being a land array

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CPC
H01L2924/15323

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/15323being a land array

Industries

Patents Grantslast 30 patents

Information Patent Grant
Integrated self-aligned assembly
- Patent number 12,119,307
- Issue date Oct 15, 2024
- Rockley Photonics Limited
- Chia-Te Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Head and printer
- Patent number 11,897,261
- Issue date Feb 13, 2024
- Brother Kogyo Kabushiki Kaisha
- Toru Yamashita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pad design for thermal fatigue resistance and interconnect joint re...
- Patent number 11,848,292
- Issue date Dec 19, 2023
- Intel Corporation
- Sireesha Gogineni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Liquid jetting apparatus and wiring member
- Patent number 11,618,252
- Issue date Apr 4, 2023
- Brother Kogyo Kabushiki Kaisha
- Toru Yamashita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mechanism combining fastener captivation and assembly tilt control...
- Patent number 11,557,529
- Issue date Jan 17, 2023
- Intel Corporation
- Thomas Boyd
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated antenna array packaging structures and methods
- Patent number 11,189,905
- Issue date Nov 30, 2021
- International Business Machines Corporation
- Xiaoxiong Gu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Liquid jetting apparatus and wiring member
- Patent number 10,906,300
- Issue date Feb 2, 2021
- Brother Kogyo Kabushiki Kaisha
- Toru Yamashita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device having a first electronic component and a second...
- Patent number 10,890,813
- Issue date Jan 12, 2021
- Omron Corporation
- Wakahiro Kawai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Top-side connector interface for processor packaging
- Patent number 10,880,994
- Issue date Dec 29, 2020
- Intel Corporation
- Russell S. Aoki
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Liquid jetting apparatus and wiring member
- Patent number 10,618,277
- Issue date Apr 14, 2020
- Brother Kogyo Kabushiki Kaisha
- Toru Yamashita
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Semiconductor device including plural semiconductor chips
- Patent number 10,403,605
- Issue date Sep 3, 2019
- Buffalo Inc.
- Yu Nakase
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photonic integrated circuit package
- Patent number 10,290,619
- Issue date May 14, 2019
- Infinera Corporation
- Peter W. Evans
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Electronic component mounting substrate, electronic device, and ele...
- Patent number 10,249,564
- Issue date Apr 2, 2019
- Kyocera Corporation
- Kensaku Murakami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Techniques and configurations to control movement and position of s...
- Patent number 10,186,497
- Issue date Jan 22, 2019
- Intel Corporation
- Mark D. Summers
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of embedding WLCSP components in E-WLB and E-PLB
- Patent number 10,147,710
- Issue date Dec 4, 2018
- Intel Corporation
- Vijay K. Nair
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip package with interconnects extending through logic chip
- Patent number 10,083,934
- Issue date Sep 25, 2018
- Invensas Corporation
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photonic integrated circuit package
- Patent number 10,037,982
- Issue date Jul 31, 2018
- Infinera Corporation
- Peter W. Evans
- G02 - OPTICS
Information Patent Grant
Photonic integrated circuit package
- Patent number 10,026,723
- Issue date Jul 17, 2018
- Infinera Corporation
- Peter W. Evans
- G02 - OPTICS
Information Patent Grant
Bumped land grid array
- Patent number 9,972,592
- Issue date May 15, 2018
- Avago Technologies General IP (Singapore) Pte. Ltd.
- Ah Ron Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Module with external shield and back-spill barrier for protecting c...
- Patent number 9,974,181
- Issue date May 15, 2018
- Avago Technologies General IP (Singapore) Pte. Ltd.
- Sarah Haney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing element chip, method of manufacturing elect...
