being a microstrip line type

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H01L2924/19032

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

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H01L2924/19032being a microstrip line type

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Methods for forming microwave tunable composited thin-film dielectr...
- Patent number 12,048,948
- Issue date Jul 30, 2024
- Applied Materials, Inc.
- Yueh Sheng Ow
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Impedance controlled electrical interconnection employing meta-mate...
- Patent number 12,027,465
- Issue date Jul 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Christopher Wyland
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package for a semiconductor device
- Patent number 11,935,848
- Issue date Mar 19, 2024
- Sumitomo Electric Device Innovations, Inc.
- Ikuo Nakashima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices comprising planar waveguide transmission lines
- Patent number 11,784,144
- Issue date Oct 10, 2023
- Infineon Technologies AG
- Horst Theuss
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages
- Patent number 11,735,532
- Issue date Aug 22, 2023
- Samsung Electronics Co., Ltd.
- Joonsung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure having multiple dielectric waveguide channe...
- Patent number 11,682,638
- Issue date Jun 20, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Wen-Shiang Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Distributed inductance integrated field effect transistor structure
- Patent number 11,574,854
- Issue date Feb 7, 2023
- National Research Council of Canada
- Nianhua (Frank) Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,557,553
- Issue date Jan 17, 2023
- Sumitomo Electric Device Innovations, Inc.
- Ikuo Nakashima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Impedance controlled electrical interconnection employing meta-mate...
- Patent number 11,456,255
- Issue date Sep 27, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Christopher Wyland
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with side-radiating wave launcher and waveguide
- Patent number 11,437,706
- Issue date Sep 6, 2022
- Intel Corporation
- Georgios Dogiamis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip
- Patent number 11,373,964
- Issue date Jun 28, 2022
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Yuji Kiyota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages
- Patent number 11,355,445
- Issue date Jun 7, 2022
- Samsung Electronics Co., Ltd.
- Joonsung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stiffener and package substrate for a semiconductor package
- Patent number 11,295,998
- Issue date Apr 5, 2022
- Intel Corporation
- Stephen Christianson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
RF power amplifier pallet
- Patent number 11,075,178
- Issue date Jul 27, 2021
- Ampleon Netherlands B.V.
- Gutta Venkata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microwave antenna apparatus and package
- Patent number 11,005,155
- Issue date May 11, 2021
- Sony Corporation
- Wasif Tanveer Khan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna structure with integrated coupling element and semiconducto...
- Patent number 10,916,854
- Issue date Feb 9, 2021
- Mediatek Inc.
- Jiunn-Nan Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure along with multiple chips bonded through mi...
- Patent number 10,854,580
- Issue date Dec 1, 2020
- Taiwan Semiconductor Manufacturing Company Ltd.
- Wei-Heng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure having multiple dielectric waveguide channe...
- Patent number 10,770,414
- Issue date Sep 8, 2020
- Taiwan Semiconductor Manufacturing Company Ltd.
- Wen-Shiang Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,637,413
- Issue date Apr 28, 2020
- Murata Manufacturing Co., Ltd.
- Takayuki Tsutsui
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Amplifier with integrated directional coupler
- Patent number 10,630,241
- Issue date Apr 21, 2020
- NXP USA, INC.
- Abdulrhman M. S. Ahmed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Impedance controlled electrical interconnection employing meta-mate...
- Patent number 10,483,209
- Issue date Nov 19, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Christopher Wyland
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure including plurality of chips along with air...
- Patent number 10,468,385
- Issue date Nov 5, 2019
- Taiwan Semiconductor Manufacturing Company Ltd.
- Wei-Heng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with integrated harmonic termination feature
- Patent number 10,332,847
- Issue date Jun 25, 2019
- Infineon Technologies AG
- Yang Liu
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Gateless switch with capacitively-coupled contacts
- Patent number 10,256,334
- Issue date Apr 9, 2019
- Sensor Electronic Technology, Inc.
- Grigory Simin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device including coupling structure along with waveguide...
- Patent number 10,199,335
- Issue date Feb 5, 2019
- Fujitsu Limited
- Daijiro Ishibashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Waveguide including first and second metal plates and having a slot...
- Patent number 10,056,672
- Issue date Aug 21, 2018
- International Business Machines Corporation
- Bing Dang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wafer including an integrated waveguide for communica...
- Patent number 10,038,232
- Issue date Jul 31, 2018
- International Business Machines Corporation
- Bing Dang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure including a package substrate having an integrate...
- Patent number 10,033,081
- Issue date Jul 24, 2018
- International Business Machines Corporation
- Bing Dang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package substrate with microstrip architecture a...
- Patent number 9,972,589
- Issue date May 15, 2018
- Intel Corporation
- Eng Huat Goh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,972,588
- Issue date May 15, 2018
- Mitsubishi Electric Corporation
- Katsuya Kato
- H03 - BASIC ELECTRONIC CIRCUITRY

