Batch processing

Industry

CPC
H01L21/561

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/561Batch processing

Industries

Patents Grantslast 30 patents

Information Patent Grant
Multi-faced molded semiconductor package and related methods
- Patent number 12,341,014
- Issue date Jun 24, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Eiji Kurose
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compartmentalized shielding of a module utilizing self-shielded sub...
- Patent number 12,342,518
- Issue date Jun 24, 2025
- Qorvo US, Inc.
- Thomas Scott Morris
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bare-die smart bridge connected with copper pillars for system-in-p...
- Patent number 12,341,096
- Issue date Jun 24, 2025
- Intel Corporation
- Georg Seidemann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing thereof
- Patent number 12,341,107
- Issue date Jun 24, 2025
- Amkor Technology Singapore Holding Pte Ltd.
- Yi Seul Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with tilted interface between device die and encapsulating...
- Patent number 12,334,406
- Issue date Jun 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Yen Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coating layer disposed on a plurality of conductive particles betwe...
- Patent number 12,336,396
- Issue date Jun 17, 2025
- Samsung Display Co., Ltd.
- Sang Hyeon Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and method for forming the same
- Patent number 12,334,444
- Issue date Jun 17, 2025
- Mediatek Inc.
- Po-Hao Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Encapsulated package including device dies connected via interconne...
- Patent number 12,334,464
- Issue date Jun 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuo-Chiang Ting
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lthc as charging barrier in info package formation
- Patent number 12,334,489
- Issue date Jun 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Jen Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 12,327,812
- Issue date Jun 10, 2025
- Amkor Technology Singapore Holding Pte Ltd.
- Yeong Beom Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heterogeneous package structures with photonic devices
- Patent number 12,326,592
- Issue date Jun 10, 2025
- International Business Machines Corporation
- Barnim Alexander Janta-Polczynski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for selective EMI shielding using a...
- Patent number 12,327,800
- Issue date Jun 10, 2025
- STATS ChipPAC Pte. Ltd.
- GunHyuck Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer reconstitution and die-stitching
- Patent number 12,322,730
- Issue date Jun 3, 2025
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing layered device chip assembly
- Patent number 12,322,655
- Issue date Jun 3, 2025
- Disco Corporation
- Shunsuke Teranishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming insulating layers around...
- Patent number 12,322,725
- Issue date Jun 3, 2025
- Semtech Corporation
- Satyamoorthi Chinnusamy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming microelectromechanical s...
- Patent number 12,319,564
- Issue date Jun 3, 2025
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Edge encapsulation for high voltage devices
- Patent number 12,315,770
- Issue date May 27, 2025
- MACOM Technology Solutions Holdings, Inc.
- Timothy Boles
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip scale package (CSP) process
- Patent number 12,315,773
- Issue date May 27, 2025
- CHANGZHOU GALAXY CENTURY MICROELECTRONICS CO., LTD
- Yueyun Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Element transferring method and electronic panel manufacturing meth...
- Patent number 12,315,742
- Issue date May 27, 2025
- Korea Institute of Machinery & Materials
- Jae-Hyun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with improved interposer structure
- Patent number 12,308,313
- Issue date May 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Wen Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor manufacturing device and method of enhancing mold gat...
- Patent number 12,304,122
- Issue date May 20, 2025
- STATS ChipPAC Pte. Ltd.
- HunTeak Lee
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Molded product for semiconductor strip and method of manufacturing...
- Patent number 12,308,253
- Issue date May 20, 2025
- Samsung Electronics Co., Ltd.
- Seunghwan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connector and method for forming the same
- Patent number 12,300,645
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package unit and chip packaging method
- Patent number 12,300,565
- Issue date May 13, 2025
- Richtek Technology Corporation
- Hao-Lin Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a packaged semiconductor device having enhanced w...
- Patent number 12,300,582
- Issue date May 13, 2025
- Amkor Technology Singapore Holding Pte Ltd.
- Pedro Joel Rivera-Marty
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method for forming same
- Patent number 12,300,590
- Issue date May 13, 2025
- JCET GROUP CO., LTD.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Grindable heat sink for multiple die packaging
- Patent number 12,300,570
- Issue date May 13, 2025
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming chip packages and a chip package
- Patent number 12,293,986
- Issue date May 6, 2025
- Yibu Semiconductor Co., Ltd.
- Weiping Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and method of fabricating the same
- Patent number 12,288,738
- Issue date Apr 29, 2025
- Samsung Electronics Co., Ltd.
- Younghwan Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photonic integrated package and method forming same
- Patent number 12,283,492
- Issue date Apr 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF PACKAGING SEMICONDUCTOR DIES