- Patent number 9,953,906
- Issue date Apr 24, 2018
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Atsushi Harikai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor package
- Patent number 9,922,846
- Issue date Mar 20, 2018
- Samsung Electronics Co., Ltd.
- Seong-chan Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip package with interconnects extending through logic chip
- Patent number 9,818,723
- Issue date Nov 14, 2017
- Invensas Corporation
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing element chip, method of manufacturing elect...
- Patent number 9,780,021
- Issue date Oct 3, 2017
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Atsushi Harikai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating multi-chip stack structure
- Patent number 9,754,927
- Issue date Sep 5, 2017
- Siliconware Precision Industries Co., Ltd.
- Chung-Lun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board for semiconductor package
- Patent number 9,504,152
- Issue date Nov 22, 2016
- Samsung Electronics Co., Ltd.
- Hai Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor circuit device, electronic device, electronic apparat...
- Patent number 9,484,857
- Issue date Nov 1, 2016
- Seiko Epson Corporation
- Yosuke Itasaka
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Package on package devices and methods of packaging semiconductor dies
- Patent number 9,397,080
- Issue date Jul 19, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Lei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Rigid wave pattern design on chip carrier substrate and printed cir...
- Patent number 9,230,919
- Issue date Jan 5, 2016
- SanDisk Technologies Inc.
- Chin-Tien Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package on package devices and methods of packaging semiconductor dies
- Patent number 8,981,559
- Issue date Mar 17, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Lei Hsu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED SELF-ALIGNED ASSEMBLY
- Publication number 20220122924
- Publication date Apr 21, 2022
- ROCKLEY PHOTONICS LIMITED
- Chia-Te CHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Liquid Jetting Apparatus and Wiring Member
- Publication number 20210229428
- Publication date Jul 29, 2021
- BROTHER KOGYO KABUSHIKI KAISHA
- Toru Yamashita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Liquid Jetting Apparatus and Wiring Member
- Publication number 20200223224
- Publication date Jul 16, 2020
- BROTHER KOGYO KABUSHIKI KAISHA
- Toru Yamashita
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
SEMICONDUCTOR DEVICE CONNECTIONS WITH SINTERED NANOPARTICLES
- Publication number 20200185322
- Publication date Jun 11, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Rongwei Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PAD DESIGN FOR THERMAL FATIGUE RESISTANCE AND INTERCONNECT JOINT RE...
- Publication number 20200118955
- Publication date Apr 16, 2020
- Intel Corporation
- Sireesha GOGINENI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED ANTENNA ARRAY PACKAGING STRUCTURES AND METHODS
- Publication number 20190319338
- Publication date Oct 17, 2019
- International Business Machines Corporation
- Xiaoxiong Gu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MECHANISM COMBINING FASTENER CAPTIVATION AND ASSEMBLY TILT CONTROL...
- Publication number 20190304870
- Publication date Oct 3, 2019
- Intel Corporation
- Thomas Boyd
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTEGRATED EMBEDDED SUBSTRATE AND SOCKET
- Publication number 20190103349
- Publication date Apr 4, 2019
- Intel Corporation
- Ram VISWANATH
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF EMBEDDING WLCSP COMPONENTS IN E-WLB AND E-PLB
- Publication number 20180269190
- Publication date Sep 20, 2018
- Intel Corporation
- Vijay K. NAIR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP PACKAGE WITH INTERCONNECTS EXTENDING THROUGH LOGIC CHIP
- Publication number 20180047704
- Publication date Feb 15, 2018
- Invensas Corporation
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMPED LAND GRID ARRAY
- Publication number 20180005971
- Publication date Jan 4, 2018
- Avago Technologies General IP(Singapore) Pte. Ltd.
