Batch processing

Industry

CPC
H01L21/561

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/561Batch processing

Industries

Patents Grantslast 30 patents

Information Patent Grant
Method for manufacturing electronic device
- Patent number 12,368,079
- Issue date Jul 22, 2025
- Innolux Corporation
- Cheng-Chi Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method comprising formation of redistribu...
- Patent number 12,368,077
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jiun Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IPD modules with flexible connection scheme in packaging
- Patent number 12,368,141
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Chia Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip package having underfill material surrounding a...
- Patent number 12,368,127
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Po-Chen Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Supporting InFO packages to reduce warpage
- Patent number 12,368,115
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of packaging semiconductor devices and packaged semiconduct...
- Patent number 12,362,260
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Li-Hui Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of making double shielding layers o...
- Patent number 12,362,287
- Issue date Jul 15, 2025
- STATS ChipPAC Pte. Ltd.
- ChangOh Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing electronic device
- Patent number 12,362,221
- Issue date Jul 15, 2025
- MITSUI CHEMICALS ICT MATERIA, INC.
- Toru Miura
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Method of manufacturing a semiconductor device
- Patent number 12,354,934
- Issue date Jul 8, 2025
- Amkor Technology Singapore Holding Pte Ltd.
- Siang Miang Yeo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laminated device chip manufacturing method
- Patent number 12,354,995
- Issue date Jul 8, 2025
- Disco Corporation
- Shunsuke Teranishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser de-bonding carriers and composite carriers thereof
- Patent number 12,347,696
- Issue date Jul 1, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Huicheng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die corner removal for underfill crack suppression in semiconductor...
- Patent number 12,347,802
- Issue date Jul 1, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and method
- Patent number 12,347,791
- Issue date Jul 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded inductor with magnetic core having mold flow enhancing channels
- Patent number 12,347,603
- Issue date Jul 1, 2025
- Texas Instruments Incorporated
- Joel Nathan Brassfield
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method manufacturing the same
- Patent number 12,347,785
- Issue date Jul 1, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compartmentalized shielding of a module utilizing self-shielded sub...
- Patent number 12,342,518
- Issue date Jun 24, 2025
- Qorvo US, Inc.
- Thomas Scott Morris
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-faced molded semiconductor package and related methods
- Patent number 12,341,014
- Issue date Jun 24, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Eiji Kurose
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bare-die smart bridge connected with copper pillars for system-in-p...
- Patent number 12,341,096
- Issue date Jun 24, 2025
- Intel Corporation
- Georg Seidemann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing thereof
- Patent number 12,341,107
- Issue date Jun 24, 2025
- Amkor Technology Singapore Holding Pte Ltd.
- Yi Seul Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with tilted interface between device die and encapsulating...
- Patent number 12,334,406
- Issue date Jun 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Yen Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coating layer disposed on a plurality of conductive particles betwe...
- Patent number 12,336,396
- Issue date Jun 17, 2025
- Samsung Display Co., Ltd.
- Sang Hyeon Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and method for forming the same
- Patent number 12,334,444
- Issue date Jun 17, 2025
- Mediatek Inc.
- Po-Hao Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Encapsulated package including device dies connected via interconne...
- Patent number 12,334,464
- Issue date Jun 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuo-Chiang Ting
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lthc as charging barrier in info package formation
- Patent number 12,334,489
- Issue date Jun 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Jen Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 12,327,812
- Issue date Jun 10, 2025
- Amkor Technology Singapore Holding Pte Ltd.
- Yeong Beom Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for selective EMI shielding using a...
- Patent number 12,327,800
- Issue date Jun 10, 2025
- STATS ChipPAC Pte. Ltd.
- GunHyuck Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heterogeneous package structures with photonic devices
- Patent number 12,326,592
- Issue date Jun 10, 2025
- International Business Machines Corporation
- Barnim Alexander Janta-Polczynski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing layered device chip assembly
- Patent number 12,322,655
- Issue date Jun 3, 2025
- Disco Corporation
- Shunsuke Teranishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer reconstitution and die-stitching
- Patent number 12,322,730
- Issue date Jun 3, 2025
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming insulating layers around...
- Patent number 12,322,725
- Issue date Jun 3, 2025
- Semtech Corporation
