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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/1016being a cuboid

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor packages with an intermetallic layer
- Patent number 12,255,167
- Issue date Mar 18, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing a multi-chip assembly
- Patent number 12,191,296
- Issue date Jan 7, 2025
- Infineon Technologies AG
- Ling Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing semiconductor device
- Patent number 12,057,362
- Issue date Aug 6, 2024
- Rohm Co., Ltd.
- Osamu Miyata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pad structure design in fan-out package
- Patent number 11,984,405
- Issue date May 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die package with conductive line crack prevention design
- Patent number 11,854,956
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ya-Huei Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure
- Patent number 11,562,935
- Issue date Jan 24, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pad structure design in fan-out package
- Patent number 11,424,189
- Issue date Aug 23, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and die
- Patent number 11,244,891
- Issue date Feb 8, 2022
- Novatek Microelectronics Corp.
- Jhih-Siou Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cavity wall structure for semiconductor packaging
- Patent number 11,139,233
- Issue date Oct 5, 2021
- UTAC HEADQUARTERS PTE. LTD.
- Hua Hong Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip modules including stacked semiconductor dice
- Patent number 11,101,245
- Issue date Aug 24, 2021
- Micron Technology, Inc.
- Eric Tan Swee Seng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing semiconductor device
- Patent number 11,069,591
- Issue date Jul 20, 2021
- Rohm Co., Ltd.
- Osamu Miyata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages
- Patent number 11,049,843
- Issue date Jun 29, 2021
- Semiconductor Components Industries, LLC
- Phillip Celaya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages with an intermetallic layer
- Patent number 11,049,833
- Issue date Jun 29, 2021
- Semiconductor Components Industries, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with island and associated leads
- Patent number 10,978,379
- Issue date Apr 13, 2021
- Rohm Co., Ltd.
- Akihiro Koga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Positional relationship among components of semiconductor device
- Patent number 10,796,983
- Issue date Oct 6, 2020
- Renesas Electronics Corporation
- Noriyuki Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cavity wall structure for semiconductor packaging
- Patent number 10,707,161
- Issue date Jul 7, 2020
- UTAC HEADQUARTERS PTE. LTD.
- Hua Hong Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chips and semiconductor packages including the same
- Patent number 10,622,312
- Issue date Apr 14, 2020
- Samsung Electronics Co., Ltd.
- Myoung-soo Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High power gallium nitride devices and structures
- Patent number 10,615,094
- Issue date Apr 7, 2020
- Zhanming Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 10,586,777
- Issue date Mar 10, 2020
- Renesas Electronics Corporation
- Kentaro Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High power gallium nitride devices and structures
- Patent number 10,586,749
- Issue date Mar 10, 2020
- Zhanming Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pad structure design in fan-out package
- Patent number 10,510,670
- Issue date Dec 17, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,461,053
- Issue date Oct 29, 2019
- Renesas Electronics Corporation
- Shinya Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Positional relationship among components of semiconductor device
- Patent number 10,461,020
- Issue date Oct 29, 2019
- Renesas Electronics Corporation
- Noriyuki Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with island and associated leads
- Patent number 10,431,527
- Issue date Oct 1, 2019
- Rohm Co., Ltd.
- Akihiro Koga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing semiconductor device
- Patent number 10,431,516
- Issue date Oct 1, 2019
- Rohm Co., Ltd.
- Osamu Miyata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package for assembling various dice in a single...
- Patent number 10,410,996
- Issue date Sep 10, 2019
- Dialog Semiconductor (UK) Limited
- Melvin Martin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Paste material, wiring member formed from the paste material, and e...
- Patent number 10,392,518
- Issue date Aug 27, 2019
- Samsung Electronics Co., Ltd.
- Kunmo Chu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated circuit package for assembling various dice in a single...
- Patent number 10,332,864
- Issue date Jun 25, 2019
- Dialog Semiconductor (UK) Limited
- Melvin Martin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Camera module and electronic device
- Patent number 10,313,567
- Issue date Jun 4, 2019
- Sony Corporation
- Toshihide Ueno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages with leadframes and related methods
- Patent number 10,304,798
- Issue date May 28, 2019
- Semiconductor Components Industries, LLC
- Phillip Celaya
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGES WITH AN INTERMETALLIC LAYER
- Publication number 20250201753
- Publication date Jun 19, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES WITH AN INTERMETALLIC LAYER
- Publication number 20250183217
- Publication date Jun 5, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE AND METHODS OF FORMATION
- Publication number 20250112183
- Publication date Apr 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- CHERN-YOW HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240321813
- Publication date Sep 26, 2024
- Kabushiki Kaisha Toshiba
- Syotaro Ono
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Selectively Dispensed Underfill and Edge Bond Patterns
- Publication number 20240249989
- Publication date Jul 25, 2024
- Apple Inc.
- Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...
- Publication number 20240250035
- Publication date Jul 25, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Se Hwan Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240234271
- Publication date Jul 11, 2024
- Mitsubishi Electric Corporation
- Norikazu SAKAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COOLED POWER MODULE
- Publication number 20240234239
- Publication date Jul 11, 2024
- GM GLOBAL TECHNOLOGY OPERATIONS LLC
- Muhammad Hussain Alvi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE PACKAGE WITH CONDUCTIVE LINE CRACK PREVENTION DESIGN
- Publication number 20240096778
- Publication date Mar 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ya-Huei LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Packages and Methods of Forming the Same
- Publication number 20240088093
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20230411272
- Publication date Dec 21, 2023
- Innolux Corporation
- Cheng-Chi Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230197553
- Publication date Jun 22, 2023
- Samsung Electronics Co., Ltd.
- KYUNGDON MUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Pad Structure Design in Fan-Out Package
- Publication number 20220352080
- Publication date Nov 3, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND DIE
- Publication number 20220028775
- Publication date Jan 27, 2022
- NOVATEK MICROELECTRONICS CORP.
- Jhih-Siou Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20210313245
- Publication date Oct 7, 2021
- Rohm Co., Ltd.
- Osamu Miyata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Pad Structure Design in Fan-Out Package
- Publication number 20200091075
- Publication date Mar 19, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20190393116
- Publication date Dec 26, 2019
- Rohm Co., Ltd.
- Osamu Miyata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH ISLAND AND ASSOCIATED LEADS
- Publication number 20190385937
- Publication date Dec 19, 2019
- Rohm Co., Ltd.
- Akihiro KOGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20190139842
- Publication date May 9, 2019
- Taiwan Semiconductor Manufacturing company Ltd.
- HSIEN-WEI CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20190027455
- Publication date Jan 24, 2019
- RENESAS ELECTRONICS CORPORATION
- SHINYA SUZUKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE THEREOF
- Publication number 20190019775
- Publication date Jan 17, 2019
- Toshiba Memory Corporation
- Takuma KAWAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20180315686
- Publication date Nov 1, 2018
- RENESAS ELECTRONICS CORPORATION
- Noriyuki TAKAHASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High Power Gallium Nitride Devices and Structures
- Publication number 20180247879
- Publication date Aug 30, 2018
- Zhanming Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High Power Gallium Nitride Devices and Structures
- Publication number 20180218961
- Publication date Aug 2, 2018
- Zhanming Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Package For Assembling Various Dice In A Single...
- Publication number 20180158804
- Publication date Jun 7, 2018
- Dialog Semiconductor (UK) Limited
- Melvin Martin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND RELATED METHODS
- Publication number 20180138144
- Publication date May 17, 2018
- Semiconductor Components Industries, LLC
- Phillip CELAYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20180108629
- Publication date Apr 19, 2018
- RENESAS ELECTRONICS CORPORATION
- Kentaro YAMADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING LOW ON RESISTANCE
- Publication number 20180090463
- Publication date Mar 29, 2018
- RENESAS ELECTRONICS CORPORATION
- Yukihiro SATOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE HAVING RECTANGULAR ASPECT RATIO
- Publication number 20180090462
- Publication date Mar 29, 2018
- Scot A. Kellar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND PRODUCTION METHOD THEREFOR
- Publication number 20180068972
- Publication date Mar 8, 2018
- Rohm Co., Ltd.
- Shoji Yasunaga
- H01 - BASIC ELECTRIC ELEMENTS