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20230387047
- Publication date Nov 30, 2023
- Mitsubishi Electric Corporation
- Takuma NISHIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING MULTIPLE DIELECTRIC WAVEGUIDE CHANNE...
- Publication number 20230268298
- Publication date Aug 24, 2023
- Taiwan Semiconductor Manufacturing company Ltd.
- WEN-SHIANG LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE FOR A SEMICONDUCTOR DEVICE
- Publication number 20230076573
- Publication date Mar 9, 2023
- SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
- Ikuo NAKASHIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Impedance Controlled Electrical Interconnection Employing Meta-Mate...
- Publication number 20230020310
- Publication date Jan 19, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Christopher Wyland
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20220278049
- Publication date Sep 1, 2022
- Samsung Electronics Co., Ltd.
- Joonsung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTENNA IN PACKAGE HAVING ANTENNA ON PACKAGE SUBSTRATE
- Publication number 20220209391
- Publication date Jun 30, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Yiqi Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISTRIBUTED INDUCTANCE INTEGRATED FIELD EFFECT TRANSISTOR STRUCTURE
- Publication number 20210320053
- Publication date Oct 14, 2021
- National Research Council of Canada
- Nianhua (Frank) JIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20210202397
- Publication date Jul 1, 2021
- Samsung Electronics Co., Ltd.
- Joonsung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20210035931
- Publication date Feb 4, 2021
- SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
- Ikuo NAKASHIMA
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
SEMICONDUCTOR DEVICES COMPRISING PLANAR WAVEGUIDE TRANSMISSION LINES
- Publication number 20200388583
- Publication date Dec 10, 2020
- INFINEON TECHNOLOGIES AG
- Horst Theuss
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING MULTIPLE DIELECTRIC WAVEGUIDE CHANNE...
- Publication number 20200381377
- Publication date Dec 3, 2020
- Taiwan Semiconductor Manufacturing company Ltd.
- WEN-SHIANG LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH SIDE-RADIATING WAVE LAUNCHER AND WAVEGUIDE
- Publication number 20200280121
- Publication date Sep 3, 2020
- Intel Corporation
- Georgios Dogiamis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RF Power Amplifier Pallet
- Publication number 20200168571
- Publication date May 28, 2020
- Ampleon Netherlands B.V.
- Gutta Venkata
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Impedance Controlled Electrical Interconnection Employing Meta-Mate...
- Publication number 20200083171
- Publication date Mar 12, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Christopher Wyland
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AMPLIFIER WITH INTEGRATED DIRECTIONAL COUPLER
- Publication number 20200067459
- Publication date Feb 27, 2020
- NXP USA, Inc.
- Abdulrhman M. S. Ahmed
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING MULTIPLE DIELECTRIC WAVEGUIDE CHANNE...
- Publication number 20190393171
- Publication date Dec 26, 2019
- Taiwan Semiconductor Manufacturing company Ltd.
- WEN-SHIANG LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP
- Publication number 20190371748
- Publication date Dec 5, 2019
- Sony Semiconductor Solutions Corporation
- YUJI KIYOTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STIFFENER AND PACKAGE SUBSTRATE FOR A SEMICONDUCTOR PACKAGE
- Publication number 20190311963
- Publication date Oct 10, 2019
- Intel Corporation
- Stephen CHRISTIANSON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE INCLUDING PLURALITY OF CHIPS ALONG WITH AIR...
- Publication number 20190164937
- Publication date May 30, 2019
- Taiwan Semiconductor Manufacturing company Ltd.
- WEI-HENG LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20180090456
- Publication date Mar 29, 2018
- Mitsubishi Electric Corporation
- Katsuya KATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND ELECTRONIC EQUIPMENT
- Publication number 20170263578
- Publication date Sep 14, 2017
- Fujitsu Limited
- Daijiro Ishibashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURES HAVING INTEGRATED WAVEGUIDES FOR HIGH SPEED COMM...
- Publication number 20160336282
- Publication date Nov 17, 2016
- International Business Machines Corporation
- Bing Dang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND RADIO COMMUNICATION DEVICE
- Publication number 20140361406
- Publication date Dec 11, 2014
- Satoshi Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE
- Publication number 20140191377
- Publication date Jul 10, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Ralf Reuter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Gateless Switch with Capacitively-Coupled Contacts
- Publication number 20140077265
- Publication date Mar 20, 2014
- SENSOR ELECTRONIC TECHNOLOGY, INC.
- Grigory Simin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND RADIO COMMUNICATION DEVICE
- Publication number 20120261799
- Publication date Oct 18, 2012
- Satoshi Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW COST HIGH FREQUENCY DEVICE PACKAGE AND METHODS
- Publication number 20120234588
- Publication date Sep 20, 2012
- Bridgewave Communications, Inc.
- Eric A. Sanjuan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MICROWAVE UNIT AND METHOD THEREFORE
- Publication number 20120211487
- Publication date Aug 23, 2012
- Huawei Technologies Co., Ltd.
- Leif Bergstedt
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LOW COST HIGH FREQUENCY DEVICE PACKAGE AND METHODS
- Publication number 20120066894
- Publication date Mar 22, 2012
- Bridgewave Communications, Inc.
- Eric A. Sanjuan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
IMPEDANCE CONTROLLED ELECTRICAL INTERCONNECTION EMPLOYING META-MATE...
- Publication number 20120038054
- Publication date Feb 16, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Christopher Wyland
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

