being a removable or sacrificial coating

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H01L2224/83002

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/83002being a removable or sacrificial coating

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Micro device integration into system substrate
- Patent number 11,735,623
- Issue date Aug 22, 2023
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing electronic device
- Patent number 11,710,719
- Issue date Jul 25, 2023
- Sumitomo Electric Device Innovations, Inc.
- Taketo Kawano
- G02 - OPTICS
Information Patent Grant
Semiconductor devices and methods of making the same
- Patent number 11,557,530
- Issue date Jan 17, 2023
- Semiconductor Components Industries, LLC
- Swee Har Khor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip assembly
- Patent number 11,508,694
- Issue date Nov 22, 2022
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sintering materials and attachment methods using same
- Patent number 11,389,865
- Issue date Jul 19, 2022
- Alpha Assembly Solutions Inc.
- Shamik Ghoshal
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Process for manufacturing assembly pads on a carrier for the self-a...
- Patent number 11,380,648
- Issue date Jul 5, 2022
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Léa Di Cioccio
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Electronic device and manufacturing method thereof and manufacturin...
- Patent number 11,342,300
- Issue date May 24, 2022
- Japan Display Inc.
- Youhei Iwai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Control of under-fill using a film during fabrication for a dual-si...
- Patent number 11,244,835
- Issue date Feb 8, 2022
- Skyworks Solutions, Inc.
- Robert Francis Darveaux
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for processing a semiconductor device
- Patent number 11,227,779
- Issue date Jan 18, 2022
- ASM Technology Singapore Pte. Ltd.
- Jiapei Ding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Control of under-fill using a dam on a packaging substrate for a du...
- Patent number 11,201,066
- Issue date Dec 14, 2021
- Skyworks Solutions, Inc.
- Robert Francis Darveaux
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level integration including design/co-design, structure proce...
- Patent number 11,201,138
- Issue date Dec 14, 2021
- International Business Machines Corporation
- Bing Dang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding apparatus and method
- Patent number 11,201,133
- Issue date Dec 14, 2021
- Samsung Display Co., Ltd.
- Joo Nyung Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Member for semiconductor device
- Patent number 11,107,787
- Issue date Aug 31, 2021
- Fuji Electric Co., Ltd.
- Shinji Sano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for transferring micro device
- Patent number 10,937,674
- Issue date Mar 2, 2021
- MIKRO MESA TECHNOLOGY CO., LTD.
- Li-Yi Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing soldered product
- Patent number 10,843,300
- Issue date Nov 24, 2020
- ORIGIN COMPANY, LIMITED
- Yukiko Hayashi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Micro device integration into system substrate
- Patent number 10,847,571
- Issue date Nov 24, 2020
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for bonding semiconductor chips to a landing wafer
- Patent number 10,797,016
- Issue date Oct 6, 2020
- Imec VZW
- Vikas Dubey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Under-fill deflash for a dual-sided ball grid array package
- Patent number 10,770,312
- Issue date Sep 8, 2020
- Skyworks Solutions, Inc.
- Robert Francis Darveaux
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for mass arrangement of micro-component devices
- Patent number 10,748,792
- Issue date Aug 18, 2020
- MAVEN OPTRONICS CO., LTD.
- Chieh Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of making the same
- Patent number 10,727,170
- Issue date Jul 28, 2020
- Semiconductor Components Industries, LLC
- Swee Har Khor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro device integration into system substrate
- Patent number 10,700,120
- Issue date Jun 30, 2020
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip assembly
- Patent number 10,636,766
- Issue date Apr 28, 2020
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a substrate arrangement, substrate arrangement...
- Patent number 10,622,331
- Issue date Apr 14, 2020
- Heraeus Deutschland GmbH & Co. KG
- Andreas Hinrich
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Method for manufacturing semiconductor chips
- Patent number 10,607,962
- Issue date Mar 31, 2020
- Danfoss Silicon Power GmbH
- Frank Osterwald
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Control of under-fill with a packaging substrate having an integrat...
- Patent number 10,593,565
- Issue date Mar 17, 2020
- Skyworks Solutions, Inc.
- Robert Francis Darveaux
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Control of under-fill using an encapsulant for a dual-sided ball gr...
- Patent number 10,460,957
- Issue date Oct 29, 2019
- Skyworks Solutions, Inc.
- Robert Francis Darveaux
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photosensitive resin composition, film adhesive, adhesive sheet, ad...
- Patent number 10,428,253
- Issue date Oct 1, 2019
- Hitachi Chemical Company, Ltd.
- Tomonori Minegishi
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Methods and apparatus for self-alignment of integrated circuit dies
- Patent number 10,431,515
- Issue date Oct 1, 2019
- Marvell World Trade Ltd.
- Long-Ching Wang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Control of under-fill using under-fill deflash for a dual-sided bal...
- Patent number 10,410,885
- Issue date Sep 10, 2019
- Skyworks Solutions, Inc.
- Robert Francis Darveaux
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 10,262,927
- Issue date Apr 16, 2019
