Beam leads

Industry

CPC
H01L23/4822

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/4822Beam leads

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor packages and methods for forming the same
- Patent number 12,159,814
- Issue date Dec 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shin-Yi Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-substrate via structure and method of manufacture
- Patent number 12,119,294
- Issue date Oct 15, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods for forming the same
- Patent number 11,854,944
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shin-Yi Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming micro interconnect struc...
- Patent number 11,710,691
- Issue date Jul 25, 2023
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Francis J. Carney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a laser-connected terminal
- Patent number 11,664,342
- Issue date May 30, 2023
- Fuji Electric Co., Ltd.
- Shinji Tada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-substrate via structure and method of manufacture
- Patent number 11,616,008
- Issue date Mar 28, 2023
- Semiconductor Components Industries, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro-fabricated, stress-engineered members formed on passivation l...
- Patent number 11,527,420
- Issue date Dec 13, 2022
- Palo Alto Research Center Incorporated
- Christopher L. Chua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat-dissipating semiconductor package including a plurality of met...
- Patent number 11,133,235
- Issue date Sep 28, 2021
- DELTA ELECTRONICS INT'L (SINGAPORE) PTE LTD
- Jie Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-substrate via structure and method of manufacture
- Patent number 10,950,534
- Issue date Mar 16, 2021
- Semiconductor Components Industries, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer structure with mode suppression
- Patent number 10,930,742
- Issue date Feb 23, 2021
- Raytheon Company
- Hooman Kazemi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming cantilevered protrusion...
- Patent number 10,903,154
- Issue date Jan 26, 2021
- Semiconductor Components Industries, LLC
- Francis J. Carney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,886,207
- Issue date Jan 5, 2021
- Denso Corporation
- Takanori Kawashima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, power converter, and method of manufacturing...
- Patent number 10,879,139
- Issue date Dec 29, 2020
- Mitsubishi Electric Corporation
- Takahiro Nishimura
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Semiconductor device and method of forming micro interconnect struc...
- Patent number 10,825,764
- Issue date Nov 3, 2020
- Semiconductor Components Industries, LLC
- Francis J. Carney
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Semiconductor device and method of forming a curved image sensor
- Patent number 10,818,587
- Issue date Oct 27, 2020
- Semiconductor Components Industries, LLC
- Michael J. Seddon
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Stacked semiconductor device structure and method
- Patent number 10,741,484
- Issue date Aug 11, 2020
- Semiconductor Components Industries, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermosonically bonded connection for flip chip packages
- Patent number 10,741,415
- Issue date Aug 11, 2020
- STMicroelectronics S.r.l.
- Mauro Mazzola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,699,997
- Issue date Jun 30, 2020
- Denso Corporation
- Takanori Kawashima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and power converter
- Patent number 10,593,609
- Issue date Mar 17, 2020
- Toyota Jidosha Kabushiki Kaisha
- Yuji Nishibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IC die, ultrasound probe, ultrasonic diagnostic system and method
- Patent number 10,586,753
- Issue date Mar 10, 2020
- Koninklijke Philips N.V.
- Egbertus Reinier Jacobs
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Semiconductor module
- Patent number 10,461,042
- Issue date Oct 29, 2019
- Shindengen Electric Manufacturing Co., Ltd.
- Kosuke Ikeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming cantilevered protrusion...
- Patent number 10,453,784
- Issue date Oct 22, 2019
- Semiconductor Components Industries, LLC
- Francis J. Carney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-substrate via structure and method of manufacture
- Patent number 10,446,480
- Issue date Oct 15, 2019
- Semiconductor Components Industries, LLC
- Michael J. Seddon
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Transparent electronics for invisible smart dust applications
- Patent number 10,396,061
- Issue date Aug 27, 2019
- International Business Machines Corporation
- Ning Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Weld joint with constant overlap area
- Patent number 10,290,616
- Issue date May 14, 2019
- GALATECH, INC.
- Wenjun Liu
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Semiconductor device and electronic apparatus
- Patent number 10,262,924
- Issue date Apr 16, 2019
- ABLIC INC.
- Kiyoaki Kadoi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of aligning semiconductor wafers fo...
- Patent number 10,199,316
- Issue date Feb 5, 2019
- Semiconductor Components Industries, LLC
- Michael J. Seddon
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Photovoltaic junction box and diode
- Patent number 10,193,495
- Issue date Jan 29, 2019
- Tyco Electronics (Shanghai) Co. Ltd.
- Wenbo Lv
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Stacked semiconductor device structure and method
- Patent number 10,163,772
- Issue date Dec 25, 2018
- Semiconductor Components Industries, LLC
- Michael J. Seddon
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Thermosonically bonded connection for flip chip packages