- Publication number 20250210376
- Publication date Jun 26, 2025
- SPTS TECHNOLOGIES LIMITED
- Liam Andrew John CHARD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT APPLIED INTERPOSER FOR CO-PACKAGED OPTICS
- Publication number 20250210613
- Publication date Jun 26, 2025
- Applied Materials, Inc.
- Guan-Shian CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE WITH STRESS RELIEF LAYER AND THE METHODS FO...
- Publication number 20250210540
- Publication date Jun 26, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Tsu Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE SUBSTRATE DICING AND EDGE PASSIVATION
- Publication number 20250210586
- Publication date Jun 26, 2025
- Intel Corporation
- Praveen SREERAMAGIRI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARRIER SUBSTRATE AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE...
- Publication number 20250210400
- Publication date Jun 26, 2025
- Samsung Electronics Co., Ltd.
- Taehoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INFO STRUCTURE WITH COPPER PILLAR HAVING REVERSED PROFILE
- Publication number 20250201617
- Publication date Jun 19, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsi-Kuei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE
- Publication number 20250201583
- Publication date Jun 19, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jiun-Ting Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NO MOLD SHELF PACKAGE DESIGN AND PROCESS FLOW FOR ADVANCED PACKAGE...
- Publication number 20250192101
- Publication date Jun 12, 2025
- Intel Corporation
- Wei LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLYMER MATERIAL IN A REDISTRIBUTION STRUCTURE OF A SEMICONDUCTOR P...
- Publication number 20250189889
- Publication date Jun 12, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Sih-Hao Liao
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Integrated Devices in Semiconductor Packages and Methods of Forming...
- Publication number 20250192080
- Publication date Jun 12, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE
- Publication number 20250191990
- Publication date Jun 12, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Sung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20250192087
- Publication date Jun 12, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Neng-Chieh CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250183115
- Publication date Jun 5, 2025
- Siliconware Precision Industries Co., Ltd.
- Shih-Hao TUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PANEL SCALE PACKAGING OF A PLURALITY OF TRANSFORMER DEVICES FOR RED...
- Publication number 20250183201
- Publication date Jun 5, 2025
- Danger Devices Inc.
- Nicholas SUTARDJA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARRIER FILM DISPOSED ON A MOTHER SUBSTRATE AND METHOD OF MANUFACTU...
- Publication number 20250183057
- Publication date Jun 5, 2025
- Samsung Electronics Co., Ltd.
- Taesung KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL ENHANCED ELECTRONIC DEVICE PACKAGE
- Publication number 20250183129
- Publication date Jun 5, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Ashok Prabhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Die Connection System and Method
- Publication number 20250174591
- Publication date May 29, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250174526
- Publication date May 29, 2025
- NEXPERIA B.V.
- Wai Hung William Hor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ASSEMBLY COMPRISING A 3D BLOCK AND METHOD OF MAKING T...
- Publication number 20250174542
- Publication date May 29, 2025
- Deca Technologies USA, Inc.
- Timothy L. Olson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL STACKING SEMICONDUCTOR ASSEMBLIES AND METHODS OF...
- Publication number 20250174604
- Publication date May 29, 2025
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A PACKAGED SEMICONDUCTOR DEVICE HAVING ENHANCED W...
- Publication number 20250167080
- Publication date May 22, 2025
- Amkor Technology Singapore Holding Pte. Ltd.
- Pedro Joel Rivera-Marty
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT STRUCTURE
- Publication number 20250159812
- Publication date May 15, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
MANUFACTURING METHOD OF PACKAGE DEVICE
- Publication number 20250157904
- Publication date May 15, 2025
- InnoLux Corporation
- Hsueh-Hsuan Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER RECONSTITUTION AND DIE-STITCHING
- Publication number 20250157991
- Publication date May 15, 2025
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING TRENCH STRUCTURE, MANUFACTURING MET...
- Publication number 20250157907
- Publication date May 15, 2025
- SK HYNIX INC.
- In Young JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A PACKAGE-ON-PACKAGE TYPE SEMICONDUCTOR PAC...
- Publication number 20250158007
- Publication date May 15, 2025
- Amkor Technology Singapore Holding Pte. Ltd.
- Dong Jin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING INTEGRATED DEVICE PACKAGES
- Publication number 20250157830
- Publication date May 15, 2025
- ASMPT SINGAPORE PTE. LTD
- Chun Ho FAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED DEVICE PACKAGES WITH INTEGRATED DEVICE DIE AND DUMMY ELE...
- Publication number 20250149483
- Publication date May 8, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOGIC DRIVE BASED ON STANDARDIZED COMMODITY PROGRAMMABLE LOGIC SEMI...
- Publication number 20250149529
- Publication date May 8, 2025
- iCometrue Company Ltd.
- Jin-Yuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADLESS SEMICONDUCTOR PACKAGES, LEADFRAMES THEREFOR, AND METHODS O...
- Publication number 20250149412
- Publication date May 8, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Darrell D. TRUHITTE
- H01 - BASIC ELECTRIC ELEMENTS

