being a liquid

Industry

CPC
H01L2224/80085

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/80085being a liquid

Industries

Patents Grantslast 30 patents

Information Patent Grant
Guide apparatus for transferring light-emitting devices onto a subs...
- Patent number 12,040,208
- Issue date Jul 16, 2024
- Samsung Electronics Co., Ltd.
- Myunghee Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for transferring micro device
- Patent number 10,937,674
- Issue date Mar 2, 2021
- MIKRO MESA TECHNOLOGY CO., LTD.
- Li-Yi Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for transferring micro device
- Patent number 10,930,528
- Issue date Feb 23, 2021
- MIKRO MESA TECHNOLOGY CO., LTD.
- Shyh-Feng Chen
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Method for transferring at least one thin film
- Patent number 10,242,915
- Issue date Mar 26, 2019
- Fraunhofer-Gesellschaft zur Forderung der Angewandten Forschung E.V.
- Thomas Gerrer
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
BASIC MOLECULE-ASSISTED DIRECT BONDING METHOD
- Publication number 20230387070
- Publication date Nov 30, 2023
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Frank FOURNEL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF ASSEMBLY BY DIRECT BONDING OF ELECTRONIC COMPONENTS
- Publication number 20230207515
- Publication date Jun 29, 2023
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Frank Fournel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR BONDING CHIPS TO A SUBSTRATE BY DIRECT BONDING
- Publication number 20230029338
- Publication date Jan 26, 2023
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Frank FOURNEL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GUIDE APPARATUS FOR TRANSFERRING LIGHT-EMITTING DEVICES ONTO A SUBS...
- Publication number 20220384231
- Publication date Dec 1, 2022
- Samsung Electronics Co., Ltd.
- Myunghee KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR TRANSFERRING MICRO DEVICE
- Publication number 20190252221
- Publication date Aug 15, 2019
- MIKRO MESA TECHNOLOGY CO., LTD.
- Shyh-Feng CHEN
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Application
METHOD FOR TRANSFERRING MICRO DEVICE
- Publication number 20190252222
- Publication date Aug 15, 2019
- MIKRO MESA TECHNOLOGY CO., LTD.
- Li-Yi CHEN
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Application
METHOD FOR TRANSFERRING AT LEAST ONE THIN FILM
- Publication number 20180240709
- Publication date Aug 23, 2018
- Fraunhofer Gesellschaft zur Forderung der angewandten Forschung e.V.
- Thomas Gerrer
- H01 - BASIC ELECTRIC ELEMENTS

being a liquid

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Guide apparatus for transferring light-emitting devices onto a subs...

Method for transferring micro device

Method for transferring micro device

Method for transferring at least one thin film

Patents Applicationslast 30 patents

BASIC MOLECULE-ASSISTED DIRECT BONDING METHOD

METHOD OF ASSEMBLY BY DIRECT BONDING OF ELECTRONIC COMPONENTS

METHOD FOR BONDING CHIPS TO A SUBSTRATE BY DIRECT BONDING

GUIDE APPARATUS FOR TRANSFERRING LIGHT-EMITTING DEVICES ONTO A SUBS...

METHOD FOR TRANSFERRING MICRO DEVICE

METHOD FOR TRANSFERRING MICRO DEVICE

METHOD FOR TRANSFERRING AT LEAST ONE THIN FILM