Battery in combination with a leadframe

Industry

CPC
H01L23/49593

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/49593Battery in combination with a leadframe

Industries

Patents Grantslast 30 patents

Information Patent Grant
IoT and AI system package with solid-state battery enhanced perform...
- Patent number 11,145,580
- Issue date Oct 12, 2021
- International Business Machines Corporation
- Frank Robert Libsch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Body-mountable device with a common substrate for electronics and b...
- Patent number 10,573,607
- Issue date Feb 25, 2020
- VERILY LIFE SCIENCES LLC
- William James Biederman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Structure of battery protection circuit module package coupled with...
- Patent number 10,193,193
- Issue date Jan 29, 2019
- ITM SEMICONDUCTOR CO., LTD.
- Hyeokhwi Na
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Body-mountable device with a common substrate for electronics and b...
- Patent number 10,134,692
- Issue date Nov 20, 2018
- VERILY LIFE SCIENCES LLC
- William James Biederman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Body-mountable device with a common substrate for electronics and b...
- Patent number 9,728,494
- Issue date Aug 8, 2017
- VERILY LIFE SCIENCES LLC
- William James Biederman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic device with integrated energy source
- Patent number 9,413,405
- Issue date Aug 9, 2016
- Joseph H. McCain
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Microelectronic device with integrated energy source
- Patent number 9,099,410
- Issue date Aug 4, 2015
- Joseph H. McCain
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Integrated circuit package including embedded thin-film battery
- Patent number 9,012,264
- Issue date Apr 21, 2015
- STMicroelectronics, Inc.
- Michael J. Hundt
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Integrated circuit package including embedded thin-film battery
- Patent number 8,766,435
- Issue date Jul 1, 2014
- STMicroelectronics, Inc.
- Michael J. Hundt
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method for manufacturing a semiconductor component and structure th...
- Patent number 8,582,317
- Issue date Nov 12, 2013
- Semiconductor Components Industries, LLC
- Yenting Wen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic device with integrated energy source
- Patent number 8,373,559
- Issue date Feb 12, 2013
- Joseph McCain
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Microelectronic device with integrated energy source
- Patent number 7,989,936
- Issue date Aug 2, 2011
- Joseph Harry McCain
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Microelectronic device with integrated energy source
- Patent number 7,557,433
- Issue date Jul 7, 2009
- Joseph H. McCain
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Battery mounted integrated circuit device
- Patent number 5,864,182
- Issue date Jan 26, 1999
- Fuji Electric Co., Ltd.
- Kazuo Matsuzaki
- G11 - INFORMATION STORAGE
Information Patent Grant
Surface mountable integrated circuit package with integrated batter...
- Patent number 5,498,903
- Issue date Mar 12, 1996
- SGS-Thomson Microelectronics, Inc.
- D. Craig Dixon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded package integrated circuit with electrochemical cell
- Patent number 5,451,715
- Issue date Sep 19, 1995
- SGS-Thomson Microelectronics, Inc.
- Michael J. Hundt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface mountable integrated circuit package with integrated batter...
- Patent number 5,403,782
- Issue date Apr 4, 1995
- SGS-Thomson Microelectronics, Inc.
- D. Craig Dixon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for reducing conductive and convective heat loss from the ba...
- Patent number 5,323,150
- Issue date Jun 21, 1994
- Micron Technology, Inc.
- John R. Tuttle
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
IC package having direct attach backup battery
- Patent number 5,294,829
- Issue date Mar 15, 1994
- SGS-Thomson Microelectronics, Inc.
- Michael J. Hundt
- G11 - INFORMATION STORAGE
Information Patent Grant
IC package having replaceable backup battery
- Patent number 5,289,034
- Issue date Feb 22, 1994
- SGS-Thomson Microelectronics, Inc.
- Michael J. Hundt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package with battery housing
- Patent number 5,276,354
- Issue date Jan 4, 1994
- SGS-Thomson Microelectronics, Inc.
- Joseph Link
- G11 - INFORMATION STORAGE
Information Patent Grant
Integrated circuit package with molded cell
- Patent number 5,196,374
- Issue date Mar 23, 1993
- SGS-Thomson Microelectronics, Inc.
- Michael J. Hundt
- G11 - INFORMATION STORAGE
Information Patent Grant
Application of laminated interconnect media between a laminated pow...
- Patent number 5,187,564
- Issue date Feb 16, 1993
- SGS-Thomson Microelectronics, Inc.
- Joseph H. McCain
- G11 - INFORMATION STORAGE
Information Patent Grant
Method for packaging an electronic circuit device
- Patent number 5,161,304
- Issue date Nov 10, 1992
- SGS-Thomson Microelectronics, Inc.
- Daniel Queyssac
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package with laminated backup cell
- Patent number 5,153,710
- Issue date Oct 6, 1992
- SGS-Thomson Microelectronics, Inc.
- Joseph H. McCain
- G11 - INFORMATION STORAGE
Information Patent Grant
Integrated circuit package with molded cell
- Patent number 5,124,782
- Issue date Jun 23, 1992
- SGS-Thomson Microelectronics, Inc.
- Michael J. Hundt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor with a battery unit
- Patent number 5,119,269
- Issue date Jun 2, 1992
- Seiko Epson Corporation
- Iwao Nakayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Zero power IC module
- Patent number 5,089,877
- Issue date Feb 18, 1992
- SGS-Thomson Microelectronics, Inc.
- Daniel Queyssac
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package with battery housing
- Patent number 5,055,704
- Issue date Oct 8, 1991
- SGS-Thomson Microelectronics, Inc.
- Joseph Link
- G11 - INFORMATION STORAGE
Information Patent Grant
Zero power IC module
- Patent number 5,008,776
- Issue date Apr 16, 1991
- SGS-Thomson Microelectronics, Inc.
- Daniel Queyssac
- G11 - INFORMATION STORAGE

