being a bump

Industry

CPC
H01L2224/02333

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/02333being a bump

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Fabricating wafers with electrical contacts on a surface parallel t...
- Patent number 12,009,352
- Issue date Jun 11, 2024
- Illumina, Inc.
- Arvin Emadi
- G01 - MEASURING TESTING
Information Patent Grant
Redistribution layers and methods of fabricating the same in semico...
- Patent number 11,967,573
- Issue date Apr 23, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsiang-Ku Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure
- Patent number 11,855,039
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ling-Wei Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming microvias with reduced diameter
- Patent number 11,798,903
- Issue date Oct 24, 2023
- Applied Materials, Inc.
- Chintan Buch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including plurality of semiconductor chips on...
- Patent number 11,791,298
- Issue date Oct 17, 2023
- Samsung Electronics Co., Ltd.
- Yun Tae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing the same
- Patent number 11,637,081
- Issue date Apr 25, 2023
- Samsung Electronics Co., Ltd.
- Jongyoun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Redistribution layers and methods of fabricating the same in semico...
- Patent number 11,581,276
- Issue date Feb 14, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsiang-Ku Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and method of manufacture
- Patent number 11,532,582
- Issue date Dec 20, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jiun Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packages with Si-substrate-free interposer and method forming same
- Patent number 11,527,465
- Issue date Dec 13, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package with conductive pillars and reinforcin...
- Patent number 11,521,958
- Issue date Dec 6, 2022
- Advanced Semiconductor Engineering, Inc.
- Ya Fang Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure
- Patent number 11,456,276
- Issue date Sep 27, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ling-Wei Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming microvias with reduced diameter
- Patent number 11,315,890
- Issue date Apr 26, 2022
- Applied Materials, Inc.
- Chintan Buch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and formation method of package structure with stacked se...
- Patent number 11,239,180
- Issue date Feb 1, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yi-Chao Mao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and package-on-package structure
- Patent number 11,239,157
- Issue date Feb 1, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chuei-Tang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages with external bump pads having trench portio...
- Patent number 11,177,199
- Issue date Nov 16, 2021
- Samsung Electronics Co., Ltd.
- Gayoung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package and manufacturing method thereof
- Patent number 11,171,098
- Issue date Nov 9, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tian Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including plurality of semiconductor chips on...
- Patent number 11,164,838
- Issue date Nov 2, 2021
- Samsung Electronics Co., Ltd.
- Yun Tae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing the same
- Patent number 11,145,611
- Issue date Oct 12, 2021
- Samsung Electronics Co., Ltd.
- Jongyoun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 11,018,105
- Issue date May 25, 2021
- Cypress Semiconductor Corporation
- Masanori Onodera
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packages with Si-substrate-free interposer and method forming same
- Patent number 10,971,443
- Issue date Apr 6, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser-releasable bonding materials for 3-D IC applications
- Patent number 10,968,348
- Issue date Apr 6, 2021
- Brewer Science, Inc.
- Xiao Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 10,879,227
- Issue date Dec 29, 2020
- Renesas Electronics Corporation
- Yoichiro Kurita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor chip, package structure, and pacakge-on-package struc...
- Patent number 10,777,502
- Issue date Sep 15, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chuei-Tang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out semiconductor packaging structure with antenna module and m...
- Patent number 10,770,394
- Issue date Sep 8, 2020
- SJ SEMICONDUCTOR (JIANGYIN) CORPORATION
- Yenheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure and method for forming the same
- Patent number 10,770,427
- Issue date Sep 8, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ling-Wei Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for achieving uniformity across a redistributio...
- Patent number 10,714,436
- Issue date Jul 14, 2020
- Lam Research Corporation
- Bryan L. Buckalew
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Packages with Si-substrate-free interposer and method forming same
- Patent number 10,685,910
- Issue date Jun 16, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 10,580,763
- Issue date Mar 3, 2020
- Renesas Electronics Corporation
- Yoichiro Kurita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure, semiconductor chip and method of fabricating the...
- Patent number 10,504,835
- Issue date Dec 10, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chuei-Tang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package device and method of manufacturing the same
- Patent number 10,497,657
- Issue date Dec 3, 2019
- Advanced Semiconductor Engineering, Inc.