being a cuboid

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor packages with an intermetallic layer

Method of producing a multi-chip assembly

Semiconductor device and method for manufacturing semiconductor device

Pad structure design in fan-out package

Semiconductor die package with conductive line crack prevention design

Semiconductor structure

Pad structure design in fan-out package

Integrated circuit package and die

Cavity wall structure for semiconductor packaging

Multi-chip modules including stacked semiconductor dice

Semiconductor device and method for manufacturing semiconductor device

Semiconductor packages

Semiconductor packages with an intermetallic layer

Semiconductor device with island and associated leads

Positional relationship among components of semiconductor device

Cavity wall structure for semiconductor packaging

Semiconductor chips and semiconductor packages including the same

High power gallium nitride devices and structures

Semiconductor device and method of manufacturing the same

High power gallium nitride devices and structures

Pad structure design in fan-out package

Semiconductor device

Positional relationship among components of semiconductor device

Semiconductor device with island and associated leads

Semiconductor device and method for manufacturing semiconductor device

Integrated circuit package for assembling various dice in a single...

Paste material, wiring member formed from the paste material, and e...

Integrated circuit package for assembling various dice in a single...

Camera module and electronic device

Semiconductor packages with leadframes and related methods

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGES WITH AN INTERMETALLIC LAYER

SEMICONDUCTOR PACKAGES WITH AN INTERMETALLIC LAYER

SEMICONDUCTOR DIE AND METHODS OF FORMATION

SEMICONDUCTOR DEVICE

Selectively Dispensed Underfill and Edge Bond Patterns

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...

SEMICONDUCTOR DEVICE

COOLED POWER MODULE

SEMICONDUCTOR DIE PACKAGE WITH CONDUCTIVE LINE CRACK PREVENTION DESIGN

Integrated Circuit Packages and Methods of Forming the Same

ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE

Pad Structure Design in Fan-Out Package

INTEGRATED CIRCUIT PACKAGE AND DIE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

Pad Structure Design in Fan-Out Package

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE WITH ISLAND AND ASSOCIATED LEADS

SEMICONDUCTOR STRUCTURE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE THEREOF

SEMICONDUCTOR DEVICE

High Power Gallium Nitride Devices and Structures

High Power Gallium Nitride Devices and Structures

Integrated Circuit Package For Assembling Various Dice In A Single...

SEMICONDUCTOR PACKAGES AND RELATED METHODS

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE HAVING LOW ON RESISTANCE

INTEGRATED CIRCUIT PACKAGE HAVING RECTANGULAR ASPECT RATIO

SEMICONDUCTOR DEVICE AND PRODUCTION METHOD THEREFOR