- Ah Ron Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TOP-SIDE CONNECTOR INTERFACE FOR PROCESSOR PACKAGING
- Publication number 20170354031
- Publication date Dec 7, 2017
- Intel Corporation
- Russell S. Aoki
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MODULE WITH EXTERNAL SHIELD AND BACK-SPILL BARRIER FOR PROTECTING C...
- Publication number 20170280561
- Publication date Sep 28, 2017
- Avago Technologies General IP (Singapore) PTE. LTD.
- Sarah Haney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING ELEMENT CHIP, METHOD OF MANUFACTURING ELECT...
- Publication number 20170229385
- Publication date Aug 10, 2017
- Panasonic Intellectual Property Management Co., Ltd.
- Atsushi HARIKAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNIQUES AND CONFIGURATIONS TO CONTROL MOVEMENT AND POSITION OF S...
- Publication number 20170229420
- Publication date Aug 10, 2017
- Intel Corporation
- Mark D. Summers
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING ELEMENT CHIP, METHOD OF MANUFACTURING ELECT...
- Publication number 20170229384
- Publication date Aug 10, 2017
- Panasonic Intellectual Property Management Co., Ltd.
- Atsushi HARIKAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP PACKAGE WITH INTERCONNECTS EXTENDING THROUGH LOGIC CHIP
- Publication number 20170200696
- Publication date Jul 13, 2017
- Invensas Corporation
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTONIC INTEGRATED CIRCUIT PACKAGE
- Publication number 20170194310
- Publication date Jul 6, 2017
- Infinera Corporation
- Peter W. Evans
- G02 - OPTICS
Information Patent Application
PHOTONIC INTEGRATED CIRCUIT PACKAGE
- Publication number 20170194308
- Publication date Jul 6, 2017
- Infinera Corporation
- Peter W. Evans
- G02 - OPTICS
Information Patent Application
PHOTONIC INTEGRATED CIRCUIT PACKAGE
- Publication number 20170194309
- Publication date Jul 6, 2017
- Infinera Corporation
- Peter W. Evans
- G02 - OPTICS
Information Patent Application
METALLURGICAL CLAMSHELL METHODS FOR MICRO LAND GRID ARRAY FABRICATION
- Publication number 20150133001
- Publication date May 14, 2015
- International Business Machines Corporation
- Gareth Hougham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RIGID WAVE PATTERN DESIGN ON CHIP CARRIER SUBSTRATE AND PRINTED CIR...
- Publication number 20150054177
- Publication date Feb 26, 2015
- SANDISK TECHNOLOGIES INC.
- Chin-Tien Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING MULTI-CHIP STACK STRUCTURE
- Publication number 20150044821
- Publication date Feb 12, 2015
- Siliconware Precision Industries Co., Ltd.
- Chung-Lun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MILLIMETER-WAVE RADIO FREQUENCY INTEGRATED CIRCUIT PACKAGES WITH IN...
- Publication number 20140145883
- Publication date May 29, 2014
- International Business Machines Corporation
- Christian W. Baks
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package on Package Devices and Methods of Packaging Semiconductor Dies
- Publication number 20130341786
- Publication date Dec 26, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Lei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RIGID WAVE PATTERN DESIGN ON CHIP CARRIER SUBSTRATE AND PRINTED CIR...
- Publication number 20130299959
- Publication date Nov 14, 2013
- Chin-Tien Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSMISSION LINE TRANSITION HAVING VERTICAL STRUCTURE AND SINGLE C...
- Publication number 20130194754
- Publication date Aug 1, 2013
- Samsung Electronics Co Ltd.
- Dong-Yun Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METALLURGICAL CLAMSHELL METHODS FOR MICRO LAND GRID ARRAY FABRICATION
- Publication number 20130072073
- Publication date Mar 21, 2013
- International Business Machines Corporation
- Gareth Hougham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MAKING THERMALLY ENHANCED SEMICONDUCTOR ASSEMBLY WITH BUM...
- Publication number 20120129299
- Publication date May 24, 2012
- Bridge Semiconductor Corporation
- Charles W.C. Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT DEVICE WITH SIGNAL LINE TRANSITION ELEMENT
- Publication number 20110279190
- Publication date Nov 17, 2011
- Duixian Liu
- H01 - BASIC ELECTRIC ELEMENTS