- Wen-Long Lu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR FORMING A REDISTRIBUTION LAYER STRUCTURE, AND CHIP PACKA...
- Publication number 20240371803
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jui-Wen SU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDISTRIBUTION LAYERS AND METHODS OF FABRICATING THE SAME IN SEMICO...
- Publication number 20240274558
- Publication date Aug 15, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Hsiang-Ku Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLYIMIDE LAYER DEPRESSIONS BETWEEN METAL PILLARS
- Publication number 20240258251
- Publication date Aug 1, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Katleen Fajardo TIMBOL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240194626
- Publication date Jun 13, 2024
- Samsung Electronics Co., Ltd.
- SOOJEOUNG PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE
- Publication number 20240088090
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ling-Wei LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE FOR REDUCING WARPAGE OF PLASTIC PACKAGE WAFER AND...
- Publication number 20240071873
- Publication date Feb 29, 2024
- NATIONAL CENTER FOR ADVANCED PACKAGING CO., LTD.
- Liqiang CAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D FAN-OUT PACKAGING STRUCTURE OF INTERCONNECTION SYSTEM WITH ULTRA...
- Publication number 20230386950
- Publication date Nov 30, 2023
- SJ Semiconductor(Jiangyin) Corporation
- Yenheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED INTEGRATED CIRCUIT
- Publication number 20230378135
- Publication date Nov 23, 2023
- SK HYNIX INC.
- Dong Uk LEE
- G11 - INFORMATION STORAGE
Information Patent Application
Redistribution Layers And Methods Of Fabricating The Same In Semico...
- Publication number 20230187392
- Publication date Jun 15, 2023
- Taiwan Semiconductor Manufacturing Co., LTD
- Hsiang-Ku Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE WITH CONDUCTIVE PILLARS AND REINFORCIN...
- Publication number 20230094668
- Publication date Mar 30, 2023
- Advanced Semiconductor Engineering, Inc.
- Ya Fang CHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Package and Method of Manufacture
- Publication number 20220359445
- Publication date Nov 10, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jiun Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods Of Forming Microvias With Reduced Diameter
- Publication number 20220246558
- Publication date Aug 4, 2022
- Applied Materials, Inc.
- Chintan Buch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATING WAFERS WITH ELECTRICAL CONTACTS ON A SURFACE PARALLEL T...
- Publication number 20220216191
- Publication date Jul 7, 2022
- Illumina, Inc.
- Arvin EMADI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE WITH STACKED SEMICONDUCTOR DIES
- Publication number 20220157743
- Publication date May 19, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Chao MAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURE
- Publication number 20220068862
- Publication date Mar 3, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jiun Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods Of Forming Microvias With Reduced Diameter
- Publication number 20220051999
- Publication date Feb 17, 2022
- Applied Materials, Inc.
- Chintan Buch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING PLURALITY OF SEMICONDUCTOR CHIPS ON...
- Publication number 20220037276
- Publication date Feb 3, 2022
- Samsung Electronics Co., Ltd.
- Yun Tae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20210407940
- Publication date Dec 30, 2021
- Samsung Electronics Co., Ltd.
- Jongyoun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20210257324
- Publication date Aug 19, 2021
- Samsung Electronics Co., Ltd.
- SOOJEOUNG PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP SCALE PACKAGE WITH REDISTRIBUTION LAYER INTERRUPTS
- Publication number 20210210462
- Publication date Jul 8, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Vivek Swaminathan Sridharan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE
- Publication number 20210134781
- Publication date May 6, 2021
- Advanced Semiconductor Engineering, Inc.
- Ya Fang CHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Redistribution Layers And Methods Of Fabricating The Same In Semico...
- Publication number 20210098400
- Publication date Apr 1, 2021
- Taiwan Semiconductor Manufacturing Co., LTD
- Hsiang-Ku Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND SEMICONDUCTOR MODULES INCLUDING THE SEMI...
- Publication number 20210028096
- Publication date Jan 28, 2021
- Samsung Electronics Co., Ltd.
- GAYOUNG KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE
- Publication number 20200411468
- Publication date Dec 31, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ling-Wei LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND PACKAGE-ON-PACKAGE STRUCTURE
- Publication number 20200381357
- Publication date Dec 3, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chuei-Tang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20200266167
- Publication date Aug 20, 2020
- Samsung Electronics Co., Ltd.
- Yun Tae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20200118994
- Publication date Apr 16, 2020
- RENESAS ELECTRONICS CORPORATION
- Yoichiro KURITA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20200105695
- Publication date Apr 2, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tian Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP, PACKAGE STRUCTURE, AND PACAKGE-ON-PACKAGE STRUC...
- Publication number 20200066631
- Publication date Feb 27, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chuei-Tang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20200058610
- Publication date Feb 20, 2020
- CYPRESS SEMICONDUCTOR CORPORATION
- Masanori Onodera
- H01 - BASIC ELECTRIC ELEMENTS