- Patent number 10,141,197
- Issue date Nov 27, 2018
- STMicroelectronics S.r.l.
- Mauro Mazzola
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
THROUGH-SUBSTRATE VIA STRUCTURE AND METHOD OF MANUFACTURE
- Publication number 20240297106
- Publication date Sep 5, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS FOR FORMING THE SAME
- Publication number 20240087990
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shin-Yi YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS FOR FORMING THE SAME
- Publication number 20230378030
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shin-Yi YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING MICRO INTERCONNECT STRUC...
- Publication number 20230307343
- Publication date Sep 28, 2023
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Francis J. CARNEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20230124778
- Publication date Apr 20, 2023
- Fuji Electric Co., Ltd.
- Akito NAKAGOME
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS FOR FORMING THE SAME
- Publication number 20220310489
- Publication date Sep 29, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shin-Yi YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH-SUBSTRATE VIA STRUCTURE AND METHOD OF MANUFACTURE
- Publication number 20210167002
- Publication date Jun 3, 2021
- Semiconductor Components Industries, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING MICRO INTERCONNECT STRUC...
- Publication number 20210043553
- Publication date Feb 11, 2021
- Semiconductor Components Industries, LLC
- Francis J. CARNEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20200373213
- Publication date Nov 26, 2020
- Delta Electronics Int'l (Singapore) Pte Ltd
- Jie Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER STRUCTURE WITH MODE SUPPRESSION
- Publication number 20200219982
- Publication date Jul 9, 2020
- Raytheon Company
- Hooman Kazemi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING CANTILEVERED PROTRUSION...
- Publication number 20190378788
- Publication date Dec 12, 2019
- Semiconductor Components Industries, LLC
- Francis J. Carney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH-SUBSTRATE VIA STRUCTURE AND METHOD OF MANUFACTURE
- Publication number 20190371721
- Publication date Dec 5, 2019
- Semiconductor Components Industries, LLC
- Michael J. Seddon
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20190355653
- Publication date Nov 21, 2019
- Toyota Jidosha Kabushiki Kaisha
- Takanori KAWASHIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20190252307
- Publication date Aug 15, 2019
- Toyota Jidosha Kabushiki Kaisha
- Takanori Kawashima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RECONSTITUTED WAFER STRUCTURE
- Publication number 20190165108
- Publication date May 30, 2019
- Raytheon Company
- Hooman Kazemi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMOSONICALLY BONDED CONNECTION FOR FLIP CHIP PACKAGES
- Publication number 20190088503
- Publication date Mar 21, 2019
- STMicroelectronics S.r.l.
- Mauro Mazzola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WELD JOINT WITH CONSTANT OVERLAP AREA
- Publication number 20190051638
- Publication date Feb 14, 2019
- Galatech, Inc.
- Wenjun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND ELECTRONIC APPARATUS
- Publication number 20180286786
- Publication date Oct 4, 2018
- ABLIC Inc.
- Kiyoaki KADOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING CANTILEVERED PROTRUSION...
- Publication number 20180240742
- Publication date Aug 23, 2018
- Semiconductor Components Industries, LLC
- Francis J. Carney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20180226356
- Publication date Aug 9, 2018
- Shindengen Electric Manufacturing Co., Ltd.
- Kosuke IKEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING CANTILEVERED PROTRUSION...
- Publication number 20180182698
- Publication date Jun 28, 2018
- Semiconductor Components Industries, LLC
- Francis J. Carney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF ALIGNING SEMICONDUCTOR WAFERS FO...
- Publication number 20180076120
- Publication date Mar 15, 2018
- Semiconductor Components Industries, LLC
- Michael J. Seddon
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
THERMOSONICALLY BONDED CONNECTION FOR FLIP CHIP PACKAGES
- Publication number 20170287730
- Publication date Oct 5, 2017
- STMicroelectronics S.r.l.
- Mauro Mazzola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Photovoltaic Junction Box and Diode
- Publication number 20170163211
- Publication date Jun 8, 2017
- Tyco Electronics (Shanghai) Co. Ltd.
- Wenbo Lv
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING MICRO INTERCONNECT STRUC...
- Publication number 20170084517
- Publication date Mar 23, 2017
- Semiconductor Components Industries, LLC
- Francis J. CARNEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE WITH SHAPED LEADS AND METHOD OF FORMING T...
- Publication number 20160172262
- Publication date Jun 16, 2016
- STMicroelectronics Pte Ltd
- Yiyi MA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTIPLE DIE IN A FACE DOWN PACKAGE
- Publication number 20150243631
- Publication date Aug 27, 2015
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20150235923
- Publication date Aug 20, 2015
- CALSONIC KANSEI CORPORATION
- Hiroki Yasuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH PIN COUNT, SMALL PACKAGES HAVING HEAT-DISSIPATING PAD
- Publication number 20150228566
- Publication date Aug 13, 2015
- TEXAS INSTRUMENTS INCORPORATED
- Sreenivasan K. KODURI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20150179620
- Publication date Jun 25, 2015
- Mitsubishi Electric Corporation
- Noboru Miyamoto
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor packages and methods for forming the same

