Batch processes

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H01L24/93

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto

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H01L24/93Batch processes

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Suspended semiconductor dies
- Patent number 12,074,095
- Issue date Aug 27, 2024
- Texas Instruments Incorporated
- Barry Jon Male
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical redundancy for bonded structures
- Patent number 12,046,583
- Issue date Jul 23, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display panel, preparation method thereof, and display device
- Patent number 12,033,974
- Issue date Jul 9, 2024
- Shanghai Tianma Micro-Electronics Co,. Ltd.
- Quanpeng Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical redundancy for bonded structures
- Patent number 11,842,894
- Issue date Dec 12, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing semiconductor device
- Patent number 11,798,905
- Issue date Oct 24, 2023
- Lapis Semiconductor Co., Ltd.
- Takashi Shimada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Suspended semiconductor dies
- Patent number 11,495,522
- Issue date Nov 8, 2022
- Texas Instruments Incorporated
- Barry Jon Male
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip device, method of manufacturing a multi-chip device, and...
- Patent number 11,488,921
- Issue date Nov 1, 2022
- Infineon Technologies AG
- Ali Roshanghias
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for making redistribution circuit structure
- Patent number 11,037,803
- Issue date Jun 15, 2021
- Century Technology (Shenzhen) Corporation Limited
- Yung-Fu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro device stabilization post
- Patent number 11,011,390
- Issue date May 18, 2021
- Apple Inc.
- Hsin-Hua Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for transferring and placing a semiconductor device on a sub...
- Patent number 10,910,342
- Issue date Feb 2, 2021
- Imec VZW
- Maria Op de Beeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Workpiece processing method
- Patent number 10,861,712
- Issue date Dec 8, 2020
- Disco Corporation
- Tsubasa Obata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro device stabilization post
- Patent number 10,424,493
- Issue date Sep 24, 2019
- Apple Inc.
- Hsin-Hua Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vacuum lamination method for forming a conformally coated article a...
- Patent number 10,153,409
- Issue date Dec 11, 2018
- Dow Silicones Corporation
- Michelle R. Cummings
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid bonding with air-gap structure
- Patent number 9,960,142
- Issue date May 1, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Szu-Ying Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Occam process for components having variations in part dimensions
- Patent number 9,894,771
- Issue date Feb 13, 2018
- Joseph Charles Fjelstad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Air trench in packages incorporating hybrid bonding
- Patent number 9,786,628
- Issue date Oct 10, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Bruce C. S. Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating electronic device package
- Patent number 9,771,259
- Issue date Sep 26, 2017
- Xintec Inc.
- Chien-Hung Liu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Micro device stabilization post
- Patent number 9,741,592
- Issue date Aug 22, 2017
- Apple Inc.
- Hsin-Hua Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro electro mechanical system, semiconductor device, and manufact...
- Patent number 9,597,933
- Issue date Mar 21, 2017
- Semiconductor Energy Laboratory Co., Ltd.
- Mayumi Yamaguchi
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Air trench in packages incorporating hybrid bonding
- Patent number 9,443,796
- Issue date Sep 13, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Bruce C. S. Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low-cost low-profile solder bump process for enabling ultra-thin wa...
- Patent number 9,425,064
- Issue date Aug 23, 2016
- Karthik Thambidurai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device package and fabrication method thereof
- Patent number 9,181,084
- Issue date Nov 10, 2015
- Chien-Hung Liu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor chip bonding apparatus and method of forming semicond...
- Patent number 9,082,885
- Issue date Jul 14, 2015
- Samsung Electronics Co., Ltd.
- Yoshiaki Yukimori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro electro mechanical system, semiconductor device, and manufact...
- Patent number 9,054,227
- Issue date Jun 9, 2015
- Semiconductor Energy Laboratory Co., Ltd.
- Mayumi Yamaguchi
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Method for mounting a semiconductor chip on a carrier
- Patent number 9,034,751
- Issue date May 19, 2015
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reducing delamination between an underfill and a buffer layer in a...
- Patent number 8,963,328
- Issue date Feb 24, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and fabrication method thereof
- Patent number 8,922,026
- Issue date Dec 30, 2014
- Chien-Hung Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro device stabilization post
- Patent number 8,835,940
- Issue date Sep 16, 2014
- LuxVue Technology Corporation
- Hsin-Hua Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro electro mechanical system, semiconductor device, and manufact...
- Patent number 8,822,251
- Issue date Sep 2, 2014
- Semiconductor Energy Laboratory Co., Ltd.
- Mayumi Yamaguchi
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Method for mounting a semiconductor chip on a carrier
