Beam lead frame or beam lead device

Industry

CPC
Y10T29/49121

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Parent Industries

YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS Y10USPC classification Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION Y10T29/00Metal working

Current Industry

Y10T29/49121Beam lead frame or beam lead device

Industries

Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing an ultrasonic probe
- Patent number 11,903,319
- Issue date Feb 13, 2024
- FUJIFILM Healthcare Corporation
- Hidetsugu Katsura
- G01 - MEASURING TESTING
Information Patent Grant
Planar cavity MEMS and related structures, methods of manufacture a...
- Patent number 11,174,160
- Issue date Nov 16, 2021
- International Business Machines Corporation
- Anthony K. Stamper
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Planar cavity mems and related structures, methods of manufacture a...
- Patent number 11,111,138
- Issue date Sep 7, 2021
- International Business Machines Corporation
- Anthony K. Stamper
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Planar cavity MEMS and related structures, methods of manufacture a...
- Patent number 11,111,139
- Issue date Sep 7, 2021
- International Business Machines Corporation
- Christopher V. Jahnes
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Planar cavity MEMS and related structures, methods of manufacture a...
- Patent number 11,104,572
- Issue date Aug 31, 2021
- International Business Machines Corporation
- Christopher V. Jahnes
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Electronic module
- Patent number 11,071,207
- Issue date Jul 20, 2021
- IMBERATEK, LLC
- Risto Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Locking dual leadframe for flip chip on leadframe packages
- Patent number 11,056,462
- Issue date Jul 6, 2021
- Texas Instruments Incorporated
- Lee Han Meng @ Eugene Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Planar cavity MEMS and related structures, methods of manufacture a...
- Patent number 11,021,364
- Issue date Jun 1, 2021
- International Business Machines Corporation
- Russell T. Herrin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Planar cavity MEMS and related structures, methods of manufacture a...
- Patent number 10,906,803
- Issue date Feb 2, 2021
- International Business Machines Corporation
- Russell T. Herrin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Micro-electro-mechanical system (MEMS) and related actuator bumps,...
- Patent number 10,811,206
- Issue date Oct 20, 2020
- International Business Machines Corporation
- Christopher V. Jahnes
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Planar cavity MEMS and related structures, methods of manufacture a...
- Patent number 10,766,765
- Issue date Sep 8, 2020
- International Business Machines Corporation
- Christopher V. Jahnes
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for manufacturing electronic component
- Patent number 10,770,205
- Issue date Sep 8, 2020
- Murata Manufacturing Co., Ltd.
- Haruhiko Mori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro-electro-mechanical system (MEMS) and related actuator bumps,...
- Patent number 10,748,725
- Issue date Aug 18, 2020
- International Business Machines Corporation
- Christopher V. Jahnes
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Planar cavity MEMS and related structures, methods of manufacture a...
- Patent number 10,640,364
- Issue date May 5, 2020
- International Business Machines Corporation
- Christopher V. Jahnes
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Planar cavity MEMS and related structures, methods of manufacture a...
- Patent number 10,640,365
- Issue date May 5, 2020
- International Business Machines Corporation
- Christopher V. Jahnes
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Planar cavity MEMS and related structures, methods of manufacture a...
- Patent number 10,618,802
- Issue date Apr 14, 2020
- International Business Machines Corporation
- Anthony K. Stamper
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for forming embedded members, pre-structure prepared therefr...
- Patent number 10,622,776
- Issue date Apr 14, 2020
- STARCONN ELECTRONIC (SU ZHOU) CO., LTD
- Yu-Feng Ke
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Planar cavity MEMS and related structures, methods of manufacture a...
- Patent number 10,618,803
- Issue date Apr 14, 2020
- International Business Machines Corporation
- Christopher V. Jahnes
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for producing electrically conductive members
- Patent number 10,622,144
