being a pin array

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H01L2924/15332

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

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H01L2924/15332being a pin array

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Patents Grantslast 30 patents

Information Patent Grant
Via and trench filling using injection molded soldering
- Patent number 10,383,572
- Issue date Aug 20, 2019
- International Business Machines Corporation
- John U. Knickerbocker
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Via and trench filling using injection molded soldering
- Patent number 10,258,279
- Issue date Apr 16, 2019
- International Business Machines Corporation
- John U. Knickerbocker
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Via and trench filling using injection molded soldering
- Patent number 10,130,302
- Issue date Nov 20, 2018
- International Business Machines Corporation
- John U. Knickerbocker
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Via and trench filling using injection molded soldering
- Patent number 9,773,751
- Issue date Sep 26, 2017
- International Business Machines Corporation
- John U. Knickerbocker
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
VIA AND TRENCH FILLING USING INJECTION MOLDED SOLDERING
- Publication number 20180344245
- Publication date Dec 6, 2018
- International Business Machines Corporation
- John U. Knickerbocker
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
VIA AND TRENCH FILLING USING INJECTION MOLDED SOLDERING
- Publication number 20180005982
- Publication date Jan 4, 2018
- International Business Machines Corporation
- John U. Knickerbocker
- H01 - BASIC ELECTRIC ELEMENTS