being a pin array

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CPC
H01L2924/15322

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/15322being a pin array

Industries

Patents Grantslast 30 patents

Information Patent Grant
Power semiconductor module, electronic device, and method for contr...
- Patent number 10,756,011
- Issue date Aug 25, 2020
- SHARP KABUSHIKI KAISHA
- Tomotoshi Satoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna-in-package structures with broadside and end-fire radiations
- Patent number 10,431,892
- Issue date Oct 1, 2019
- International Business Machines Corporation
- Alberto V. Garcia
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor package and related methods
- Patent number 10,319,659
- Issue date Jun 11, 2019
- Semiconductor Components Industries, LLC
- Atapol Prajuckamol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical shielding and interconnect for SIP modules
- Patent number 10,292,258
- Issue date May 14, 2019
- Apple Inc.
- Lan H. Hoang
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Fan-out ball grid array package structure and process for manufactu...
- Patent number 10,242,940
- Issue date Mar 26, 2019
- Advanced Semiconductor Engineering, Inc.
- Jung-Liang Yeh
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Antenna-in-package structures with broadside and end-fire radiations
- Patent number 10,170,838
- Issue date Jan 1, 2019
- International Business Machines Corporation
- Alberto V. Garcia
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Module with external shield and back-spill barrier for protecting c...
- Patent number 9,974,181
- Issue date May 15, 2018
- Avago Technologies General IP (Singapore) Pte. Ltd.
- Sarah Haney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna-in-package structures with broadside and end-fire radiations
- Patent number 9,917,368
- Issue date Mar 13, 2018
- International Business Machines Corporation
- Alberto V. Garcia
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Antenna-in-package structures with broadside and end-fire radiations
- Patent number 9,806,422
- Issue date Oct 31, 2017
- International Business Machines Corporation
- Alberto V. Garcia
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Module substrate and method for manufacturing module substrate
- Patent number 9,781,828
- Issue date Oct 3, 2017
- Murata Manufacturing Co., Ltd.
- Issei Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assembly for microelectronic packaging with bond el...
- Patent number 9,615,456
- Issue date Apr 4, 2017
- Invensas Corporation
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure for microelectronic packaging with bond elements to encap...
- Patent number 9,095,074
- Issue date Jul 28, 2015
- Invensas Corporation
- Belgacem Haba
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Packaging methods and structures for semiconductor devices
- Patent number 9,082,636
- Issue date Jul 14, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging methods and structures for semiconductor devices
- Patent number 8,884,431
- Issue date Nov 11, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure with glass substrate
- Patent number 7,038,309
- Issue date May 2, 2006
- VIA Technologies, Inc.
- Chi-Hsing Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite material member for semiconductor device and insulated an...
- Patent number 6,579,623
- Issue date Jun 17, 2003
- Hitachi, Ltd.
- Yasutoshi Kurihara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer thin-film wiring board
- Patent number 6,303,877
- Issue date Oct 16, 2001
- Fujitsu Limited
- Kiyokazu Moriizumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat spreader and method of making the same
- Patent number 6,129,993
- Issue date Oct 10, 2000
- Hitachi Metals, Ltd.
- Shingo Kumamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus to minimize integrated circuit heatsink E.M.I. radiation
- Patent number 6,011,299
- Issue date Jan 4, 2000
- Digital Equipment Corporation
- Colin E. Brench
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating an integrated circuit package having a liquid...
- Patent number 5,658,831
- Issue date Aug 19, 1997
- Unisys Corporation
- Wilber Terry Layton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Employing on die temperature sensors and fan-heatsink failure signa...
- Patent number 5,483,102
- Issue date Jan 9, 1996
- Intel Corporation
- James R. Neal
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Integrated circuit package having a liquid metal-aluminum/copper joint
- Patent number 5,459,352
- Issue date Oct 17, 1995
- Unisys Corporation
- Wilber T. Layton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package with integral heating circuit
- Patent number 4,561,006
- Issue date Dec 24, 1985
- Sperry Corporation
- Thomas P. Currie
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20230269868
- Publication date Aug 24, 2023
- Fuji Electric Co., Ltd.
- Tomomi NONAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES WITH SUB-TERMINALS AND RELATED METHODS
- Publication number 20170365518
- Publication date Dec 21, 2017
- Semiconductor Components Industries, LLC
- Atapol Prajuckamol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTENNA-IN-PACKAGE STRUCTURES WITH BROADSIDE AND END-FIRE RADIATIONS
- Publication number 20170317418
- Publication date Nov 2, 2017
- International Business Machines Corporation
- Alberto V. Garcia
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MODULE WITH EXTERNAL SHIELD AND BACK-SPILL BARRIER FOR PROTECTING C...
- Publication number 20170280561
- Publication date Sep 28, 2017
- Avago Technologies General IP (Singapore) PTE. LTD.
- Sarah Haney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE FOR MICROELECTRONIC PACKAGING WITH BOND ELEMENTS TO ENCAP...
- Publication number 20140175671
- Publication date Jun 26, 2014
- Invensas Corporation
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE MODULE
- Publication number 20130285232
- Publication date Oct 31, 2013
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Job Ha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULE SUBSTRATE AND METHOD FOR MANUFACTURING MODULE SUBSTRATE
- Publication number 20130223038
- Publication date Aug 29, 2013
- Murata Manufacturing Co., Ltd.
- Issei YAMAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaging Methods and Structures for Semiconductor Devices
- Publication number 20130062761
- Publication date Mar 14, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Cavity-down stacked multi-chip package
- Publication number 20060071314
- Publication date Apr 6, 2006
- Via Technologies, Inc.
- Kwun-Yao Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip package structure
- Publication number 20040046255
- Publication date Mar 11, 2004
- Chi-Hsing Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Composite material member for semiconductor device and insulated an...
- Publication number 20030201530
- Publication date Oct 30, 2003
- Hitachi, Ltd.
- Yasutoshi Kurihara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Composite material member for semiconductor device and insulated an...
- Publication number 20020192488
- Publication date Dec 19, 2002
- Yasutoshi Kurihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER THIN-FILM WIRING BOARD
- Publication number 20010011607
- Publication date Aug 9, 2001
- KIYOKAZU MORIIZUMI
- H01 - BASIC ELECTRIC ELEMENTS