- Satyamoorthi Chinnusamy
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR MANUFACTURING ELECTRONIC COMPONENTS
- Publication number 20250239505
- Publication date Jul 24, 2025
- STMicroelectronics International N.V.
- Ludovic FALLOURD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20250239463
- Publication date Jul 24, 2025
- UNITED MICROELECTRONICS CORP.
- Chien-Ting Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20250239569
- Publication date Jul 24, 2025
- Advanced Semiconductor Engineering, Inc.
- Chih-Ming HUNG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR PACKAGE STRESS BALANCE STRUCTURES AND RELATED METHODS
- Publication number 20250232978
- Publication date Jul 17, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...
- Publication number 20250233081
- Publication date Jul 17, 2025
- Amkor Technology Singapore Holding Pte. Ltd.
- Ji Hoon Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRESS BALANCE STRUCTURES AND RELATED METHODS
- Publication number 20250232979
- Publication date Jul 17, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
- Publication number 20250226238
- Publication date Jul 10, 2025
- Resonac Corporation
- Keiichi HATAKEYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BATCH-TYPE SUBSTRATE PROCESSING APPARATUS
- Publication number 20250226252
- Publication date Jul 10, 2025
- Samsung Electronics Co., Ltd.
- Sekeun KWAK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Making a Molded IPD-CoW
- Publication number 20250226334
- Publication date Jul 10, 2025
- STATS ChipPAC Pte Ltd.
- Kai Chong Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Packages And Methods Of Forming The Same
- Publication number 20250219024
- Publication date Jul 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND DEVICES FOR PROCESSING SINGULATED SUBSTRATES
- Publication number 20250218798
- Publication date Jul 3, 2025
- Octavo Systems LLC
- Erik WELSH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTONIC INTEGRATED PACKAGE AND METHOD FORMING SAME
- Publication number 20250218799
- Publication date Jul 3, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING ELECTRONIC COMPONENT OR SEMICONDUCTOR DEVICE
- Publication number 20250218801
- Publication date Jul 3, 2025
- LINTEC CORPORATION
- Kanako KONO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-LEVEL CHIP SCALE PACKAGE SEMICONDUCTOR DEVICES WITH LIGHT BLO...
- Publication number 20250218975
- Publication date Jul 3, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Daiki Komatsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250218978
- Publication date Jul 3, 2025
- Advanced Semiconductor Engineering, Inc.
- Hui-Ping JIAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP INTEGRATION INTO CAVITIES OF A HOST WAFER USING LATERAL DIELEC...
- Publication number 20250218882
- Publication date Jul 3, 2025
- PseudolithIC, Inc.
- Florian Herrault
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PACKAGING SEMICONDUCTOR DIES
- Publication number 20250210376
- Publication date Jun 26, 2025
- SPTS TECHNOLOGIES LIMITED
- Liam Andrew John CHARD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT APPLIED INTERPOSER FOR CO-PACKAGED OPTICS
- Publication number 20250210613
- Publication date Jun 26, 2025
- Applied Materials, Inc.
- Guan-Shian CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE WITH STRESS RELIEF LAYER AND THE METHODS FO...
- Publication number 20250210540
- Publication date Jun 26, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Tsu Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE SUBSTRATE DICING AND EDGE PASSIVATION
- Publication number 20250210586
- Publication date Jun 26, 2025
- Intel Corporation
- Praveen SREERAMAGIRI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARRIER SUBSTRATE AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE...
- Publication number 20250210400
- Publication date Jun 26, 2025
- Samsung Electronics Co., Ltd.
- Taehoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INFO STRUCTURE WITH COPPER PILLAR HAVING REVERSED PROFILE
- Publication number 20250201617
- Publication date Jun 19, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsi-Kuei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE
- Publication number 20250201583
- Publication date Jun 19, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jiun-Ting Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NO MOLD SHELF PACKAGE DESIGN AND PROCESS FLOW FOR ADVANCED PACKAGE...
- Publication number 20250192101
- Publication date Jun 12, 2025
- Intel Corporation
- Wei LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLYMER MATERIAL IN A REDISTRIBUTION STRUCTURE OF A SEMICONDUCTOR P...
- Publication number 20250189889
- Publication date Jun 12, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Sih-Hao Liao
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Integrated Devices in Semiconductor Packages and Methods of Forming...
- Publication number 20250192080
- Publication date Jun 12, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE
- Publication number 20250191990
- Publication date Jun 12, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Sung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20250192087
- Publication date Jun 12, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Neng-Chieh CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250183115
- Publication date Jun 5, 2025
- Siliconware Precision Industries Co., Ltd.
- Shih-Hao TUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PANEL SCALE PACKAGING OF A PLURALITY OF TRANSFORMER DEVICES FOR RED...
- Publication number 20250183201
- Publication date Jun 5, 2025
- Danger Devices Inc.
- Nicholas SUTARDJA
- H01 - BASIC ELECTRIC ELEMENTS

