITH COMPOSITE CONDUCTIVE FEATURES AND METHOD...

SEMICONDUCTOR DEVICE WITH COMPOSITE CONDUCTIVE FEATURES AND METHOD...

ELECTRON-ENHANCED ATOMIC LAYER DEPOSITION (EE-ALD) METHODS AND DEVI...

Ru Liner above a Barrier Layer

GRAPHENE COATED INTERCONNECTS WITH AIRGAP STRUCTURES

CONTROLLING THRESHOLD VOLTAGES THROUGH BLOCKING LAYERS

SELF-ALIGNED CONTACT AIR GAP FORMATION

SEMICONDUCTOR DEVICE

METAL THIN-FILM PRECURSOR COMPOSITION, METHOD OF FORMING THIN FILM...

Buffer Layer for Dielectric Protection in Physical Vapor Deposition...

PROTECTION LINER ON INTERCONNECT WIRE TO ENLARGE PROCESSING WINDOW...

Ru Liner above a Barrier Layer

Shutter Disk

SEMICONDUCTOR DEVICE WITH REDISTRIBUTION STRUCTURE AND METHOD FOR F...

SURFACE FINISH STRUCTURE OF MULTI-LAYER SUBSTRATE AND METHOD FOR MA...

METHOD FOR FABRICATING SEMICONDUCTOR DEVICE WITH REDISTRIBUTION STR...

SEMICONDUCTOR DEVICE WITH POROUS DIELECTRIC LAYERS AND METHOD FOR F...

SEMICONDUCTOR DEVICE WITH POROUS DIELECTRIC LAYERS AND METHOD FOR F...

Methods of Performing Chemical-Mechanical Polishing Process in Semi...

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND A SEMICONDUCTOR...

Semiconductor Device Having Backside Interconnect Structure on Thr...