being a pin array

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CPC
H01L2924/15312

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/15312being a pin array

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device
- Patent number 11,848,294
- Issue date Dec 19, 2023
- Intel Corporation
- Christoph Kutter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for establishing thermal joints between heat spreaders or l...
- Patent number 11,776,868
- Issue date Oct 3, 2023
- Laird Technologies, Inc.
- Jason L. Strader
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board with phase change material
- Patent number 11,742,259
- Issue date Aug 29, 2023
- Advanced Micro Devices, Inc.
- Manish Arora
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for providing an interface on a printed circuit...
- Patent number 11,731,207
- Issue date Aug 22, 2023
- Eagle Technology, LLC
- Michael T. De Roy
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System-in-package with double-sided molding
- Patent number 11,670,618
- Issue date Jun 6, 2023
- STATS ChipPAC Pte. Ltd.
- DeokKyung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for establishing thermal joints between heat spreaders or l...
- Patent number 11,610,831
- Issue date Mar 21, 2023
- Laird Technologies, Inc.
- Jason L. Strader
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems and methods for providing an interface on a printed circuit...
- Patent number 11,602,800
- Issue date Mar 14, 2023
- Eagle Technology, LLC
- Michael T. De Roy
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device
- Patent number 11,233,027
- Issue date Jan 25, 2022
- INTEL DEUTSCHLAND GMBH
- Christoph Kutter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Discrete circuit having cross-talk noise cancellation circuitry and...
- Patent number 11,116,072
- Issue date Sep 7, 2021
- Intel Corporation
- Jun Liao
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Integrated circuit and electronic circuit comprising the same
- Patent number 11,081,439
- Issue date Aug 3, 2021
- Kabushiki Kaisha Toshiba
- Kentaro Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board with phase change material
- Patent number 11,049,794
- Issue date Jun 29, 2021
- Advanced Micro Devices, Inc.
- Manish Arora
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods for establishing thermal joints between heat spreaders or l...
- Patent number 10,964,617
- Issue date Mar 30, 2021
- Laird Technologies, Inc.
- Jason L. Strader
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device assembly with pillar array and test ability
- Patent number 10,943,794
- Issue date Mar 9, 2021
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabricating an integrated circuit chip module with stiffening frame...
- Patent number 10,892,170
- Issue date Jan 12, 2021
- International Business Machines Corporation
- Evan G. Colgan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System-in-package with double-sided molding
- Patent number 10,797,024
- Issue date Oct 6, 2020
- STATS ChipPAC Pte. Ltd.
- DeokKyung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 10,714,415
- Issue date Jul 14, 2020
- Renesas Electronics Corporation
- Eiji Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible system integration to improve thermal properties
- Patent number 10,714,425
- Issue date Jul 14, 2020
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,679,959
- Issue date Jun 9, 2020
- INTEL DEUTSCHLAND GMBH
- Christoph Kutter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System-in-package with double-sided molding
- Patent number 10,636,765
- Issue date Apr 28, 2020
- STATS ChipPAC Pte. Ltd.
- DeokKyung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and fabrication method thereof
- Patent number 10,629,517
- Issue date Apr 21, 2020
- Fuji Electric Co., Ltd.
- Koji Ichikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for establishing thermal joints between heat spreaders or l...
- Patent number 10,600,714
- Issue date Mar 24, 2020
- Laird Technologies, Inc.
- Jason L. Strader
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of fabricating a chip module with stiffening frame and ortho...
- Patent number 10,566,215
- Issue date Feb 18, 2020
- International Business Machines Corporation
- Evan G. Colgan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,529,678
- Issue date Jan 7, 2020
- INTEL DEUTSCHLAND GMBH
- Christoph Kutter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip module with stiffening frame and orthogonal heat spreader
- Patent number 10,424,494
- Issue date Sep 24, 2019
- International Business Machines Corporation
- Evan G. Colgan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,425,030
- Issue date Sep 24, 2019
- Rohm Co., Ltd.
- Masashi Nagasato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for establishing thermal joints between heat spreaders or l...
- Patent number 10,373,891
- Issue date Aug 6, 2019
- Laird Technologies, Inc.
- Jason L. Strader
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lid attach optimization to limit electronic package warpage
- Patent number 10,332,813
- Issue date Jun 25, 2019
- International Business Machines Corporation
- Sushumna Iruvanti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 10,283,444
- Issue date May 7, 2019
- Renesas Electronics Corporation
- Eiji Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power overlay structure and method of making same
- Patent number 10,269,688
- Issue date Apr 23, 2019
- General Electric Company
- Arun Virupaksha Gowda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power overlay structure and method of making same
- Patent number 10,186,477
- Issue date Jan 22, 2019
- General Electric Company
- Arun Virupaksha Gowda
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SYSTEMS AND METHODS FOR PROVIDING AN INTERFACE ON A PRINTED CIRCUIT...