- Patent number 8,802,553
- Issue date Aug 12, 2014
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRICAL REDUNDANCY FOR BONDED STRUCTURES
- Publication number 20240136333
- Publication date Apr 25, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOCUMENT STRUCTURE FORMATION
- Publication number 20240105669
- Publication date Mar 28, 2024
- INFINEON TECHNOLOGIES AG
- Jens Pohl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL REDUNDANCY FOR BONDED STRUCTURES
- Publication number 20230420419
- Publication date Dec 28, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUSPENDED SEMICONDUCTOR DIES
- Publication number 20230089201
- Publication date Mar 23, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Barry Jon MALE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUSPENDED SEMICONDUCTOR DIES
- Publication number 20220189857
- Publication date Jun 16, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Barry Jon MALE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20220102300
- Publication date Mar 31, 2022
- LAPIS SEMICONDUCTOR CO., LTD.
- Takashi SHIMADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY PANEL, PREPARATION METHOD THEREOF, AND DISPLAY DEVICE
- Publication number 20220052022
- Publication date Feb 17, 2022
- SHANGHAI TIANMA MICRO-ELECTRONICS CO., LTD.
- Quanpeng YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL REDUNDANCY FOR BONDED STRUCTURES
- Publication number 20210193625
- Publication date Jun 24, 2021
- INVENSAS BONDING TECHNOLOGIES, INC.
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Chip Device, Method of Manufacturing a Multi-Chip Device, and...
- Publication number 20210098410
- Publication date Apr 1, 2021
- INFINEON TECHNOLOGIES AG
- Ali Roshanghias
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MAKING REDISTRIBUTION CIRCUIT STRUCTURE
- Publication number 20200343104
- Publication date Oct 29, 2020
- Century Technology (Shenzhen) Corporation Limited
- YUNG-FU LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Micro Device Stabilization Post
- Publication number 20190371623
- Publication date Dec 5, 2019
- Apple Inc.
- Hsin-Hua Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Burned-in Component Assembly
- Publication number 20190174630
- Publication date Jun 6, 2019
- VNS Portfolio LLC
- Joseph Charles Fjelstad
- B32 - LAYERED PRODUCTS
Information Patent Application
THERMOPLASTIC ELASTOMER (TPE) ADHESIVE CARRIER TAPE
- Publication number 20180166313
- Publication date Jun 14, 2018
- Intel Corporation
- Mingzhi Dai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VACUUM LAMINATION METHOD FOR FORMING A CONFORMALLY COATED ARTICLE A...
- Publication number 20170309799
- Publication date Oct 26, 2017
- Dow Corning Corporation
- MICHELLE R. CUMMINGS
- B32 - LAYERED PRODUCTS
Information Patent Application
SEMICONDUCTOR CHIP BONDING APPARATUS AND METHOD OF FORMING SEMICOND...
- Publication number 20150024551
- Publication date Jan 22, 2015
- Samsung Electronics Co., Ltd.
- Yoshiaki YUKIMORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO ELECTRO MECHANICAL SYSTEM, SEMICONDUCTOR DEVICE, AND MANUFACT...
- Publication number 20140370639
- Publication date Dec 18, 2014
- Mayumi Yamaguchi
- B60 - VEHICLES IN GENERAL
Information Patent Application
MICRO DEVICE STABILIZATION POST
- Publication number 20140363928
- Publication date Dec 11, 2014
- Hsin-Hua Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Mounting a Semiconductor Chip on a Carrier
- Publication number 20140329361
- Publication date Nov 6, 2014
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20140193950
- Publication date Jul 10, 2014
- Xintec Inc.
- Shu-Ming CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BALL GRID ARRAY SEMICONDUCTOR DEVICE AND ITS MANUFACTURE
- Publication number 20140170814
- Publication date Jun 19, 2014
- FUJITSU SEMICONDUCTOR LIMITED
- Hayato OKUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW-COST LOW-PROFILE SOLDER BUMP PROCESS FOR ENABLING ULTRA-THIN WA...
- Publication number 20140167252
- Publication date Jun 19, 2014
- Maxim Integrated Products, Inc.
- Karthik Thambidurai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO DEVICE STABILIZATION POST
- Publication number 20140084240
- Publication date Mar 27, 2014
- Hsin-Hua Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Reducing Delamination Between an Underfill and a Buffer Layer in a...
- Publication number 20140087522
- Publication date Mar 27, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20140017854
- Publication date Jan 16, 2014
- Xintec Inc.
- Ching-Yu NI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METAL-CONTAMINATION-FREE THROUGH-SUBSTRATE VIA STRUCTURE
- Publication number 20130143400
- Publication date Jun 6, 2013
- International Business Machines Corporation
- Mukta G. Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL APPLIED RF SHIELDS
- Publication number 20130093067
- Publication date Apr 18, 2013
- FlipChip International, LLC
- David Clark
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING FULLY EMBEDDED BUMPLESS BUILD-UP LAYER PACKAGES...
- Publication number 20130023088
- Publication date Jan 24, 2013
- Ravi K. Nalla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Doping Minor Elements into Metal Bumps
- Publication number 20120286423
- Publication date Nov 15, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Da Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20120280389
- Publication date Nov 8, 2012
- Chien-Hung Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR COMPONENT
- Publication number 20120282772
- Publication date Nov 8, 2012
- Danfoss Silicon Power GmbH
- Mathias Kock
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Batch processes