Through-substrate via structure and method of manufacture

Semiconductor packages and methods for forming the same

Semiconductor device and method of forming micro interconnect struc...

Semiconductor device with a laser-connected terminal

Through-substrate via structure and method of manufacture

Micro-fabricated, stress-engineered members formed on passivation l...

Heat-dissipating semiconductor package including a plurality of met...

Through-substrate via structure and method of manufacture

Wafer structure with mode suppression

Semiconductor device and method of forming cantilevered protrusion...

Semiconductor device

Semiconductor device, power converter, and method of manufacturing...

Semiconductor device and method of forming micro interconnect struc...

Semiconductor device and method of forming a curved image sensor

Stacked semiconductor device structure and method

Thermosonically bonded connection for flip chip packages

Semiconductor device

Semiconductor device and power converter

IC die, ultrasound probe, ultrasonic diagnostic system and method

Semiconductor module

Semiconductor device and method of forming cantilevered protrusion...

Through-substrate via structure and method of manufacture

Transparent electronics for invisible smart dust applications

Weld joint with constant overlap area

Semiconductor device and electronic apparatus

Semiconductor device and method of aligning semiconductor wafers fo...

Photovoltaic junction box and diode

Stacked semiconductor device structure and method

Thermosonically bonded connection for flip chip packages

Patents Applicationslast 30 patents

THROUGH-SUBSTRATE VIA STRUCTURE AND METHOD OF MANUFACTURE

SEMICONDUCTOR PACKAGES AND METHODS FOR FORMING THE SAME

SEMICONDUCTOR PACKAGES AND METHODS FOR FORMING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF FORMING MICRO INTERCONNECT STRUC...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGES AND METHODS FOR FORMING THE SAME

THROUGH-SUBSTRATE VIA STRUCTURE AND METHOD OF MANUFACTURE

SEMICONDUCTOR DEVICE AND METHOD OF FORMING MICRO INTERCONNECT STRUC...

PACKAGE STRUCTURE

WAFER STRUCTURE WITH MODE SUPPRESSION

SEMICONDUCTOR DEVICE AND METHOD OF FORMING CANTILEVERED PROTRUSION...

THROUGH-SUBSTRATE VIA STRUCTURE AND METHOD OF MANUFACTURE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

RECONSTITUTED WAFER STRUCTURE

THERMOSONICALLY BONDED CONNECTION FOR FLIP CHIP PACKAGES

WELD JOINT WITH CONSTANT OVERLAP AREA

SEMICONDUCTOR DEVICE AND ELECTRONIC APPARATUS

SEMICONDUCTOR DEVICE AND METHOD OF FORMING CANTILEVERED PROTRUSION...

SEMICONDUCTOR MODULE

SEMICONDUCTOR DEVICE AND METHOD OF FORMING CANTILEVERED PROTRUSION...

SEMICONDUCTOR DEVICE AND METHOD OF ALIGNING SEMICONDUCTOR WAFERS FO...

THERMOSONICALLY BONDED CONNECTION FOR FLIP CHIP PACKAGES

Photovoltaic Junction Box and Diode

SEMICONDUCTOR DEVICE AND METHOD OF FORMING MICRO INTERCONNECT STRUC...

INTEGRATED CIRCUIT DEVICE WITH SHAPED LEADS AND METHOD OF FORMING T...

MULTIPLE DIE IN A FACE DOWN PACKAGE

SEMICONDUCTOR DEVICE

HIGH PIN COUNT, SMALL PACKAGES HAVING HEAT-DISSIPATING PAD

SEMICONDUCTOR DEVICE