- Publication number 20230121381
- Publication date Apr 20, 2023
- Eagle Technology, LLC
- Michael T. De Roy
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS FOR ESTABLISHING THERMAL JOINTS BETWEEN HEAT SPREADERS OR L...
- Publication number 20210202343
- Publication date Jul 1, 2021
- Laird Technologies, Inc.
- Jason L. Strader
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor Device Assembly with Pillar Array
- Publication number 20210183662
- Publication date Jun 17, 2021
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20200266166
- Publication date Aug 20, 2020
- Intel Deutschland GmbH
- Christoph Kutter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods For Establishing Thermal Joints Between Heat Spreaders Or L...
- Publication number 20200219785
- Publication date Jul 9, 2020
- Laird Technologies, Inc.
- Jason L. Strader
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTEGRATED CIRCUIT AND ELECTRONIC CIRCUIT COMPRISING THE SAME
- Publication number 20200168539
- Publication date May 28, 2020
- Kabushiki Kaisha Toshiba
- Kentaro WATANABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for Establishing Thermal Joints Between Heat Spreaders or L...
- Publication number 20190371697
- Publication date Dec 5, 2019
- Laird Technologies, Inc.
- Jason L. Strader
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CHIP MODULE WITH STIFFENING FRAME AND ORTHOGONAL HEAT SPREADER
- Publication number 20180277396
- Publication date Sep 27, 2018
- International Business Machines Corporation
- Evan G. Colgan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20180183374
- Publication date Jun 28, 2018
- Rohm Co., Ltd.
- Masashi Nagasato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LID ATTACH OPTIMIZATION TO LIMIT ELECTRONIC PACKAGE WARPAGE
- Publication number 20180068916
- Publication date Mar 8, 2018
- International Business Machines Corporation
- Sushumna Iruvanti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LID ATTACH OPTIMIZATION TO LIMIT ELECTRONIC PACKAGE WARPAGE
- Publication number 20180068917
- Publication date Mar 8, 2018
- International Business Machines Corporation
- Sushumna Iruvanti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP MODULE WITH STIFFENING FRAME AND ORTHOGONAL HEAT SPREADER
- Publication number 20180061732
- Publication date Mar 1, 2018
- International Business Machines Corporation
- Evan G. Colgan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP MODULE WITH STIFFENING FRAME AND ORTHOGONAL HEAT SPREADER
- Publication number 20180061733
- Publication date Mar 1, 2018
- International Business Machines Corporation
- Evan G. Colgan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIMITING ELECTRONIC PACKAGE WARPAGE
- Publication number 20180047590
- Publication date Feb 15, 2018
- International Business Machines Corporation
- Shidong Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for Forming Ceramic Substrates with Via Studs
- Publication number 20170338127
- Publication date Nov 23, 2017
- Ananda H. Kumar
- G01 - MEASURING TESTING
Information Patent Application
POWER OVERLAY STRUCTURE AND METHOD OF MAKING SAME
- Publication number 20170263539
- Publication date Sep 14, 2017
- GENERAL ELECTRIC COMPANY
- Arun Virupaksha Gowda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-DIE WIREBOND PACKAGES WITH ELONGATED WINDOWS
- Publication number 20160233193
- Publication date Aug 11, 2016
- Invensas Corporation
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR HIGH-SPEED, LOW-PROFILE MEMORY PACKAGES AND...
- Publication number 20150325560
- Publication date Nov 12, 2015
- Apple Inc.
- Anthony Fai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-USE SUBSTRATE FOR INTEGRATED CIRCUIT
- Publication number 20150303137
- Publication date Oct 22, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Weng Hoong Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20150200174
- Publication date Jul 16, 2015
- INTEL MOBILE COMMUNICATIONS TECHNOLOGY GMBH
- Christoph Kutter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY MODULE IN A PACKAGE
- Publication number 20140367866
- Publication date Dec 18, 2014
- Belgacem Haba
- G11 - INFORMATION STORAGE
Information Patent Application
Methods For Establishing Thermal Joints Between Heat Spreaders and...
- Publication number 20140368992
- Publication date Dec 18, 2014
- Jason L. Strader
- B32 - LAYERED PRODUCTS
Information Patent Application
METHODS FOR ESTABLISHING THERMAL JOINTS BETWEEN HEAT SPREADERS OR L...
- Publication number 20140367847
- Publication date Dec 18, 2014
- Laird Technologies, Inc.
- Jason L. Strader
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140327137
- Publication date Nov 6, 2014
- Eiji HAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER OVERLAY STRUCTURE AND METHOD OF MAKING SAME
- Publication number 20140264800
- Publication date Sep 18, 2014
- GENERAL ELECTRIC COMPANY
- Arun Virupaksha Gowda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER OVERLAY STRUCTURE AND METHOD OF MAKING SAME
- Publication number 20140264799
- Publication date Sep 18, 2014
- GENERAL ELECTRIC COMPANY
- Arun Virupaksha Gowda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR HIGH-SPEED, LOW-PROFILE MEMORY PACKAGES AND...
- Publication number 20140264906
- Publication date Sep 18, 2014
- Apple Inc.
- Anthony Fai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20140247572
- Publication date Sep 4, 2014
- IBIDEN CO., LTD.
- Yasushi Inagaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-DIE WIREBOND PACKAGES WITH ELONGATED WINDOWS
- Publication number 20140217617
- Publication date Aug 7, 2014
- Invensas Corporation
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CERAMIC SUBSTRATE AND PROCESS FOR PRODUCING SAME
- Publication number 20140196935
- Publication date Jul 17, 2014
- Takatoshi Tojo
- H01 - BASIC ELECTRIC ELEMENTS