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Suspended semiconductor dies

Electrical redundancy for bonded structures

Display panel, preparation method thereof, and display device

Electrical redundancy for bonded structures

Semiconductor device and method for manufacturing semiconductor device

Suspended semiconductor dies

Multi-chip device, method of manufacturing a multi-chip device, and...

Method for making redistribution circuit structure

Micro device stabilization post

Method for transferring and placing a semiconductor device on a sub...

Workpiece processing method

Micro device stabilization post

Vacuum lamination method for forming a conformally coated article a...

Hybrid bonding with air-gap structure

Occam process for components having variations in part dimensions

Air trench in packages incorporating hybrid bonding

Method for fabricating electronic device package

Micro device stabilization post

Micro electro mechanical system, semiconductor device, and manufact...

Air trench in packages incorporating hybrid bonding

Low-cost low-profile solder bump process for enabling ultra-thin wa...

Electronic device package and fabrication method thereof

Semiconductor chip bonding apparatus and method of forming semicond...

Micro electro mechanical system, semiconductor device, and manufact...

Method for mounting a semiconductor chip on a carrier

Reducing delamination between an underfill and a buffer layer in a...

Chip package and fabrication method thereof

Micro device stabilization post

Micro electro mechanical system, semiconductor device, and manufact...

Method for mounting a semiconductor chip on a carrier

Patents Applicationslast 30 patents

ELECTRICAL REDUNDANCY FOR BONDED STRUCTURES

DOCUMENT STRUCTURE FORMATION

ELECTRICAL REDUNDANCY FOR BONDED STRUCTURES

SUSPENDED SEMICONDUCTOR DIES

SUSPENDED SEMICONDUCTOR DIES

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

DISPLAY PANEL, PREPARATION METHOD THEREOF, AND DISPLAY DEVICE

ELECTRICAL REDUNDANCY FOR BONDED STRUCTURES

Multi-Chip Device, Method of Manufacturing a Multi-Chip Device, and...

METHOD FOR MAKING REDISTRIBUTION CIRCUIT STRUCTURE

Micro Device Stabilization Post

Burned-in Component Assembly

THERMOPLASTIC ELASTOMER (TPE) ADHESIVE CARRIER TAPE

VACUUM LAMINATION METHOD FOR FORMING A CONFORMALLY COATED ARTICLE A...

SEMICONDUCTOR CHIP BONDING APPARATUS AND METHOD OF FORMING SEMICOND...

MICRO ELECTRO MECHANICAL SYSTEM, SEMICONDUCTOR DEVICE, AND MANUFACT...

MICRO DEVICE STABILIZATION POST

Method for Mounting a Semiconductor Chip on a Carrier

ELECTRONIC DEVICE PACKAGE AND FABRICATION METHOD THEREOF

BALL GRID ARRAY SEMICONDUCTOR DEVICE AND ITS MANUFACTURE

LOW-COST LOW-PROFILE SOLDER BUMP PROCESS FOR ENABLING ULTRA-THIN WA...

MICRO DEVICE STABILIZATION POST

Reducing Delamination Between an Underfill and a Buffer Layer in a...

CHIP PACKAGE AND FABRICATION METHOD THEREOF

METAL-CONTAMINATION-FREE THROUGH-SUBSTRATE VIA STRUCTURE

WAFER LEVEL APPLIED RF SHIELDS

METHODS OF FORMING FULLY EMBEDDED BUMPLESS BUILD-UP LAYER PACKAGES...

Doping Minor Elements into Metal Bumps

CHIP PACKAGE AND FABRICATION METHOD THEREOF

METHOD OF MANUFACTURING A SEMICONDUCTOR COMPONENT