being a liquid

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CPC
H01L2224/83085

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/83085being a liquid

Industries

Patents Grantslast 30 patents

Information Patent Grant
Guide apparatus for transferring light-emitting devices onto a subs...
- Patent number 12,040,208
- Issue date Jul 16, 2024
- Samsung Electronics Co., Ltd.
- Myunghee Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting element and display device including the same and me...
- Patent number 11,955,468
- Issue date Apr 9, 2024
- Samsung Display Co., Ltd.
- Yunku Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mass transfer method for micro-LEDs with a temperature-controlled a...
- Patent number 10,784,400
- Issue date Sep 22, 2020
- GUANGDONG UNIVERSITY OF TECHNOLOGY
- Yun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for mass arrangement of micro-component devices
- Patent number 10,748,792
- Issue date Aug 18, 2020
- MAVEN OPTRONICS CO., LTD.
- Chieh Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solution deposited magnetically guided chiplet displacement
- Patent number 10,636,837
- Issue date Apr 28, 2020
- International Business Machines Corporation
- Stephen W. Bedell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for the fluidic assembly of micro-LEDs utilizing...
- Patent number 10,535,640
- Issue date Jan 14, 2020
- eLux Inc.
- Jong-Jan Lee
- G02 - OPTICS
Information Patent Grant
Methods for preparing layered semiconductor structures
- Patent number 10,068,795
- Issue date Sep 4, 2018
- GlobalWafers Co., Ltd.
- Michael J. Ries
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DISPLAY DEVICE
- Publication number 20240387492
- Publication date Nov 21, 2024
- LG ELECTRONICS INC.
- Dohan KIM
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
GUIDE APPARATUS FOR TRANSFERRING LIGHT-EMITTING DEVICES ONTO A SUBS...
- Publication number 20220384231
- Publication date Dec 1, 2022
- Samsung Electronics Co., Ltd.
- Myunghee KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING ELEMENT AND DISPLAY DEVICE INCLUDING THE SAME AND ME...
- Publication number 20210035962
- Publication date Feb 4, 2021
- SAMSUNG DISPLAY CO., LTD.
- Yunku JUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MASS TRANSFER METHOD FOR MICRO-LEDS WITH A TEMPERATURE-CONTROLLED A...
- Publication number 20200203558
- Publication date Jun 25, 2020
- Guangdong University of Technology
- Yun CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System and Method for Immersion Bonding
- Publication number 20170330855
- Publication date Nov 16, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hang Tung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Sintering Utilizing Non-Mechanical Pressure
- Publication number 20140224409
- Publication date Aug 14, 2014
- INTERNATIONAL RECTIFIER CORPORATION
- Henning M. Hauenstein
- B32 - LAYERED PRODUCTS

being a liquid

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Guide apparatus for transferring light-emitting devices onto a subs...

Light emitting element and display device including the same and me...

Mass transfer method for micro-LEDs with a temperature-controlled a...

Method and system for mass arrangement of micro-component devices

Solution deposited magnetically guided chiplet displacement

System and method for the fluidic assembly of micro-LEDs utilizing...

Methods for preparing layered semiconductor structures

Patents Applicationslast 30 patents

DISPLAY DEVICE

GUIDE APPARATUS FOR TRANSFERRING LIGHT-EMITTING DEVICES ONTO A SUBS...

LIGHT EMITTING ELEMENT AND DISPLAY DEVICE INCLUDING THE SAME AND ME...

MASS TRANSFER METHOD FOR MICRO-LEDS WITH A TEMPERATURE-CONTROLLED A...

System and Method for Immersion Bonding

Sintering Utilizing Non-Mechanical Pressure