being a combination of two or more materials provided in the groups H01L2924/0471 - H01L2924/0486

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H01L2924/0489

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

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H01L2924/0489being a combination of two or more materials provided in the groups H01L2924/0471 - H01L2924/0486

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Patents Grantslast 30 patents

Information Patent Grant
Reduced expansion thermal compression bonding process bond head
- Patent number 9,548,284
- Issue date Jan 17, 2017
- Intel Corporation
- Pramod Malatkar
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Methods for bonding a die and a substrate
- Patent number 9,111,901
- Issue date Aug 18, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Jin-Wook Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices that include a die bonded to a substrate with...
- Patent number 9,105,599
- Issue date Aug 11, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Jin-Wook Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die bonding a semiconductor device
- Patent number 8,753,983
- Issue date Jun 17, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Jin-Wook Jang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
THERMALLY CONDUCTIVE FILM-LIKE ADHESIVE, SEMICONDUCTOR PACKAGE, AND...
- Publication number 20240128154
- Publication date Apr 18, 2024
- FURUKAWA ELECTRIC CO., LTD.
- Minoru MORITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCED EXPANSION THERMAL COMPRESSION BONDING PROCESS BOND HEAD
- Publication number 20150171047
- Publication date Jun 18, 2015
- Intel Corporation
- Pramod Malatkar
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
DEVICES HAVING INHOMOGENEOUS SILICIDE SCHOTTKY BARRIER CONTACTS
- Publication number 20150061034
- Publication date Mar 5, 2015
- TEXAS INSTRUMENTS INCORPORATED
- DEBORAH JEAN RILEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR BONDING A DIE AND A SUBSTRATE
- Publication number 20140256091
- Publication date Sep 11, 2014
- FREESCALE SEMICONDUCTOR, INC.
- JIN-WOOK JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES THAT INCLUDE A DIE BONDED TO A SUBSTRATE WITH...
- Publication number 20140252586
- Publication date Sep 11, 2014
- FREESCALE SEMICONDUCTOR, INC.
- JIN-WOOK JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE BONDING A SEMICONDUCTOR DEVICE
- Publication number 20110163439
- Publication date Jul 7, 2011
- Jin-Wook Jang
- H01 - BASIC ELECTRIC ELEMENTS