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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method of forming compliant conductive int...
- Patent number 9,245,834
- Issue date Jan 26, 2016
- STATS ChipPAC, Ltd.
- Ming-Che Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated antennas in wafer level package
- Patent number 9,064,787
- Issue date Jun 23, 2015
- Infineon Technologies AG
- Josef Boeck
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated antennas in wafer level package
- Patent number 8,451,618
- Issue date May 28, 2013
- Infineon Technologies AG
- Josef Boeck
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated (multilayer) circuits and process of producing the same
- Patent number 8,138,019
- Issue date Mar 20, 2012
- Toyota Motor Engineering & Manufactruing North America, Inc.
- Sang Won Yoon
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method and apparatus for improving thermal energy dissipation in a...
- Patent number 7,817,434
- Issue date Oct 19, 2010
- Agere Systems Inc.
- James M. Hattis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Device and Method of Forming Compliant Conductive Int...
- Publication number 20130241071
- Publication date Sep 19, 2013
- STATS ChipPAC, Ltd.
- Ming-Che Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Antennas in Wafer Level Package
- Publication number 20130241059
- Publication date Sep 19, 2013
- INFINEON TECHNOLOGIES AG
- Josef Boeck
- G01 - MEASURING TESTING
Information Patent Application
INTEGRATED ANTENNAS IN WAFER LEVEL PACKAGE
- Publication number 20120104574
- Publication date May 3, 2012
- INFINEON TECHNOLOGIES AG
- Josef Boeck
- G01 - MEASURING TESTING
Information Patent Application
INTEGRATED (MULTILAYER) CIRCUITS AND PROCESS OF PRODUCING THE SAME
- Publication number 20110101533
- Publication date May 5, 2011
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Sang Won Yoon
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method and apparatus for improving thermal energy dissipation in a...
- Publication number 20060211461
- Publication date Sep 21, 2006
- Agere Systems Inc.
- James M. Hattis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR