Membership
Tour
Register
Log in
being a cuboid
Follow
Industry
CPC
H01L2924/1016
This industry / category may be too specific. Please go to a parent level for more data
Parent Industries
H
ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2924/00
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
Current Industry
H01L2924/1016
being a cuboid
Industries
Overview
Organizations
People
Information
Impact
Patents Grants
last 30 patents
Information
Patent Grant
Semiconductor packages with an intermetallic layer
Patent number
12,255,167
Issue date
Mar 18, 2025
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Michael J. Seddon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of producing a multi-chip assembly
Patent number
12,191,296
Issue date
Jan 7, 2025
Infineon Technologies AG
Ling Ma
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method for manufacturing semiconductor device
Patent number
12,057,362
Issue date
Aug 6, 2024
Rohm Co., Ltd.
Osamu Miyata
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Pad structure design in fan-out package
Patent number
11,984,405
Issue date
May 14, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor die package with conductive line crack prevention design
Patent number
11,854,956
Issue date
Dec 26, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Ya-Huei Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor structure
Patent number
11,562,935
Issue date
Jan 24, 2023
Taiwan Semiconductor Manufacturing Company Ltd.
Hsien-Wei Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Pad structure design in fan-out package
Patent number
11,424,189
Issue date
Aug 23, 2022
Taiwan Semiconductor Manufacturing Company, Ltd.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit package and die
Patent number
11,244,891
Issue date
Feb 8, 2022
Novatek Microelectronics Corp.
Jhih-Siou Cheng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Cavity wall structure for semiconductor packaging
Patent number
11,139,233
Issue date
Oct 5, 2021
UTAC HEADQUARTERS PTE. LTD.
Hua Hong Tan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multi-chip modules including stacked semiconductor dice
Patent number
11,101,245
Issue date
Aug 24, 2021
Micron Technology, Inc.
Eric Tan Swee Seng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method for manufacturing semiconductor device
Patent number
11,069,591
Issue date
Jul 20, 2021
Rohm Co., Ltd.
Osamu Miyata
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor packages
Patent number
11,049,843
Issue date
Jun 29, 2021
Semiconductor Components Industries, LLC
Phillip Celaya
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor packages with an intermetallic layer
Patent number
11,049,833
Issue date
Jun 29, 2021
Semiconductor Components Industries, LLC
Michael J. Seddon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device with island and associated leads
Patent number
10,978,379
Issue date
Apr 13, 2021
Rohm Co., Ltd.
Akihiro Koga
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Positional relationship among components of semiconductor device
Patent number
10,796,983
Issue date
Oct 6, 2020
Renesas Electronics Corporation
Noriyuki Takahashi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Cavity wall structure for semiconductor packaging
Patent number
10,707,161
Issue date
Jul 7, 2020
UTAC HEADQUARTERS PTE. LTD.
Hua Hong Tan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor chips and semiconductor packages including the same
Patent number
10,622,312
Issue date
Apr 14, 2020
Samsung Electronics Co., Ltd.
Myoung-soo Kim
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
High power gallium nitride devices and structures
Patent number
10,615,094
Issue date
Apr 7, 2020
Zhanming Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of manufacturing the same
Patent number
10,586,777
Issue date
Mar 10, 2020
Renesas Electronics Corporation
Kentaro Yamada
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
High power gallium nitride devices and structures
Patent number
10,586,749
Issue date
Mar 10, 2020
Zhanming Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Pad structure design in fan-out package
Patent number
10,510,670
Issue date
Dec 17, 2019
Taiwan Semiconductor Manufacturing Company, Ltd.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device
Patent number
10,461,053
Issue date
Oct 29, 2019
Renesas Electronics Corporation
Shinya Suzuki
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Positional relationship among components of semiconductor device
Patent number
10,461,020
Issue date
Oct 29, 2019
Renesas Electronics Corporation
Noriyuki Takahashi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device with island and associated leads
Patent number
10,431,527
Issue date
Oct 1, 2019
Rohm Co., Ltd.
Akihiro Koga
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method for manufacturing semiconductor device
Patent number
10,431,516
Issue date
Oct 1, 2019
Rohm Co., Ltd.
Osamu Miyata
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit package for assembling various dice in a single...
Patent number
10,410,996
Issue date
Sep 10, 2019
Dialog Semiconductor (UK) Limited
Melvin Martin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Paste material, wiring member formed from the paste material, and e...
Patent number
10,392,518
Issue date
Aug 27, 2019
Samsung Electronics Co., Ltd.
Kunmo Chu
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Integrated circuit package for assembling various dice in a single...