Batch processing

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for manufacturing electronic device

Semiconductor package and method comprising formation of redistribu...

IPD modules with flexible connection scheme in packaging

Semiconductor chip package having underfill material surrounding a...

Supporting InFO packages to reduce warpage

Methods of packaging semiconductor devices and packaged semiconduct...

Semiconductor device and method of making double shielding layers o...

Method for manufacturing electronic device

Method of manufacturing a semiconductor device

Laminated device chip manufacturing method

Laser de-bonding carriers and composite carriers thereof

Die corner removal for underfill crack suppression in semiconductor...

Integrated circuit package and method

Molded inductor with magnetic core having mold flow enhancing channels

Semiconductor structure and method manufacturing the same

Compartmentalized shielding of a module utilizing self-shielded sub...

Multi-faced molded semiconductor package and related methods

Bare-die smart bridge connected with copper pillars for system-in-p...

Semiconductor device and method of manufacturing thereof

Package with tilted interface between device die and encapsulating...

Coating layer disposed on a plurality of conductive particles betwe...

Semiconductor package structure and method for forming the same

Encapsulated package including device dies connected via interconne...

Lthc as charging barrier in info package formation

Semiconductor device and manufacturing method thereof

Semiconductor device and method for selective EMI shielding using a...

Heterogeneous package structures with photonic devices

Method of manufacturing layered device chip assembly

Wafer reconstitution and die-stitching

Semiconductor device and method of forming insulating layers around...

Patents Applicationslast 30 patents

METHOD FOR MANUFACTURING ELECTRONIC COMPONENTS

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

SEMICONDUCTOR DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE STRESS BALANCE STRUCTURES AND RELATED METHODS

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...

SEMICONDUCTOR PACKAGE STRESS BALANCE STRUCTURES AND RELATED METHODS

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE

BATCH-TYPE SUBSTRATE PROCESSING APPARATUS

Semiconductor Device and Method of Making a Molded IPD-CoW

Semiconductor Packages And Methods Of Forming The Same

METHODS AND DEVICES FOR PROCESSING SINGULATED SUBSTRATES

PHOTONIC INTEGRATED PACKAGE AND METHOD FORMING SAME

METHOD FOR MANUFACTURING ELECTRONIC COMPONENT OR SEMICONDUCTOR DEVICE

WAFER-LEVEL CHIP SCALE PACKAGE SEMICONDUCTOR DEVICES WITH LIGHT BLO...

ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME

CHIP INTEGRATION INTO CAVITIES OF A HOST WAFER USING LATERAL DIELEC...

METHOD OF PACKAGING SEMICONDUCTOR DIES

DIRECT APPLIED INTERPOSER FOR CO-PACKAGED OPTICS

SEMICONDUCTOR STRUCTURE WITH STRESS RELIEF LAYER AND THE METHODS FO...

SEMICONDUCTOR PACKAGE SUBSTRATE DICING AND EDGE PASSIVATION

CARRIER SUBSTRATE AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE...

INFO STRUCTURE WITH COPPER PILLAR HAVING REVERSED PROFILE

MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE

NO MOLD SHELF PACKAGE DESIGN AND PROCESS FLOW FOR ADVANCED PACKAGE...

POLYMER MATERIAL IN A REDISTRIBUTION STRUCTURE OF A SEMICONDUCTOR P...

Integrated Devices in Semiconductor Packages and Methods of Forming...

MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE STRUCTURE

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

PANEL SCALE PACKAGING OF A PLURALITY OF TRANSFORMER DEVICES FOR RED...