- Renesas Electronics Corporation
- Kazunori Hasegawa
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING
- Publication number 20240387184
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yan-Yu CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO DEVICE INTEGRATION INTO SYSTEM SUBSTRATE
- Publication number 20230207611
- Publication date Jun 29, 2023
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE TRANSFER FILM AND METHOD FOR MANUFACTURING POWER MODULE SU...
- Publication number 20230178509
- Publication date Jun 8, 2023
- AMOSENSE CO., LTD.
- Younghwan JUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR USING A BUFFER SHEET
- Publication number 20230095879
- Publication date Mar 30, 2023
- Showa Denko Materials Co., Ltd.
- Yuta Koseki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DICING DIE ATTACH FILM AND METHOD OF PRODUCING THE SAME, AND SEMICO...
- Publication number 20220310547
- Publication date Sep 29, 2022
- FURUKAWA ELECTRIC CO., LTD.
- Minoru MORITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT BONDING METHODS AND STRUCTURES
- Publication number 20220139869
- Publication date May 5, 2022
- INVENSAS BONDING TECHNOLOGIES, INC.
- Guilian GAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DICING DIE ATTACH FILM, AND SEMICONDUCTOR PACKAGE USING THE SAME AN...
- Publication number 20220077101
- Publication date Mar 10, 2022
- FURUKAWA ELECTRIC CO., LTD.
- Minoru MORITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING ELECTRONIC DEVICE
- Publication number 20210313297
- Publication date Oct 7, 2021
- SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
- Taketo KAWANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF AND MANUFACTURIN...
- Publication number 20210066238
- Publication date Mar 4, 2021
- Japan Display Inc.
- Youhei IWAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO DEVICE INTEGRATION INTO SYSTEM SUBSTRATE
- Publication number 20200328249
- Publication date Oct 15, 2020
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A CHIP ASSEMBLY AND CHIP ASSEMBLY
- Publication number 20200219848
- Publication date Jul 9, 2020
- INFINEON TECHNOLOGIES AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS AND METHOD
- Publication number 20200168581
- Publication date May 28, 2020
- SAMSUNG DISPLAY CO., LTD.
- Joo Nyung JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL INTEGRATION INCLUDING DESIGN/CO-DESIGN, STRUCTURE PROCE...
- Publication number 20200126951
- Publication date Apr 23, 2020
- International Business Machines Corporation
- Bing DANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR PROCESSING A SEMICONDUCTOR DEVICE
- Publication number 20190080939
- Publication date Mar 14, 2019
- ASM Technology Singapore Pte Ltd
- Jiapei DING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING MEMBER FOR SEMICONDUCTOR DEVICE AND SEMICONDUC...
- Publication number 20190081020
- Publication date Mar 14, 2019
- Fuji Electric Co., Ltd.
- Shinji SANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO DEVICE INTEGRATION INTO SYSTEM SUBSTRATE
- Publication number 20180358405
- Publication date Dec 13, 2018
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO DEVICE INTEGRATION INTO SYSTEM SUBSTRATE
- Publication number 20180358404
- Publication date Dec 13, 2018
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20180247884
- Publication date Aug 30, 2018
- RENESAS ELECTRONICS CORPORATION
- Kazunori HASEGAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING PROCESS USING TEMPERATURE CONTROLLED CURVATURE CHANGE
- Publication number 20160204078
- Publication date Jul 14, 2016
- International Business Machines Corporation
- Stephen W. Bedell
- B32 - LAYERED PRODUCTS
Information Patent Application
TECHNIQUES FOR ADHESIVE CONTROL BETWEEN A SUBSTRATE AND A DIE
- Publication number 20150155264
- Publication date Jun 4, 2015
- Maxim Integrated Products, Inc.
- Vivek S. Sridharan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNIVERSAL NANOPATTERNABLE INTERFACIAL BONDING
- Publication number 20140283982
- Publication date Sep 25, 2014
- Tingrui Pan
- B32 - LAYERED PRODUCTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE HAVING AN AIR GAP AND METHOD FOR FO...
- Publication number 20140001632
- Publication date Jan 2, 2014
- Trent S. Uehling
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP DEVICE WITH THERMAL INTERFACE MATERIAL FRAME
- Publication number 20130105975
- Publication date May 2, 2013
- Rafiqul Hussain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR BONDING THIN FILM PIECE
- Publication number 20130075023
- Publication date Mar 28, 2013
- Sumitomo Electric Industries, Ltd.
- Akira Furuya
- B44 - DECORATIVE ARTS
Information Patent Application
METHOD FOR PRODUCING RECONSTITUTED WAFERS AND METHOD FOR PRODUCING...
- Publication number 20120315710
- Publication date Dec 13, 2012
- Kazuyuki Hozawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR PACKAGE HAVING CONDUCTIVE VIAS AND METHOD FOR...
- Publication number 20120086120
- Publication date Apr 12, 2012
- Advanced Semiconductor Engineering, Inc.
- Jen-Chuan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF PRODUCING THE SAME
- Publication number 20110049702
- Publication date Mar 3, 2011
- Shinko Electric Industries Co., Ltd.
- Syuji NEGORO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EQUIPMENT FOR BONDING BY MOLECULAR ADHESION
- Publication number 20090294072
- Publication date Dec 3, 2009
- S.O.I.Tec Silicon on Insulator Technologies
- Sebastien Kerdiles
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS FOR BONDING BY MOLECULAR ADHESION
- Publication number 20090261064
- Publication date Oct 22, 2009
- S.O.I.Tec Silicon on Insulator Technologies
- Sebastien Kerdiles
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Process and equipment for bonding by molecular adhesion
- Publication number 20070119812
- Publication date May 31, 2007
- Sebastien Kerdiles
- H01 - BASIC ELECTRIC ELEMENTS