- Issue date Apr 14, 2020
- Nissin Kogyo Co., Ltd.
- Takuro Kodama
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Planar cavity MEMS and related structures, methods of manufacture a...
- Patent number 10,584,026
- Issue date Mar 10, 2020
- International Business Machines Corporation
- Christopher V. Jahnes
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Methods of assembling a flip chip on a locking dual leadframe
- Patent number 10,541,225
- Issue date Jan 21, 2020
- Texas Instruments Incorporated
- Lee Han Meng @ Eugene Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,490,486
- Issue date Nov 26, 2019
- Renesas Electronics Corporation
- Hajime Hasebe
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Multi-layer substrate for semiconductor packaging
- Patent number 10,446,457
- Issue date Oct 15, 2019
- Advanpack Solutions PTE LTD
- Shoa Siong Lim
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Selective planishing method for making a semiconductor device
- Patent number 10,438,816
- Issue date Oct 8, 2019
- Texas Instruments Incorporated
- Donald C. Abbott
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Planar cavity MEMS and related structures, methods of manufacture a...
- Patent number 10,414,646
- Issue date Sep 17, 2019
- International Business Machines Corporation
- Russell T. Herrin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Integrated circuit including sensor having injection molded magneti...
- Patent number 10,355,197
- Issue date Jul 16, 2019
- Infineon Technologies AG
- Udo Ausserlechner
- G01 - MEASURING TESTING
Information Patent Grant
Planar cavity MEMS and related structures, methods of manufacture a...
- Patent number 10,315,913
- Issue date Jun 11, 2019
- International Business Machines Corporation
- Christopher V. Jahnes
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Planar cavity MEMS and related structures, methods of manufacture a...
- Patent number 10,308,501
- Issue date Jun 4, 2019
- International Business Machines Corporation
- Christopher V. Jahnes
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of forming a power module with a magnetic device having a co...
- Patent number 10,304,615
- Issue date May 28, 2019
- Enpirion, Inc.
- Ashraf W. Lotfi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Back-to-back stacked dies
- Patent number 10,290,618
- Issue date May 14, 2019
- Intersil Americas LLC
- Francois Hebert
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC MODULE
- Publication number 20210321520
- Publication date Oct 14, 2021
- IMBERATEK, LLC
- Risto Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLANAR CAVITY MEMS AND RELATED STRUCTURES, METHODS OF MANUFACTURE A...
- Publication number 20200024127
- Publication date Jan 23, 2020
- International Business Machines Corporation
- Christopher V. JAHNES
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PLANAR CAVITY MEMS AND RELATED STRUCTURES, METHODS OF MANUFACTURE A...
- Publication number 20200017355
- Publication date Jan 16, 2020
- International Business Machines Corporation
- Anthony K. Stamper
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PLANAR CAVITY MEMS AND RELATED STRUCTURES, METHODS OF MANUFACTURE A...
- Publication number 20200017356
- Publication date Jan 16, 2020
- International Business Machines Corporation
- Christopher V. JAHNES
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PLANAR CAVITY MEMS AND RELATED STRUCTURES, METHODS OF MANUFACTURE A...
- Publication number 20190315619
- Publication date Oct 17, 2019
- International Business Machines Corporation
- Russell T. HERRIN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PLANAR CAVITY MEMS AND RELATED STRUCTURES, METHODS OF MANUFACTURE A...
- Publication number 20190248644
- Publication date Aug 15, 2019
- International Business Machines Corporation
- Christopher V. JAHNES
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PLANAR CAVITY MEMS AND RELATED STRUCTURES, METHODS OF MANUFACTURE A...
- Publication number 20190233277
- Publication date Aug 1, 2019
- International Business Machines Corporation
- Christopher V. JAHNES
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PLANAR CAVITY MEMS AND RELATED STRUCTURES, METHODS OF MANUFACTURE A...
- Publication number 20190169017
- Publication date Jun 6, 2019
- International Business Machines Corporation
- Christopher V. JAHNES
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PLANAR CAVITY MEMS AND RELATED STRUCTURES, METHODS OF MANUFACTURE A...
- Publication number 20190152767
- Publication date May 23, 2019
- International Business Machines Corporation
- Christopher V. JAHNES