being a bump

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Fabricating wafers with electrical contacts on a surface parallel t...

Redistribution layers and methods of fabricating the same in semico...

Chip package structure

Methods of forming microvias with reduced diameter

Semiconductor package including plurality of semiconductor chips on...

Semiconductor package and method of manufacturing the same

Redistribution layers and methods of fabricating the same in semico...

Semiconductor device package and method of manufacture

Packages with Si-substrate-free interposer and method forming same

Semiconductor device package with conductive pillars and reinforcin...

Chip package structure

Methods of forming microvias with reduced diameter

Structure and formation method of package structure with stacked se...

Package structure and package-on-package structure

Semiconductor packages with external bump pads having trench portio...

Package and manufacturing method thereof

Semiconductor package including plurality of semiconductor chips on...

Semiconductor package and method of manufacturing the same

Semiconductor device and method of manufacturing the same

Packages with Si-substrate-free interposer and method forming same

Laser-releasable bonding materials for 3-D IC applications

Electronic device

Semiconductor chip, package structure, and pacakge-on-package struc...

Fan-out semiconductor packaging structure with antenna module and m...

Chip package structure and method for forming the same

Systems and methods for achieving uniformity across a redistributio...

Packages with Si-substrate-free interposer and method forming same

Electronic device

Package structure, semiconductor chip and method of fabricating the...

Semiconductor package device and method of manufacturing the same

Patents Applicationslast 30 patents

METHOD FOR FORMING A REDISTRIBUTION LAYER STRUCTURE, AND CHIP PACKA...

REDISTRIBUTION LAYERS AND METHODS OF FABRICATING THE SAME IN SEMICO...

POLYIMIDE LAYER DEPRESSIONS BETWEEN METAL PILLARS

SEMICONDUCTOR PACKAGE

CHIP PACKAGE STRUCTURE

PACKAGE STRUCTURE FOR REDUCING WARPAGE OF PLASTIC PACKAGE WAFER AND...

3D FAN-OUT PACKAGING STRUCTURE OF INTERCONNECTION SYSTEM WITH ULTRA...

STACKED INTEGRATED CIRCUIT

Redistribution Layers And Methods Of Fabricating The Same In Semico...

SEMICONDUCTOR DEVICE PACKAGE WITH CONDUCTIVE PILLARS AND REINFORCIN...

Semiconductor Device Package and Method of Manufacture

Methods Of Forming Microvias With Reduced Diameter

FABRICATING WAFERS WITH ELECTRICAL CONTACTS ON A SURFACE PARALLEL T...

PACKAGE STRUCTURE WITH STACKED SEMICONDUCTOR DIES

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURE

Methods Of Forming Microvias With Reduced Diameter

SEMICONDUCTOR PACKAGE INCLUDING PLURALITY OF SEMICONDUCTOR CHIPS ON...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE

CHIP SCALE PACKAGE WITH REDISTRIBUTION LAYER INTERRUPTS

SEMICONDUCTOR DEVICE PACKAGE

Redistribution Layers And Methods Of Fabricating The Same In Semico...

SEMICONDUCTOR PACKAGES AND SEMICONDUCTOR MODULES INCLUDING THE SEMI...

CHIP PACKAGE STRUCTURE

PACKAGE STRUCTURE AND PACKAGE-ON-PACKAGE STRUCTURE

SEMICONDUCTOR PACKAGE

ELECTRONIC DEVICE

PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR CHIP, PACKAGE STRUCTURE, AND PACAKGE-ON-PACKAGE STRUC...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME