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H
ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L21/00
Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Current Industry
H01L21/561
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Patents Grants
last 30 patents
Information
Patent Grant
Semiconductor package, semiconductor module and methods for manufac...
Patent number
11,978,692
Issue date
May 7, 2024
Infineon Technologies Austria AG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package
Patent number
11,978,716
Issue date
May 7, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Substrate processing system and substrate processing method
Patent number
11,978,644
Issue date
May 7, 2024
Tokyo Electron Limited
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Encapsulated package including device dies connected via interconne...
Patent number
11,978,714
Issue date
May 7, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stacked via structure
Patent number
11,973,023
Issue date
Apr 30, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Po-Han Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multiple die assembly
Patent number
11,973,058
Issue date
Apr 30, 2024
International Business Machines Corporation
Katsuyuki Sakuma
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Optical lithography system and method of using the same
Patent number
11,960,211
Issue date
Apr 16, 2024
Taiwan Semiconductor Manufacturing Co., Ltd
Hung-Jui Kuo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and package-on-package including the same
Patent number
11,961,795
Issue date
Apr 16, 2024
Samsung Electronics Co., Ltd.
Bongken Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and manufacturing method thereof
Patent number
11,961,789
Issue date
Apr 16, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of making a wafer-level chip-scale...
Patent number
11,961,764
Issue date
Apr 16, 2024
STATS ChipPAC Pte. Ltd.
Thomas J. Strothmann
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Devices and methods related to dual-sided radio-frequency package w...
Patent number
11,961,805
Issue date
Apr 16, 2024
Skyworks Solutions, Inc.
Howard E. Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Ultra small molded module integrated with die by module-on-wafer as...
Patent number
11,955,434
Issue date
Apr 9, 2024
Intel Corporation
Yoshihiro Tomita
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Direct bonded stack structures for increased reliability and improv...
Patent number
11,955,463
Issue date
Apr 9, 2024
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Cyprian Emeka Uzoh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Anisotropic carrier for high aspect ratio fanout
Patent number
11,955,349
Issue date
Apr 9, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package stacking using chip to wafer bonding
Patent number
11,955,462
Issue date
Apr 9, 2024
Intel Corporation
Georg Seidemann
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device
Patent number
RE49912
Issue date
Apr 9, 2024
Rohm Co., Ltd.
Akihiro Kimura
Information
Patent Grant
Regulator circuit package techniques
Patent number
11,955,437
Issue date
Apr 9, 2024
Analog Devices International Unlimited Company
Leonard Shtargot
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and manufacturing method thereof
Patent number
11,948,808
Issue date
Apr 2, 2024
Amkor Technology Singapore Holding Pte Ltd.
Dong Jin Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package including high thermal conductivity layer
Patent number
11,948,851
Issue date
Apr 2, 2024
Samsung Electronics Co., Ltd.
Sunjae Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method for manufacturing the same
Patent number
11,948,869
Issue date
Apr 2, 2024
Kabushiki Kaisha Toshiba
Naoki Okawa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor packaging method and semiconductor package device
Patent number
11,948,911
Issue date
Apr 2, 2024
TONGFU MICROELECTRONICS CO., LTD.
Guoqing Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and method
Patent number
11,948,890
Issue date
Apr 2, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Shih-Hao Tseng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package structures and method of forming the same
Patent number
11,948,862
Issue date
Apr 2, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Thin semiconductor package for notched semiconductor die
Patent number
11,942,369
Issue date
Mar 26, 2024
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Shutesh Krishnan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor structure and manufacturing method thereof
Patent number
11,942,408
Issue date
Mar 26, 2024
Taiwan Semiconductor Manufacturing Company Ltd.
Shuo-Mao Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit package and method
Patent number
11,942,403
Issue date
Mar 26, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Chih-Chien Pan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor structure and method of forming the same
Patent number
11,942,451
Issue date
Mar 26, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Mao-Yen Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package structure having thermal dissipation structure therein and...
Patent number
11,935,760
Issue date
Mar 19, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor manufacturing equipment and method of providing suppo...
Patent number
11,935,777
Issue date
Mar 19, 2024
STATS ChipPAC Pte. Ltd.
HyeonChul Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and method of forming thereof
Patent number
11,935,761
Issue date
Mar 19, 2024
Taiwan Semiconductor Manufacturing Co., Ltd
Jiun Yi Wu
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
ELECTRONIC DEVICE
Publication number
20240145255
Publication date
May 2, 2024
InnoLux Corporation
Ker-Yih KAO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Publication number
20240145256
Publication date
May 2, 2024
Resonac Corporation
Hiroaki MATSUBARA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES, CORRESPONDING LEADFR...
Publication number
20240145429
Publication date
May 2, 2024
STMicroelectronics S.r.l.
Riccardo VILLA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
Publication number
20240145455
Publication date
May 2, 2024
Siliconware Precision Industries Co., Ltd.