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICRO-ELECTRO-MECHANICAL SYSTEM (MEMS) AND RELATED ACTUATOR BUMPS,...
- Publication number 20190115179
- Publication date Apr 18, 2019
- International Business Machines Corporation
- Christopher V. JAHNES
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20190027427
- Publication date Jan 24, 2019
- RENESAS ELECTRONICS CORPORATION
- Hajime HASEBE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLANAR CAVITY MEMS AND RELATED STRUCTURES, METHODS OF MANUFACTURE A...
- Publication number 20180346318
- Publication date Dec 6, 2018
- International Business Machines Corporation
- Anthony K. Stamper
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Multi-Layer Substrate For Semiconductor Packaging
- Publication number 20180323121
- Publication date Nov 8, 2018
- Advanpack Solutions Pte Ltd
- Shoa Siong LIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLANAR CAVITY MEMS AND RELATED STRUCTURES, METHODS OF MANUFACTURE A...
- Publication number 20180257931
- Publication date Sep 13, 2018
- International Business Machines Corporation
- Christopher V. JAHNES
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SELECTIVE PLANISHING METHOD FOR MAKING A SEMICONDUCTOR DEVICE
- Publication number 20180204739
- Publication date Jul 19, 2018
- TEXAS INSTRUMENTS INCORPORATED
- Donald C. Abbott
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLANAR CAVITY MEMS AND RELATED STRUCTURES, METHODS OF MANUFACTURE A...
- Publication number 20180072568
- Publication date Mar 15, 2018
- International Business Machines Corporation
- Anthony K. Stamper
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PLANAR CAVITY MEMS AND RELATED STRUCTURES, METHODS OF MANUFACTURE A...
- Publication number 20180072566
- Publication date Mar 15, 2018
- International Business Machines Corporation
- Christopher V. JAHNES
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PLANAR CAVITY MEMS AND RELATED STRUCTURES, METHODS OF MANUFACTURE A...
- Publication number 20180072567
- Publication date Mar 15, 2018
- International Business Machines Corporation
- Christopher V. JAHNES
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PLANAR CAVITY MEMS AND RELATED STRUCTURES, METHODS OF MANUFACTURE A...
- Publication number 20180057357
- Publication date Mar 1, 2018
- International Business Machines Corporation
- Russell T. HERRIN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PLANAR CAVITY MEMS AND RELATED STRUCTURES, METHODS OF MANUFACTURE A...
- Publication number 20180050903
- Publication date Feb 22, 2018
- International Business Machines Corporation
- Russell T. HERRIN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PLANAR CAVITY MEMS AND RELATED STRUCTURES, METHODS OF MANUFACTURE A...
- Publication number 20180009658
- Publication date Jan 11, 2018
- International Business Machines Corporation
- Christopher V. JAHNES
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
INTEGRATED CIRCUIT INCLUDING SENSOR HAVING INJECTION MOLDED MAGNETI...
- Publication number 20170358735
- Publication date Dec 14, 2017
- Infineon Technologies AG
- Udo Ausserlechner
- G01 - MEASURING TESTING
Information Patent Application
Method for Reducing Crosstalk in Electrical Connectors
- Publication number 20170324198
- Publication date Nov 9, 2017
- Panduit Corp.
- Jack E. Caveney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADLESS SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURE
- Publication number 20140377910
- Publication date Dec 25, 2014
- Jerry Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADFRAME WITH LEAD OF VARYING THICKNESS
- Publication number 20140367838
- Publication date Dec 18, 2014
- Donald Charles Abbott
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD OF ELECTRONIC DEVICE
- Publication number 20140347838
- Publication date Nov 27, 2014
- DENSO CORPORATION
- Toshihiro NAGAYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURE
- Publication number 20140338956
- Publication date Nov 20, 2014
- Dwight L. DANIELS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME, METHOD FOR MANUFACTURING LEAD FRAME, SEMICONDUCTOR DEVI...
- Publication number 20140319663
- Publication date Oct 30, 2014
- Satoshi SHIBASAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A DATA CARRIER PROVIDED WITH A MICROCIRCUIT
- Publication number 20140290051
- Publication date Oct 2, 2014
- GEMALTO TECHNOLOGIES ASIA LTD
- Chi Tung Tsoi
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
DUAL STAGE VACUUM CHAMBER WITH FULL CIRCUIT BOARD SUPPORT
- Publication number 20140292362
- Publication date Oct 2, 2014
- Clement C. Adams
- G01 - MEASURING TESTING