being a removable or sacrificial coating

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Micro device integration into system substrate

Method for manufacturing electronic device

Semiconductor devices and methods of making the same

Chip assembly

Sintering materials and attachment methods using same

Process for manufacturing assembly pads on a carrier for the self-a...

Electronic device and manufacturing method thereof and manufacturin...

Control of under-fill using a film during fabrication for a dual-si...

Apparatus and method for processing a semiconductor device

Control of under-fill using a dam on a packaging substrate for a du...

Wafer level integration including design/co-design, structure proce...

Bonding apparatus and method

Member for semiconductor device

Method for transferring micro device

Method for producing soldered product

Micro device integration into system substrate

Method for bonding semiconductor chips to a landing wafer

Under-fill deflash for a dual-sided ball grid array package

Method and system for mass arrangement of micro-component devices

Semiconductor devices and methods of making the same

Micro device integration into system substrate

Chip assembly

Method for producing a substrate arrangement, substrate arrangement...

Method for manufacturing semiconductor chips

Control of under-fill with a packaging substrate having an integrat...

Control of under-fill using an encapsulant for a dual-sided ball gr...

Photosensitive resin composition, film adhesive, adhesive sheet, ad...

Methods and apparatus for self-alignment of integrated circuit dies

Control of under-fill using under-fill deflash for a dual-sided bal...

Semiconductor device and manufacturing method thereof

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING

MICRO DEVICE INTEGRATION INTO SYSTEM SUBSTRATE

ADHESIVE TRANSFER FILM AND METHOD FOR MANUFACTURING POWER MODULE SU...

METHOD FOR USING A BUFFER SHEET

DICING DIE ATTACH FILM AND METHOD OF PRODUCING THE SAME, AND SEMICO...

DIRECT BONDING METHODS AND STRUCTURES

DICING DIE ATTACH FILM, AND SEMICONDUCTOR PACKAGE USING THE SAME AN...

METHOD FOR MANUFACTURING ELECTRONIC DEVICE

ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF AND MANUFACTURIN...

MICRO DEVICE INTEGRATION INTO SYSTEM SUBSTRATE

METHOD OF FORMING A CHIP ASSEMBLY AND CHIP ASSEMBLY

BONDING APPARATUS AND METHOD

WAFER LEVEL INTEGRATION INCLUDING DESIGN/CO-DESIGN, STRUCTURE PROCE...

APPARATUS AND METHOD FOR PROCESSING A SEMICONDUCTOR DEVICE

METHOD FOR PRODUCING MEMBER FOR SEMICONDUCTOR DEVICE AND SEMICONDUC...

MICRO DEVICE INTEGRATION INTO SYSTEM SUBSTRATE

MICRO DEVICE INTEGRATION INTO SYSTEM SUBSTRATE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

BONDING PROCESS USING TEMPERATURE CONTROLLED CURVATURE CHANGE

TECHNIQUES FOR ADHESIVE CONTROL BETWEEN A SUBSTRATE AND A DIE

UNIVERSAL NANOPATTERNABLE INTERFACIAL BONDING

SEMICONDUCTOR PACKAGE STRUCTURE HAVING AN AIR GAP AND METHOD FOR FO...

SEMICONDUCTOR CHIP DEVICE WITH THERMAL INTERFACE MATERIAL FRAME

METHOD FOR BONDING THIN FILM PIECE

METHOD FOR PRODUCING RECONSTITUTED WAFERS AND METHOD FOR PRODUCING...

STACKED SEMICONDUCTOR PACKAGE HAVING CONDUCTIVE VIAS AND METHOD FOR...

SEMICONDUCTOR PACKAGE AND METHOD OF PRODUCING THE SAME

EQUIPMENT FOR BONDING BY MOLECULAR ADHESION

PROCESS FOR BONDING BY MOLECULAR ADHESION

Process and equipment for bonding by molecular adhesion