Meng-Jie LEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGES AND ASSOCIATED METHODS WITH SOLDER MASK OPEN...
Publication number
20240145405
Publication date
May 2, 2024
Micron Technology, Inc.
Avishesh Dhakal
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES, CORRESPONDING SEMICO...
Publication number
20240145351
Publication date
May 2, 2024
STMicroelectronics S.r.l
Matteo DE SANTA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STACKED DIES AND METHODS FOR FORMING BONDED STRUCTURES
Publication number
20240145458
Publication date
May 2, 2024
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Cyprian Emeka Uzoh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MULTI-CHIP INTERCONNECTION PACKAGE STRUCTURE WITH HEAT DISSIPATION...
Publication number
20240136297
Publication date
Apr 25, 2024
Institute of Semiconductors, Guangdong Academy of Sciences
Yingqiang YAN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THERMALLY CONDUCTIVE SEMICONDUCTOR PACKAGING STRUCTURE AND METHOD F...
Publication number
20240136245
Publication date
Apr 25, 2024
SJ Semiconductor(Jiangyin) Corporation
Yenheng Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
COMPOSITE COMPONENT
Publication number
20240136268
Publication date
Apr 25, 2024
Murata Manufacturing Co., Ltd.
Yoshiaki SATAKE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PHOTONIC INTEGRATED PACKAGE AND METHOD FORMING SAME
Publication number
20240136203
Publication date
Apr 25, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
NO MOLD SHELF PACKAGE DESIGN AND PROCESS FLOW FOR ADVANCED PACKAGE...
Publication number
20240136326
Publication date
Apr 25, 2024
Intel Corporation
Wei LI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTERCONNECT STRIPS
Publication number
20240128094
Publication date
Apr 18, 2024
TEXAS INSTRUMENTS INCORPORATED
CHIH-CHIEN HO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Package and Method of Manufacturing the Same
Publication number
20240128157
Publication date
Apr 18, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Chin-Chuan Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND PRE-FORMING ADAPTOR THEREOF
Publication number
20240128185
Publication date
Apr 18, 2024
PANJIT INTERNATIONAL INC.
Chung Hsiung Ho
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND A METHOD OF MANUFACTURING THE SAME
Publication number
20240128206
Publication date
Apr 18, 2024
Advanced Semiconductor Engineering, Inc.
Peng YANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
Publication number
20240128143
Publication date
Apr 18, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Chia-Han Hsieh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGES AND METHOD FOR FABRICATING THE SAME
Publication number
20240128145
Publication date
Apr 18, 2024
Samsung Electronics Co., Ltd.
HYEONSEOK LEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SIP-TYPE ELECTRONIC DEVICE AND METHOD FOR MAKING SUCH A DEVICE
Publication number
20240128227
Publication date
Apr 18, 2024
Commissariat A L'Energie Atomique et Aux Energies Alternatives
Perceval COUDRAIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE
Publication number
20240120280
Publication date
Apr 11, 2024
Samsung Electronics Co., Ltd.
Kyungdon Mun
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR STRUCTURES AND METHOD FOR MANUFACTURING A SEMICONDUCT...
Publication number
20240120282
Publication date
Apr 11, 2024
SERIPHY TECHNOLOGY CORPORATION
TZU-WEI CHIU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MAKING THE SAME
Publication number
20240120291
Publication date
Apr 11, 2024
STATS ChipPAC Pte Ltd.
ChangOh Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method of Manufacturing a Semiconductor Package, Such Semiconductor...
Publication number
20240120247
Publication date
Apr 11, 2024
NEXPERIA B.V.
Regnerus Hermannus Poelma
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGING DEVICE CAPABLE OF DETECTING RISK OF IMPACT OF ELECTROSTAT...
Publication number
20240120241
Publication date
Apr 11, 2024
PANJIT INTERNATIONAL INC.
Chung-Hsiung HO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SINGULATION OF INTEGRATED CIRCUIT PACKAGE SUBSTRATES WITH GLASS CORES
Publication number
20240113072
Publication date
Apr 4, 2024
Intel Corporation
Whitney Bryks
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES
Publication number
20240112975
Publication date
Apr 4, 2024
Amkor Technology Singapore Holding Pte. Ltd.
Kwang Seok PARK
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Stacking Hybrid Substrates with...
Publication number
20240105630
Publication date
Mar 28, 2024
STATS ChipPAC Pte Ltd.
Yaojian Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
3D Package with Chip-on-Reconstituted Wafer or Reconstituted Wafer-...
Publication number
20240105702
Publication date
Mar 28, 2024
Apple Inc.
Chonghua Zhong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR MAKING AN ELECTRONIC PACKAGE
Publication number
20240105538
Publication date
Mar 28, 2024
JCET STATS ChipPAC Korea Limited
SangHo SONG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
Publication number
20240105701
Publication date
Mar 28, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Chih-Wei Wu
H01 - BASIC ELECTRIC ELEMENTS