Beam lead frame or beam lead device

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method of manufacturing an ultrasonic probe

Planar cavity MEMS and related structures, methods of manufacture a...

Planar cavity mems and related structures, methods of manufacture a...

Planar cavity MEMS and related structures, methods of manufacture a...

Planar cavity MEMS and related structures, methods of manufacture a...

Electronic module

Locking dual leadframe for flip chip on leadframe packages

Planar cavity MEMS and related structures, methods of manufacture a...

Planar cavity MEMS and related structures, methods of manufacture a...

Micro-electro-mechanical system (MEMS) and related actuator bumps,...

Planar cavity MEMS and related structures, methods of manufacture a...

Method for manufacturing electronic component

Micro-electro-mechanical system (MEMS) and related actuator bumps,...

Planar cavity MEMS and related structures, methods of manufacture a...

Planar cavity MEMS and related structures, methods of manufacture a...

Planar cavity MEMS and related structures, methods of manufacture a...

Method for forming embedded members, pre-structure prepared therefr...

Planar cavity MEMS and related structures, methods of manufacture a...

Method for producing electrically conductive members

Planar cavity MEMS and related structures, methods of manufacture a...

Methods of assembling a flip chip on a locking dual leadframe

Semiconductor device

Multi-layer substrate for semiconductor packaging

Selective planishing method for making a semiconductor device

Planar cavity MEMS and related structures, methods of manufacture a...

Integrated circuit including sensor having injection molded magneti...

Planar cavity MEMS and related structures, methods of manufacture a...

Planar cavity MEMS and related structures, methods of manufacture a...

Method of forming a power module with a magnetic device having a co...

Back-to-back stacked dies

Patents Applicationslast 30 patents

ELECTRONIC MODULE

PLANAR CAVITY MEMS AND RELATED STRUCTURES, METHODS OF MANUFACTURE A...

PLANAR CAVITY MEMS AND RELATED STRUCTURES, METHODS OF MANUFACTURE A...

PLANAR CAVITY MEMS AND RELATED STRUCTURES, METHODS OF MANUFACTURE A...

PLANAR CAVITY MEMS AND RELATED STRUCTURES, METHODS OF MANUFACTURE A...

PLANAR CAVITY MEMS AND RELATED STRUCTURES, METHODS OF MANUFACTURE A...

PLANAR CAVITY MEMS AND RELATED STRUCTURES, METHODS OF MANUFACTURE A...

PLANAR CAVITY MEMS AND RELATED STRUCTURES, METHODS OF MANUFACTURE A...

PLANAR CAVITY MEMS AND RELATED STRUCTURES, METHODS OF MANUFACTURE A...

MICRO-ELECTRO-MECHANICAL SYSTEM (MEMS) AND RELATED ACTUATOR BUMPS,...

SEMICONDUCTOR DEVICE

PLANAR CAVITY MEMS AND RELATED STRUCTURES, METHODS OF MANUFACTURE A...

Multi-Layer Substrate For Semiconductor Packaging

PLANAR CAVITY MEMS AND RELATED STRUCTURES, METHODS OF MANUFACTURE A...

SELECTIVE PLANISHING METHOD FOR MAKING A SEMICONDUCTOR DEVICE

PLANAR CAVITY MEMS AND RELATED STRUCTURES, METHODS OF MANUFACTURE A...

PLANAR CAVITY MEMS AND RELATED STRUCTURES, METHODS OF MANUFACTURE A...

PLANAR CAVITY MEMS AND RELATED STRUCTURES, METHODS OF MANUFACTURE A...

PLANAR CAVITY MEMS AND RELATED STRUCTURES, METHODS OF MANUFACTURE A...

PLANAR CAVITY MEMS AND RELATED STRUCTURES, METHODS OF MANUFACTURE A...

PLANAR CAVITY MEMS AND RELATED STRUCTURES, METHODS OF MANUFACTURE A...

INTEGRATED CIRCUIT INCLUDING SENSOR HAVING INJECTION MOLDED MAGNETI...

Method for Reducing Crosstalk in Electrical Connectors

LEADLESS SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURE

LEADFRAME WITH LEAD OF VARYING THICKNESS

ELECTRONIC DEVICE AND MANUFACTURING METHOD OF ELECTRONIC DEVICE

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURE

LEAD FRAME, METHOD FOR MANUFACTURING LEAD FRAME, SEMICONDUCTOR DEVI...

METHOD OF MANUFACTURING A DATA CARRIER PROVIDED WITH A MICROCIRCUIT

DUAL STAGE VACUUM CHAMBER WITH FULL CIRCUIT BOARD SUPPORT