being a land array

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Integrated self-aligned assembly

Head and printer

Pad design for thermal fatigue resistance and interconnect joint re...

Liquid jetting apparatus and wiring member

Mechanism combining fastener captivation and assembly tilt control...

Integrated antenna array packaging structures and methods

Liquid jetting apparatus and wiring member

Electronic device having a first electronic component and a second...

Top-side connector interface for processor packaging

Liquid jetting apparatus and wiring member

Semiconductor device including plural semiconductor chips

Photonic integrated circuit package

Electronic component mounting substrate, electronic device, and ele...

Techniques and configurations to control movement and position of s...

Method of embedding WLCSP components in E-WLB and E-PLB

Multi-chip package with interconnects extending through logic chip

Photonic integrated circuit package

Photonic integrated circuit package

Bumped land grid array

Module with external shield and back-spill barrier for protecting c...

Method of manufacturing element chip, method of manufacturing elect...

Method of manufacturing semiconductor package

Multi-chip package with interconnects extending through logic chip

Method of manufacturing element chip, method of manufacturing elect...

Method for fabricating multi-chip stack structure

Printed circuit board for semiconductor package

Semiconductor circuit device, electronic device, electronic apparat...

Package on package devices and methods of packaging semiconductor dies

Rigid wave pattern design on chip carrier substrate and printed cir...

Package on package devices and methods of packaging semiconductor dies

Patents Applicationslast 30 patents

INTEGRATED SELF-ALIGNED ASSEMBLY

Liquid Jetting Apparatus and Wiring Member

Liquid Jetting Apparatus and Wiring Member

SEMICONDUCTOR DEVICE CONNECTIONS WITH SINTERED NANOPARTICLES

PAD DESIGN FOR THERMAL FATIGUE RESISTANCE AND INTERCONNECT JOINT RE...

INTEGRATED ANTENNA ARRAY PACKAGING STRUCTURES AND METHODS

MECHANISM COMBINING FASTENER CAPTIVATION AND ASSEMBLY TILT CONTROL...

INTEGRATED EMBEDDED SUBSTRATE AND SOCKET

METHOD OF EMBEDDING WLCSP COMPONENTS IN E-WLB AND E-PLB

MULTI-CHIP PACKAGE WITH INTERCONNECTS EXTENDING THROUGH LOGIC CHIP

BUMPED LAND GRID ARRAY

TOP-SIDE CONNECTOR INTERFACE FOR PROCESSOR PACKAGING

MODULE WITH EXTERNAL SHIELD AND BACK-SPILL BARRIER FOR PROTECTING C...

METHOD OF MANUFACTURING ELEMENT CHIP, METHOD OF MANUFACTURING ELECT...

TECHNIQUES AND CONFIGURATIONS TO CONTROL MOVEMENT AND POSITION OF S...

METHOD OF MANUFACTURING ELEMENT CHIP, METHOD OF MANUFACTURING ELECT...

MULTI-CHIP PACKAGE WITH INTERCONNECTS EXTENDING THROUGH LOGIC CHIP

PHOTONIC INTEGRATED CIRCUIT PACKAGE

PHOTONIC INTEGRATED CIRCUIT PACKAGE

PHOTONIC INTEGRATED CIRCUIT PACKAGE

METALLURGICAL CLAMSHELL METHODS FOR MICRO LAND GRID ARRAY FABRICATION

RIGID WAVE PATTERN DESIGN ON CHIP CARRIER SUBSTRATE AND PRINTED CIR...

METHOD FOR FABRICATING MULTI-CHIP STACK STRUCTURE

MILLIMETER-WAVE RADIO FREQUENCY INTEGRATED CIRCUIT PACKAGES WITH IN...

Package on Package Devices and Methods of Packaging Semiconductor Dies

RIGID WAVE PATTERN DESIGN ON CHIP CARRIER SUBSTRATE AND PRINTED CIR...

TRANSMISSION LINE TRANSITION HAVING VERTICAL STRUCTURE AND SINGLE C...

METALLURGICAL CLAMSHELL METHODS FOR MICRO LAND GRID ARRAY FABRICATION

METHOD OF MAKING THERMALLY ENHANCED SEMICONDUCTOR ASSEMBLY WITH BUM...

CIRCUIT DEVICE WITH SIGNAL LINE TRANSITION ELEMENT