Batch processing

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Multi-faced molded semiconductor package and related methods

Compartmentalized shielding of a module utilizing self-shielded sub...

Bare-die smart bridge connected with copper pillars for system-in-p...

Semiconductor device and method of manufacturing thereof

Package with tilted interface between device die and encapsulating...

Coating layer disposed on a plurality of conductive particles betwe...

Semiconductor package structure and method for forming the same

Encapsulated package including device dies connected via interconne...

Lthc as charging barrier in info package formation

Semiconductor device and manufacturing method thereof

Heterogeneous package structures with photonic devices

Semiconductor device and method for selective EMI shielding using a...

Wafer reconstitution and die-stitching

Method of manufacturing layered device chip assembly

Semiconductor device and method of forming insulating layers around...

Semiconductor device and method of forming microelectromechanical s...

Edge encapsulation for high voltage devices

Chip scale package (CSP) process

Element transferring method and electronic panel manufacturing meth...

Semiconductor package with improved interposer structure

Semiconductor manufacturing device and method of enhancing mold gat...

Molded product for semiconductor strip and method of manufacturing...

Connector and method for forming the same

Chip package unit and chip packaging method

Method of forming a packaged semiconductor device having enhanced w...

Package structure and method for forming same

Grindable heat sink for multiple die packaging

Method for forming chip packages and a chip package

Semiconductor device package and method of fabricating the same

Photonic integrated package and method forming same

Patents Applicationslast 30 patents

METHOD OF PACKAGING SEMICONDUCTOR DIES

DIRECT APPLIED INTERPOSER FOR CO-PACKAGED OPTICS

SEMICONDUCTOR STRUCTURE WITH STRESS RELIEF LAYER AND THE METHODS FO...

SEMICONDUCTOR PACKAGE SUBSTRATE DICING AND EDGE PASSIVATION

CARRIER SUBSTRATE AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE...

INFO STRUCTURE WITH COPPER PILLAR HAVING REVERSED PROFILE

MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE

NO MOLD SHELF PACKAGE DESIGN AND PROCESS FLOW FOR ADVANCED PACKAGE...

POLYMER MATERIAL IN A REDISTRIBUTION STRUCTURE OF A SEMICONDUCTOR P...

Integrated Devices in Semiconductor Packages and Methods of Forming...

MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE STRUCTURE

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

PANEL SCALE PACKAGING OF A PLURALITY OF TRANSFORMER DEVICES FOR RED...

CARRIER FILM DISPOSED ON A MOTHER SUBSTRATE AND METHOD OF MANUFACTU...

THERMAL ENHANCED ELECTRONIC DEVICE PACKAGE

Semiconductor Die Connection System and Method

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR ASSEMBLY COMPRISING A 3D BLOCK AND METHOD OF MAKING T...

THREE-DIMENSIONAL STACKING SEMICONDUCTOR ASSEMBLIES AND METHODS OF...

METHOD OF FORMING A PACKAGED SEMICONDUCTOR DEVICE HAVING ENHANCED W...

INTEGRATED CIRCUIT STRUCTURE

MANUFACTURING METHOD OF PACKAGE DEVICE

WAFER RECONSTITUTION AND DIE-STITCHING

SEMICONDUCTOR PACKAGE INCLUDING TRENCH STRUCTURE, MANUFACTURING MET...

METHOD OF MANUFACTURING A PACKAGE-ON-PACKAGE TYPE SEMICONDUCTOR PAC...

METHOD FOR MANUFACTURING INTEGRATED DEVICE PACKAGES

INTEGRATED DEVICE PACKAGES WITH INTEGRATED DEVICE DIE AND DUMMY ELE...

LOGIC DRIVE BASED ON STANDARDIZED COMMODITY PROGRAMMABLE LOGIC SEMI...

LEADLESS SEMICONDUCTOR PACKAGES, LEADFRAMES THEREFOR, AND METHODS O...