being a combination of two or more materials provided in the groups H01L2924/0511 - H01L2924/0526

Industry

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H01L2924/0529

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/0529being a combination of two or more materials provided in the groups H01L2924/0511 - H01L2924/0526

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Bonded assembly containing oxidation barriers and/or adhesion enhan...
- Patent number 11,139,272
- Issue date Oct 5, 2021
- SanDisk Technologies LLC
- Raghuveer S. Makala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal bonding pads for packaging applications
- Patent number 10,825,792
- Issue date Nov 3, 2020
- International Business Machines Corporation
- Chih-Chao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal bonding pads for packaging applications
- Patent number 10,381,323
- Issue date Aug 13, 2019
- International Business Machines Corporation
- Chih-Chao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal bonding pads for packaging applications
- Patent number 10,020,281
- Issue date Jul 10, 2018
- International Business Machines Corporation
- Chih-Chao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive lines and pads and method of manufacturing thereof
- Patent number 8,586,472
- Issue date Nov 19, 2013
- Infineon Technologies AG
- Roland Hampp
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT AND PREPARATION METHOD THEREOF, THREE-DIMENSIONA...
- Publication number 20250054888
- Publication date Feb 13, 2025
- Huawei Technologies Co., Ltd
- Ran He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED ASSEMBLY CONTAINING OXIDATION BARRIERS AND/OR ADHESION ENHAN...
- Publication number 20210028149
- Publication date Jan 28, 2021
- SANDISK TECHNOLOGIES LLC
- Raghuveer S. MAKALA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL BONDING PADS FOR PACKAGING APPLICATIONS
- Publication number 20190304948
- Publication date Oct 3, 2019
- International Business Machines Corporation
- Chih-Chao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL BONDING PADS FOR PACKAGING APPLICATIONS
- Publication number 20180269177
- Publication date Sep 20, 2018
- International Business Machines Corporation
- Chih-Chao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL BONDING PADS FOR PACKAGING APPLICATIONS
- Publication number 20180061804
- Publication date Mar 1, 2018
- International Business Machines Corporation
- Chih-Chao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Conductive Lines and Pads and Method of Manufacturing Thereof
- Publication number 20150194398
- Publication date Jul 9, 2015
- INFINEON TECHNOLOGIES AG
- Roland Hampp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Conductive Lines and Pads and Method of Manufacturing Thereof
- Publication number 20140048940
- Publication date Feb 20, 2014
- INFINEON TECHNOLOGIES AG
- Roland Hampp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Conductive Lines and Pads and Method of Manufacturing Thereof
- Publication number 20120013011
- Publication date Jan 19, 2012
- Roland Hampp
- H01 - BASIC ELECTRIC ELEMENTS

being a combination of two or more materials provided in the groups H01L2924/0511 - H01L2924/0526

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Bonded assembly containing oxidation barriers and/or adhesion enhan...

Metal bonding pads for packaging applications

Metal bonding pads for packaging applications

Metal bonding pads for packaging applications

Conductive lines and pads and method of manufacturing thereof

Patents Applicationslast 30 patents

INTEGRATED CIRCUIT AND PREPARATION METHOD THEREOF, THREE-DIMENSIONA...

BONDED ASSEMBLY CONTAINING OXIDATION BARRIERS AND/OR ADHESION ENHAN...

METAL BONDING PADS FOR PACKAGING APPLICATIONS

METAL BONDING PADS FOR PACKAGING APPLICATIONS

METAL BONDING PADS FOR PACKAGING APPLICATIONS

Conductive Lines and Pads and Method of Manufacturing Thereof

Conductive Lines and Pads and Method of Manufacturing Thereof

Conductive Lines and Pads and Method of Manufacturing Thereof