being a pin array

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Power semiconductor module, electronic device, and method for contr...

Antenna-in-package structures with broadside and end-fire radiations

Semiconductor package and related methods

Vertical shielding and interconnect for SIP modules

Fan-out ball grid array package structure and process for manufactu...

Antenna-in-package structures with broadside and end-fire radiations

Module with external shield and back-spill barrier for protecting c...

Antenna-in-package structures with broadside and end-fire radiations

Antenna-in-package structures with broadside and end-fire radiations

Module substrate and method for manufacturing module substrate

Microelectronic assembly for microelectronic packaging with bond el...

Structure for microelectronic packaging with bond elements to encap...

Packaging methods and structures for semiconductor devices

Packaging methods and structures for semiconductor devices

Chip package structure with glass substrate

Composite material member for semiconductor device and insulated an...

Multilayer thin-film wiring board

Heat spreader and method of making the same

Apparatus to minimize integrated circuit heatsink E.M.I. radiation

Method of fabricating an integrated circuit package having a liquid...

Employing on die temperature sensors and fan-heatsink failure signa...

Integrated circuit package having a liquid metal-aluminum/copper joint

Integrated circuit package with integral heating circuit

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGES WITH SUB-TERMINALS AND RELATED METHODS

ANTENNA-IN-PACKAGE STRUCTURES WITH BROADSIDE AND END-FIRE RADIATIONS

MODULE WITH EXTERNAL SHIELD AND BACK-SPILL BARRIER FOR PROTECTING C...

STRUCTURE FOR MICROELECTRONIC PACKAGING WITH BOND ELEMENTS TO ENCAP...

SEMICONDUCTOR PACKAGE MODULE

MODULE SUBSTRATE AND METHOD FOR MANUFACTURING MODULE SUBSTRATE

Packaging Methods and Structures for Semiconductor Devices

Cavity-down stacked multi-chip package

Chip package structure

Composite material member for semiconductor device and insulated an...

Composite material member for semiconductor device and insulated an...

MULTILAYER THIN-FILM WIRING BOARD