being a microstrip line type

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Methods for forming microwave tunable composited thin-film dielectr...

Impedance controlled electrical interconnection employing meta-mate...

Package for a semiconductor device

Semiconductor devices comprising planar waveguide transmission lines

Semiconductor packages

Semiconductor structure having multiple dielectric waveguide channe...

Distributed inductance integrated field effect transistor structure

Semiconductor device

Impedance controlled electrical interconnection employing meta-mate...

Package with side-radiating wave launcher and waveguide

Semiconductor chip

Semiconductor packages

Stiffener and package substrate for a semiconductor package

RF power amplifier pallet

Microwave antenna apparatus and package

Antenna structure with integrated coupling element and semiconducto...

Semiconductor structure along with multiple chips bonded through mi...

Semiconductor structure having multiple dielectric waveguide channe...

Semiconductor device

Amplifier with integrated directional coupler

Impedance controlled electrical interconnection employing meta-mate...

Semiconductor structure including plurality of chips along with air...

Semiconductor package with integrated harmonic termination feature

Gateless switch with capacitively-coupled contacts

Electronic device including coupling structure along with waveguide...

Waveguide including first and second metal plates and having a slot...

Semiconductor wafer including an integrated waveguide for communica...

Package structure including a package substrate having an integrate...

Integrated circuit package substrate with microstrip architecture a...

Semiconductor device

Patents Applicationslast 30 patents

SEMICONDUCTOR MODULE

SEMICONDUCTOR STRUCTURE HAVING MULTIPLE DIELECTRIC WAVEGUIDE CHANNE...

PACKAGE FOR A SEMICONDUCTOR DEVICE

Impedance Controlled Electrical Interconnection Employing Meta-Mate...

SEMICONDUCTOR PACKAGES

ANTENNA IN PACKAGE HAVING ANTENNA ON PACKAGE SUBSTRATE

DISTRIBUTED INDUCTANCE INTEGRATED FIELD EFFECT TRANSISTOR STRUCTURE

SEMICONDUCTOR PACKAGES

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICES COMPRISING PLANAR WAVEGUIDE TRANSMISSION LINES

SEMICONDUCTOR STRUCTURE HAVING MULTIPLE DIELECTRIC WAVEGUIDE CHANNE...

PACKAGE WITH SIDE-RADIATING WAVE LAUNCHER AND WAVEGUIDE

RF Power Amplifier Pallet

Impedance Controlled Electrical Interconnection Employing Meta-Mate...

AMPLIFIER WITH INTEGRATED DIRECTIONAL COUPLER

SEMICONDUCTOR STRUCTURE HAVING MULTIPLE DIELECTRIC WAVEGUIDE CHANNE...

SEMICONDUCTOR CHIP

STIFFENER AND PACKAGE SUBSTRATE FOR A SEMICONDUCTOR PACKAGE

SEMICONDUCTOR STRUCTURE INCLUDING PLURALITY OF CHIPS ALONG WITH AIR...

SEMICONDUCTOR DEVICE

ELECTRONIC DEVICE AND ELECTRONIC EQUIPMENT

PACKAGE STRUCTURES HAVING INTEGRATED WAVEGUIDES FOR HIGH SPEED COMM...

SEMICONDUCTOR DEVICE AND RADIO COMMUNICATION DEVICE

INTEGRATED CIRCUIT PACKAGE

Gateless Switch with Capacitively-Coupled Contacts

SEMICONDUCTOR DEVICE AND RADIO COMMUNICATION DEVICE

LOW COST HIGH FREQUENCY DEVICE PACKAGE AND METHODS

MICROWAVE UNIT AND METHOD THEREFORE

LOW COST HIGH FREQUENCY DEVICE PACKAGE AND METHODS

IMPEDANCE CONTROLLED ELECTRICAL INTERCONNECTION EMPLOYING META-MATE...