Patent number
10,332,864
Issue date
Jun 25, 2019
Dialog Semiconductor (UK) Limited
Melvin Martin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Camera module and electronic device
Patent number
10,313,567
Issue date
Jun 4, 2019
Sony Corporation
Toshihide Ueno
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor packages with leadframes and related methods
Patent number
10,304,798
Issue date
May 28, 2019
Semiconductor Components Industries, LLC
Phillip Celaya
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
SEMICONDUCTOR PACKAGES WITH AN INTERMETALLIC LAYER
Publication number
20250183217
Publication date
Jun 5, 2025
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Michael J. Seddon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DIE AND METHODS OF FORMATION
Publication number
20250112183
Publication date
Apr 3, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
CHERN-YOW HSU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE
Publication number
20240321813
Publication date
Sep 26, 2024
Kabushiki Kaisha Toshiba
Syotaro Ono
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Selectively Dispensed Underfill and Edge Bond Patterns
Publication number
20240249989
Publication date
Jul 25, 2024
Apple Inc.
Wei Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...
Publication number
20240250035
Publication date
Jul 25, 2024
Amkor Technology Singapore Holding Pte. Ltd.
Se Hwan Hong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE
Publication number
20240234271
Publication date
Jul 11, 2024
Mitsubishi Electric Corporation
Norikazu SAKAI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
COOLED POWER MODULE
Publication number
20240234239
Publication date
Jul 11, 2024
GM GLOBAL TECHNOLOGY OPERATIONS LLC
Muhammad Hussain Alvi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DIE PACKAGE WITH CONDUCTIVE LINE CRACK PREVENTION DESIGN
Publication number
20240096778
Publication date
Mar 21, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Ya-Huei LEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Integrated Circuit Packages and Methods of Forming the Same
Publication number
20240088093
Publication date
Mar 14, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Wensen Hung
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
Publication number
20230411272
Publication date
Dec 21, 2023
Innolux Corporation
Cheng-Chi Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE
Publication number
20230197553
Publication date
Jun 22, 2023
Samsung Electronics Co., Ltd.
KYUNGDON MUN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Pad Structure Design in Fan-Out Package
Publication number
20220352080
Publication date
Nov 3, 2022
Taiwan Semiconductor Manufacturing Co., Ltd.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT PACKAGE AND DIE
Publication number
20220028775
Publication date
Jan 27, 2022
NOVATEK MICROELECTRONICS CORP.
Jhih-Siou Cheng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Publication number
20210313245
Publication date
Oct 7, 2021
Rohm Co., Ltd.
Osamu Miyata
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Pad Structure Design in Fan-Out Package
Publication number
20200091075
Publication date
Mar 19, 2020
Taiwan Semiconductor Manufacturing Company, Ltd.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Publication number
20190393116
Publication date
Dec 26, 2019
Rohm Co., Ltd.
Osamu Miyata
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE WITH ISLAND AND ASSOCIATED LEADS
Publication number
20190385937
Publication date
Dec 19, 2019
Rohm Co., Ltd.
Akihiro KOGA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR STRUCTURE
Publication number
20190139842
Publication date
May 9, 2019
Taiwan Semiconductor Manufacturing company Ltd.
HSIEN-WEI CHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE
Publication number
20190027455
Publication date
Jan 24, 2019
RENESAS ELECTRONICS CORPORATION
SHINYA SUZUKI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE THEREOF
Publication number
20190019775
Publication date
Jan 17, 2019
Toshiba Memory Corporation
Takuma KAWAMURA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE
Publication number
20180315686
Publication date
Nov 1, 2018
RENESAS ELECTRONICS CORPORATION
Noriyuki TAKAHASHI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
High Power Gallium Nitride Devices and Structures
Publication number
20180247879
Publication date
Aug 30, 2018
Zhanming Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
High Power Gallium Nitride Devices and Structures
Publication number
20180218961
Publication date
Aug 2, 2018
Zhanming Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Integrated Circuit Package For Assembling Various Dice In A Single...
Publication number
20180158804
Publication date
Jun 7, 2018
Dialog Semiconductor (UK) Limited
Melvin Martin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGES AND RELATED METHODS
Publication number
20180138144
Publication date
May 17, 2018
Semiconductor Components Industries, LLC
Phillip CELAYA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
Publication number
20180108629
Publication date
Apr 19, 2018
RENESAS ELECTRONICS CORPORATION
Kentaro YAMADA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE HAVING LOW ON RESISTANCE
Publication number
20180090463
Publication date
Mar 29, 2018
RENESAS ELECTRONICS CORPORATION
Yukihiro SATOU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT PACKAGE HAVING RECTANGULAR ASPECT RATIO
Publication number
20180090462
Publication date
Mar 29, 2018
Scot A. Kellar
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND PRODUCTION METHOD THEREFOR
Publication number
20180068972
Publication date
Mar 8, 2018
Rohm Co., Ltd.
Shoji Yasunaga
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
Publication number
20180069073
Publication date
Mar 8, 2018
RENESAS ELECTRONICS CORPORATION
Takuo Funaya
H01 - BASIC ELECTRIC ELEMENTS