being a pin array

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device

Methods for establishing thermal joints between heat spreaders or l...

Circuit board with phase change material

Systems and methods for providing an interface on a printed circuit...

System-in-package with double-sided molding

Methods for establishing thermal joints between heat spreaders or l...

Systems and methods for providing an interface on a printed circuit...

Semiconductor device

Discrete circuit having cross-talk noise cancellation circuitry and...

Integrated circuit and electronic circuit comprising the same

Circuit board with phase change material

Methods for establishing thermal joints between heat spreaders or l...

Semiconductor device assembly with pillar array and test ability

Fabricating an integrated circuit chip module with stiffening frame...

System-in-package with double-sided molding

Semiconductor device and method of manufacturing the same

Flexible system integration to improve thermal properties

Semiconductor device

System-in-package with double-sided molding

Semiconductor device and fabrication method thereof

Methods for establishing thermal joints between heat spreaders or l...

Method of fabricating a chip module with stiffening frame and ortho...

Semiconductor device

Chip module with stiffening frame and orthogonal heat spreader

Semiconductor device

Methods for establishing thermal joints between heat spreaders or l...

Lid attach optimization to limit electronic package warpage

Semiconductor device and method of manufacturing the same

Power overlay structure and method of making same

Power overlay structure and method of making same

Patents Applicationslast 30 patents

SYSTEMS AND METHODS FOR PROVIDING AN INTERFACE ON A PRINTED CIRCUIT...

METHODS FOR ESTABLISHING THERMAL JOINTS BETWEEN HEAT SPREADERS OR L...

Semiconductor Device Assembly with Pillar Array

SEMICONDUCTOR DEVICE

Methods For Establishing Thermal Joints Between Heat Spreaders Or L...

INTEGRATED CIRCUIT AND ELECTRONIC CIRCUIT COMPRISING THE SAME

Methods for Establishing Thermal Joints Between Heat Spreaders or L...

CHIP MODULE WITH STIFFENING FRAME AND ORTHOGONAL HEAT SPREADER

SEMICONDUCTOR DEVICE

LID ATTACH OPTIMIZATION TO LIMIT ELECTRONIC PACKAGE WARPAGE

LID ATTACH OPTIMIZATION TO LIMIT ELECTRONIC PACKAGE WARPAGE

CHIP MODULE WITH STIFFENING FRAME AND ORTHOGONAL HEAT SPREADER

CHIP MODULE WITH STIFFENING FRAME AND ORTHOGONAL HEAT SPREADER

LIMITING ELECTRONIC PACKAGE WARPAGE

Methods for Forming Ceramic Substrates with Via Studs

POWER OVERLAY STRUCTURE AND METHOD OF MAKING SAME

MULTI-DIE WIREBOND PACKAGES WITH ELONGATED WINDOWS

SYSTEMS AND METHODS FOR HIGH-SPEED, LOW-PROFILE MEMORY PACKAGES AND...

MULTI-USE SUBSTRATE FOR INTEGRATED CIRCUIT

SEMICONDUCTOR DEVICE

MEMORY MODULE IN A PACKAGE

Methods For Establishing Thermal Joints Between Heat Spreaders and...

METHODS FOR ESTABLISHING THERMAL JOINTS BETWEEN HEAT SPREADERS OR L...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

POWER OVERLAY STRUCTURE AND METHOD OF MAKING SAME

POWER OVERLAY STRUCTURE AND METHOD OF MAKING SAME

SYSTEMS AND METHODS FOR HIGH-SPEED, LOW-PROFILE MEMORY PACKAGES AND...

PRINTED CIRCUIT BOARD

MULTI-DIE WIREBOND PACKAGES WITH ELONGATED WINDOWS

CERAMIC SUBSTRATE AND PROCESS FOR PRODUCING SAME