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE WITH EMBEDDED BATTERY AND METHOD THEREFOR
- Publication number 20230343683
- Publication date Oct 26, 2023
- NXP USA, Inc.
- Stephen Ryan Hooper
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING LEAD FRAME WITH SEMICONDUCTOR DIE AND...
- Publication number 20230178457
- Publication date Jun 8, 2023
- NXP B.V.
- Chayathorn Saklang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CHIP WITH SOLID-STATE POWER STORAGE DEVICE
- Publication number 20220415883
- Publication date Dec 29, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi Ching Ong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IoT and AI System Package with Solid-State Battery Enhanced Perform...
- Publication number 20210305137
- Publication date Sep 30, 2021
- International Business Machines Corporation
- Frank Robert Libsch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Body-Mountable Device with a Common Substrate for Electronics and B...
- Publication number 20190043815
- Publication date Feb 7, 2019
- Verily Life Sciences LLC
- William James Biederman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Body-Mountable Device with a Common Substrate for Electronics and B...
- Publication number 20170301616
- Publication date Oct 19, 2017
- Verily Life Sciences LLC
- William James Biederman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP SEMICONDUCTOR POWER PACKAGE
- Publication number 20170213783
- Publication date Jul 27, 2017
- INFINEON TECHNOLOGIES AG
- Andreas Meiser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE OF BATTERY PROTECTION CIRCUIT MODULE PACKAGE COUPLED WITH...
- Publication number 20160164146
- Publication date Jun 9, 2016
- ITM SEMICONDUCTOR CO., LTD.
- Hyeokhwi NA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE INCLUDING EMBEDDED THIN-FILM BATTERY
- Publication number 20140315334
- Publication date Oct 23, 2014
- Michael J. Hundt
- G21 - NUCLEAR PHYSICS NUCLEAR ENGINEERING
Information Patent Application
Microelectronic Device with Integrated Energy Source
- Publication number 20140027730
- Publication date Jan 30, 2014
- Joseph H. McCain
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Microelectronic Device with Integrated Energy Source
- Publication number 20120025982
- Publication date Feb 2, 2012
- Joseph McCain
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD FOR MANUFACTURING A SEMICONDUCTOR COMPONENT AND STRUCTURE TH...
- Publication number 20110292632
- Publication date Dec 1, 2011
- Yenting Wen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Microelectronic Device With Integrated Energy Source
- Publication number 20090221925
- Publication date Sep 3, 2009
- Joseph H. McCain
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Microelectronic device with integrated energy source
- Publication number 20060267167
- Publication date Nov 30, 2006
- Joseph H. McCain
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Integrated circuit package including embedded thin-film battery
- Publication number 20060001137
- Publication date Jan 5, 2006
- STMicroelectronics, Inc.
- Michael J. Hundt
- G21 - NUCLEAR PHYSICS NUCLEAR ENGINEERING

Battery in combination with a leadframe

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

IoT and AI system package with solid-state battery enhanced perform...

Body-mountable device with a common substrate for electronics and b...

Structure of battery protection circuit module package coupled with...

Body-mountable device with a common substrate for electronics and b...

Body-mountable device with a common substrate for electronics and b...

Microelectronic device with integrated energy source

Microelectronic device with integrated energy source

Integrated circuit package including embedded thin-film battery

Integrated circuit package including embedded thin-film battery

Method for manufacturing a semiconductor component and structure th...

Microelectronic device with integrated energy source

Microelectronic device with integrated energy source

Microelectronic device with integrated energy source

Battery mounted integrated circuit device

Surface mountable integrated circuit package with integrated batter...

Molded package integrated circuit with electrochemical cell

Surface mountable integrated circuit package with integrated batter...

Method for reducing conductive and convective heat loss from the ba...

IC package having direct attach backup battery

IC package having replaceable backup battery

Integrated circuit package with battery housing

Integrated circuit package with molded cell

Application of laminated interconnect media between a laminated pow...

Method for packaging an electronic circuit device

Integrated circuit package with laminated backup cell

Integrated circuit package with molded cell

Semiconductor with a battery unit

Zero power IC module

Integrated circuit package with battery housing

Zero power IC module

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE WITH EMBEDDED BATTERY AND METHOD THEREFOR

SEMICONDUCTOR PACKAGE HAVING LEAD FRAME WITH SEMICONDUCTOR DIE AND...

INTEGRATED CHIP WITH SOLID-STATE POWER STORAGE DEVICE

IoT and AI System Package with Solid-State Battery Enhanced Perform...

Body-Mountable Device with a Common Substrate for Electronics and B...

Body-Mountable Device with a Common Substrate for Electronics and B...

MULTI-CHIP SEMICONDUCTOR POWER PACKAGE

STRUCTURE OF BATTERY PROTECTION CIRCUIT MODULE PACKAGE COUPLED WITH...

INTEGRATED CIRCUIT PACKAGE INCLUDING EMBEDDED THIN-FILM BATTERY

Microelectronic Device with Integrated Energy Source

Microelectronic Device with Integrated Energy Source

METHOD FOR MANUFACTURING A SEMICONDUCTOR COMPONENT AND STRUCTURE TH...

Microelectronic Device With Integrated Energy Source

Microelectronic device with integrated energy source

Integrated circuit package including embedded thin-film battery