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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

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H01L2924/0509being a combination of two or more materials provided in the groups H01L2924/0491 - H01L2924/0506

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Patents Grantslast 30 patents

Information Patent Grant
Heterogenous bonding layers for direct semiconductor bonding
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- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Technologies for plasma oxidation protection during hybrid bonding...
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heterogenous bonding layers for direct semiconductor bonding
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- Issue date Aug 20, 2024
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with composite conductive features and method...
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor device with slanted conductive...
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Information Patent Grant
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- NANYA TECHNOLOGY CORPORATION
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
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Information Patent Grant
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Information Patent Grant
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- Issue date Jan 12, 2021
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Information Patent Grant
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- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
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- Issue date Mar 20, 2018
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- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE
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Information Patent Application
SEMICONDUCTOR DEVICE WITH COMPOSITE CONDUCTIVE FEATURES AND METHOD...
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SEMICONDUCTOR DEVICE WITH COMPOSITE CONDUCTIVE FEATURES AND METHOD...
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Information Patent Application
HETEROGENOUS BONDING LAYERS FOR DIRECT SEMICONDUCTOR BONDING
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Information Patent Application
SEMICONDUCTOR DEVICE WITH COMPOSITE CONDUCTIVE FEATURES AND METHOD...
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- NANYA TECHNOLOGY CORPORATION
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Information Patent Application
TECHNOLOGIES FOR PLASMA OXIDATION PROTECTION DURING HYBRID BONDING...
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Information Patent Application
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SEMICONDUCTOR DEVICE WITH SLANTED CONDUCTIVE LAYERS AND METHOD FOR...
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Information Patent Application
SEMICONDUCTOR DEVICE WITH GRAPHENE LAYERS AND METHOD FOR FABRICATIN...
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND PAD RELIABILITY OF SEMICONDUCTOR DEVICES
- Publication number 20210013166
- Publication date Jan 14, 2021
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- RAMASAMY CHOCKALINGAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20170092605
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- RENESAS ELECTRONICS CORPORATION
- Takashi TONEGAWA
- H01 - BASIC ELECTRIC ELEMENTS

being a combination of two or more materials provided in the groups H01L2924/0491 - H01L2924/0506

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Heterogenous bonding layers for direct semiconductor bonding

Technologies for plasma oxidation protection during hybrid bonding...

Heterogenous bonding layers for direct semiconductor bonding

Semiconductor device with composite conductive features and method...

Method for fabricating semiconductor device with slanted conductive...

Method for fabricating semiconductor device with graphene layers

Semiconductor device with graphene layers and method for fabricatin...

Semiconductor device with slanted conductive layers and method for...

Bond pad reliability of semiconductor devices

Sensor and manufacturing method thereof

Semiconductor device and method of manufacturing semiconductor device

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE WITH COMPOSITE CONDUCTIVE FEATURES AND METHOD...

SEMICONDUCTOR DEVICE WITH COMPOSITE CONDUCTIVE FEATURES AND METHOD...

HETEROGENOUS BONDING LAYERS FOR DIRECT SEMICONDUCTOR BONDING

SEMICONDUCTOR DEVICE WITH COMPOSITE CONDUCTIVE FEATURES AND METHOD...

TECHNOLOGIES FOR PLASMA OXIDATION PROTECTION DURING HYBRID BONDING...

HETEROGENOUS BONDING LAYERS FOR DIRECT SEMICONDUCTOR BONDING

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

METHOD FOR FABRICATING SEMICONDUCTOR DEVICE WITH GRAPHENE LAYERS

METHOD FOR FABRICATING SEMICONDUCTOR DEVICE WITH SLANTED CONDUCTIVE...

SEMICONDUCTOR DEVICE WITH SLANTED CONDUCTIVE LAYERS AND METHOD FOR...

SEMICONDUCTOR DEVICE WITH GRAPHENE LAYERS AND METHOD FOR FABRICATIN...

BOND PAD RELIABILITY OF SEMICONDUCTOR DEVICES

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE