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ELECTRICITY
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Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2924/00
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H01L2924/19043
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Patents Grants
last 30 patents
Information
Patent Grant
High density interconnection using fanout interposer chiplet
Patent number
12,283,549
Issue date
Apr 22, 2025
Apple Inc.
Jun Zhai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit structure
Patent number
12,238,865
Issue date
Feb 25, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic device with top side pin array and manufacturing method...
Patent number
12,205,827
Issue date
Jan 21, 2025
Amkor Technology Singapore Holding Pte Ltd.
Devarajan Balaraman
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods of forming microelectronic device assemblies and packages
Patent number
12,199,068
Issue date
Jan 14, 2025
Micron Technology, Inc.
Owen R. Fay
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
LED packaging structure
Patent number
12,176,473
Issue date
Dec 24, 2024
Peng Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package with front side and back side redistribution...
Patent number
12,159,823
Issue date
Dec 3, 2024
Amkor Technology Singapore Holding Pte Ltd.
Michael Kelly
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and a method of manufacturing the same
Patent number
12,154,823
Issue date
Nov 26, 2024
Renesas Electronics Corporation
Katsuhiko Hotta
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Monolithic surface mount passive component
Patent number
12,142,402
Issue date
Nov 12, 2024
SanDisk Technologies, Inc.
Ai-Wen Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device including resistor element
Patent number
12,142,589
Issue date
Nov 12, 2024
SK hynix Inc.
Chan Ho Yoon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device assembly with pre-reflowed solder
Patent number
12,132,027
Issue date
Oct 29, 2024
Texas Instruments Incorporated
James Raymond Maliclic Baello
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device assembly with surface-mount die support struct...
Patent number
12,087,720
Issue date
Sep 10, 2024
Micron Technology, Inc.
Brandon P. Wirz
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Packaged integrated circuit devices with through-body conductive vi...
Patent number
12,087,738
Issue date
Sep 10, 2024
Tongbi Jiang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Packaged electrical device
Patent number
12,074,628
Issue date
Aug 27, 2024
Skyworks Solutions, Inc.
Andrew Martin Kay
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic package and method for fabricating the same
Patent number
12,033,868
Issue date
Jul 9, 2024
Siliconware Precision Industries Co., Ltd.
Shu-Chi Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Structures for low temperature bonding using nanoparticles
Patent number
12,027,487
Issue date
Jul 2, 2024
ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
Cyprian Emeka Uzoh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and method of forming the same
Patent number
12,021,051
Issue date
Jun 25, 2024
Taiwan Semiconductor Manufacturing Company Limited
Hsien-Wei Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and manufacturing method thereof
Patent number
12,009,289
Issue date
Jun 11, 2024
Amkor Technology Singapore Holding Pte Ltd.
Jae Ung Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multiple plated via arrays of different wire heights on a same subs...
Patent number
RE49987
Issue date
May 28, 2024
Invensas LLC
Cyprian Emeka Uzoh
Information
Patent Grant
Manufacturing method and electronic module with new routing possibi...
Patent number
RE49970
Issue date
May 14, 2024
IMBERATEK, LLC
Antti Kivikero
Information
Patent Grant
Methods for low temperature bonding using nanoparticles
Patent number
11,973,056
Issue date
Apr 30, 2024
ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
Cyprian Emeka Uzoh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated high voltage capacitor
Patent number
11,967,610
Issue date
Apr 23, 2024
Semtech Corporation
Christopher David Ainsworth
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
3DIC packaging with hot spot thermal management features
Patent number
11,961,779
Issue date
Apr 16, 2024
Taiwan Semiconductor Manufacturing Company, Ltd. (TSMC)
Wensen Hung
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Microelectronic device assemblies and packages including multiple d...
Patent number
11,961,825
Issue date
Apr 16, 2024
Micron Technology, Inc.
Aparna U. Limaye
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods of forming stacked semiconductors die assemblies
Patent number
11,948,921
Issue date
Apr 2, 2024
Randon K. Richards
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device including resistor element
Patent number
11,929,336
Issue date
Mar 12, 2024
SK hynix Inc.
Chan Ho Yoon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and method of manufacturing the semiconductor...
Patent number
11,901,348
Issue date
Feb 13, 2024
Samsung Electronics Co., Ltd.
Tae-Ho Kang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and method of manufacturing the same
Patent number
11,894,308
Issue date
Feb 6, 2024
Advanced Semiconductor Engineering, Inc.
Sheng-Ming Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device with discrete blocks
Patent number
11,855,045
Issue date
Dec 26, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Ching-Wen Hsiao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stacked semiconductor die assemblies with support members and assoc...
Patent number
11,855,065
Issue date
Dec 26, 2023
Micron Technology, Inc.
Hong Wan Ng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device having EMI shielding structure and related met...
Patent number
11,855,000
Issue date
Dec 26, 2023
Amkor Technology Singapore Holding Pte Ltd.
Young Woo Lee
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
ELECTRONIC DEVICE WITH TOP SIDE PIN ARRAY AND MANUFACTURING METHOD...
Publication number
20250167007
Publication date
May 22, 2025
Amkor Technology Singapore Holding Pte. Ltd.
Devarajan Balaraman
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HIGH DENSITY INTERCONNECTION USING FANOUT INTERPOSER CHIPLET
Publication number
20250157939
Publication date
May 15, 2025
Apple Inc.
Jun Zhai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT STRUCTURE
Publication number
20250159812
Publication date
May 15, 2025
Taiwan Semiconductor Manufacturing Co., Ltd.
Chen-Hua Yu
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information
Patent Application
DIRECT PLUG-IN LED LAMP BEAD WITH INTERNAL RESISTOR
Publication number
20250140764
Publication date
May 1, 2025
Linhai Qinghui Light Electricity Lamp Co., Ltd.
Yongfu ZENG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF
Publication number
20250096107
Publication date
Mar 20, 2025
Amkor Technology Singapore Holding Pte. Ltd.
Michael Kelly
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGED ELECTRICAL DEVICES AND RELATED METHODS
Publication number
20250070814
Publication date
Feb 27, 2025
Skyworks Solutions, Inc.
Andrew Martin KAY
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME
Publication number
20250046653
Publication date
Feb 6, 2025
RENESAS ELECTRONICS CORPORATION
Katsuhiko HOTTA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE ASSEMBLY WITH PRE-REFLOWED SOLDER
Publication number
20250022841
Publication date
Jan 16, 2025
TEXAS INSTRUMENTS INCORPORATED
James Raymond Maliclic Baello
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC COMPONENT, SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTU...
Publication number
20250015123
Publication date
Jan 9, 2025
SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
Ikuo NAKASHIMA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE ASSEMBLY WITH SURFACE-MOUNT DIE SUPPORT STRUCT...
Publication number
20240429191
Publication date
Dec 26, 2024
Micron Technology, Inc.
Brandon P. Wirz
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGED INTEGRATED CIRCUIT DEVICES WITH THROUGH-BODY CONDUCTIVE VI...
Publication number
20240421131
Publication date
Dec 19, 2024
Lodestar Licensing Group LLC
Tongbi Jiang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Making an Interconnect Bridge wi...
Publication number
20240404956
Publication date
Dec 5, 2024
STATS ChipPAC Pte Ltd.
YongTaek Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE
Publication number
20240395681
Publication date
Nov 28, 2024
ROHM CO., LTD.
Bungo TANAKA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STRUCTURE INCLUDING PASSIVE COMPONENT TRAVERSING MULTIPLE SEMICONDU...
Publication number
20240371809
Publication date
Nov 7, 2024
GLOBALFOUNDRIES U.S. Inc.
Haritez Narisetty
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
SEMICONDUCTOR DEVICE
Publication number
20240363606
Publication date
Oct 31, 2024
ROHM CO., LTD.
Yoshizo OSUMI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
Publication number
20240332159
Publication date
Oct 3, 2024
Amkor Technology Singapore Holding Pte. Ltd.
Jae Ung Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR FABRICATING ELECTRONIC PACKAGE
Publication number
20240321591
Publication date
Sep 26, 2024
Siliconware Precision Industries Co., Ltd.
Shu-Chi Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
POWER SEMICONDUCTOR PACKAGE INCLUDING A PASSIVE ELECTRONIC COMPONEN...
Publication number
20240312936
Publication date
Sep 19, 2024
Infineon Technologies Austria AG
Joon Shyan Tan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STRUCTURES FOR LOW TEMPERATURE BONDING USING NANOPARTICLES
Publication number
20240312954
Publication date
Sep 19, 2024
ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
Cyprian Emeka Uzoh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE
Publication number
20240296980
Publication date
Sep 5, 2024
ROHM CO., LTD.
Keiji WADA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH DIE SUPPORT MEMBERS AND A...
Publication number
20240274583
Publication date
Aug 15, 2024
Micron Technology, Inc.
Seng Kim Ye
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE PACKAGE WITH VERTICALLY STACKED PASSIVE COMPONENT
Publication number
20240258288
Publication date
Aug 1, 2024
TEXAS INSTRUMENTS INCORPORATED
Makoto Shibuya
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
3DIC PACKAGING WITH HOT SPOT THERMAL MANAGEMENT FEATURES
Publication number
20240222218
Publication date
Jul 4, 2024
Taiwan Semiconductor Manufacturing Co, LTD.
Wensen Hung
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
Publication number
20240213168
Publication date
Jun 27, 2024
Advanced Semiconductor Engineering, Inc.
Sheng-Ming WANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTERPOSER WITH INTEGRATIVE PASSIVE COMPONENTS
Publication number
20240203911
Publication date
Jun 20, 2024
NXP USA, Inc.
Zhiwei Gong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MICROELECTRONIC DEVICE ASSEMBLIES, STACKED SEMICONDUCTOR DIE ASSEMB...
Publication number
20240186295
Publication date
Jun 6, 2024
Lodestar Licensing Group LLC
Randon K. Richards
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MULTICHIP PACKAGES WITH 3D INTEGRATION
Publication number
20240186303
Publication date
Jun 6, 2024
NXP USA, Inc.
Zhiwei Gong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE INCLUDING RESISTOR ELEMENT
Publication number
20240178172
Publication date
May 30, 2024
SK HYNIX INC.
Chan Ho YOON
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE, PACKAGE STRUCTURE AND METHOD OF MANUFACTURING PACKAGE STRU...
Publication number
20240178086
Publication date
May 30, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Che-Yu Yeh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH SUPPORT MEMBERS AND ASSOC...
Publication number
20240128254
Publication date
Apr 18, 2024
Micron Technology, Inc.
Hong Wan Ng
H01 - BASIC ELECTRIC ELEMENTS