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H01L28/84

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L28/00Passive two-terminal components without a potential-jump or surface barrier for integrated circuits; Details thereof; Multistep manufacturing processes therefor

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H01L28/84being a rough surface

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Patents Grantslast 30 patents

Information Patent Grant
Thin film capacitor and electronic circuit substrate having the same
- Patent number 12,218,185
- Issue date Feb 4, 2025
- TDK Corporation
- Daiki Ishii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin film capacitor and electronic circuit substrate having the same
- Patent number 12,132,078
- Issue date Oct 29, 2024
- TDK Corporation
- Yoshihiko Yano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal plate corner structure on metal insulator metal
- Patent number 12,107,041
- Issue date Oct 1, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yuan-Yang Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory cell, capacitive memory structure, and methods thereof
- Patent number 11,950,430
- Issue date Apr 2, 2024
- FERROELECTRIC MEMORY GMBH
- Stefan Ferdinand Müller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor structure, and semiconductor...
- Patent number 11,882,682
- Issue date Jan 23, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Jiancheng Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method for deep trench capacitor with scalloped profile
- Patent number 11,854,817
- Issue date Dec 26, 2023
- KEY FOUNDRY CO., LTD.
- Seung Mo Jo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating metal-insulator-metal capacitor
- Patent number 11,784,214
- Issue date Oct 10, 2023
- United Microelectronics Corp.
- Bo-Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method for semiconductor device
- Patent number 11,756,991
- Issue date Sep 12, 2023
- Lapis Semiconductor Co., Ltd.
- Hiroshi Shibata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including polysilicon structures and method of...
- Patent number 11,676,856
- Issue date Jun 13, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- J. J. Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,538,899
- Issue date Dec 27, 2022
- Powerchip Semiconductor Manufacturing Corporation
- Ching-Sung Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of fabricating the same
- Patent number 11,538,900
- Issue date Dec 27, 2022
- Winbond Electronics Corp.
- Hiroyuki Takaba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-insulator-metal capacitor and method for fabricating the same
- Patent number 11,469,294
- Issue date Oct 11, 2022
- United Microelectronics Corp.
- Bo-Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor devices and fabrication methods thereof
- Patent number 11,424,318
- Issue date Aug 23, 2022
- Semiconductor Manufacturing International (Shanghai) Corporation
- Lianfeng Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate structure having roughned upper surface of conductive layer
- Patent number 11,393,747
- Issue date Jul 19, 2022
- Advanced Semiconductor Engineering, Inc.
- Wen Hung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fingerprint sensors
- Patent number 11,348,994
- Issue date May 31, 2022
- Semiconductor Manufacturing International (Shanghai) Corporation
- Fu Gang Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Capacitor and method for manufacturing the same
- Patent number 11,271,074
- Issue date Mar 8, 2022
- Murata Manufacturing Co., Ltd.
- Takeshi Kagawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,164,937
- Issue date Nov 2, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yi-Chen Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming semiconductor device including polysilicon struct...
- Patent number 11,094,584
- Issue date Aug 17, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- J. J. Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-insulator-metal capacitors including nanofibers
- Patent number 11,038,011
- Issue date Jun 15, 2021
- GLOBALFOUNDRIES U.S. INC.
- Lili Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sinusoidal shaped capacitor architecture in oxide
- Patent number 10,756,164
- Issue date Aug 25, 2020
- Advanced Micro Devices, Inc.
- Richard T. Schultz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Oscillating capacitor architecture in polysilicon for improved capa...
- Patent number 10,608,076
- Issue date Mar 31, 2020
- Advanced Micro Devices, Inc.
- Richard T. Schultz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fingerprint sensors and fabrication methods thereof
- Patent number 10,600,861
- Issue date Mar 24, 2020
- Semiconductor Manufacturing International (Shanghai) Corporation
- Fu Gang Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device including polysilicon structures having differ...
- Patent number 10,553,476
- Issue date Feb 4, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- J. J. Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin film capacitor and semiconductor device with improved heat dis...
- Patent number 10,121,728
- Issue date Nov 6, 2018
- TDK Corporation
- Masahiro Yamaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of power storage device
- Patent number 9,960,225
- Issue date May 1, 2018
- Semiconductor Energy Laboratory Co., Ltd.
- Kazutaka Kuriki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a capacitor structure and capacitor structure
- Patent number 9,941,348
- Issue date Apr 10, 2018
- GLOBALFOUNDRIES Inc.
- Ran Yan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrochemical capacitor and semiconductor chip having an electroc...
- Patent number 9,697,957
- Issue date Jul 4, 2017
- Teknologian tutkimuskeskus VTT Oy
- Jouni Ahopelto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integration of energy storage devices onto substrates for microelec...
- Patent number 9,245,695
- Issue date Jan 26, 2016
- Intel Corporation
- Donald S. Gardner
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Light emitting device having interstitial elements in grain boundar...
- Patent number 9,178,117
- Issue date Nov 3, 2015
- LG Innotek Co., Ltd
- Han Byul Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon structure and manufacturing methods thereof and of capacito...
- Patent number 9,111,775
- Issue date Aug 18, 2015
- Semiconductor Energy Laboratory Co., Ltd.
- Satoshi Toriumi
- B82 - NANO-TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE WITH ELECTRODE LAYER AND METHOD FOR...
- Publication number 20240413193
- Publication date Dec 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Tzu CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL PLATE CORNER STRUCTURE ON METAL INSULATOR METAL
- Publication number 20240379529
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Yuan-Yang Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE
- Publication number 20230378252
- Publication date Nov 23, 2023
- LAPIS SEMICONDUCTOR CO., LTD.
- Hiroshi SHIBATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN FILM CAPACITOR, ITS MANUFACTURING METHOD, AND ELECTRONIC CIRCU...
- Publication number 20230335579
- Publication date Oct 19, 2023
- TDK Corporation
- Daiki ISHII
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING POLYSILICON STRUCTURES AND METHOD OF...
- Publication number 20230298935
- Publication date Sep 21, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- J. J. LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN FILM CAPACITOR AND ELECTRONIC CIRCUIT SUBSTRATE HAVING THE SAME
- Publication number 20230253446
- Publication date Aug 10, 2023
- TDK Corporation
- Yoshihiko YANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20230142938
- Publication date May 11, 2023
- Samsung Electronics Co., Ltd.
- JINGU KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC SYSTEM WITH POWER DISTRIBUTION NETWORK INCLUDING CAPACIT...
- Publication number 20230075019
- Publication date Mar 9, 2023
- SMOLTEK AB
- M Shafiqul Kabir
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD FOR DEEP TRENCH CAPACITOR WITH SCALLOPED PROFILE
- Publication number 20230009146
- Publication date Jan 12, 2023
- KEY FOUNDRY CO., LTD.
- Seung Mo JO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING METAL-INSULATOR-METAL CAPACITOR
- Publication number 20220416013
- Publication date Dec 29, 2022
- United Microelectronics Corp.
- Bo-Wei HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20220310780
- Publication date Sep 29, 2022
- Powerchip Semiconductor Manufacturing Corporation
- Ching-Sung Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR AND METHOD FOR PRODUCING THE SAME
- Publication number 20220254714
- Publication date Aug 11, 2022
- Shenzhen Goodix Technology Co., Ltd.
- Bin LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY CELL, CAPACITIVE MEMORY STRUCTURE, AND METHODS THEREOF
- Publication number 20220139937
- Publication date May 5, 2022
- Ferroelectric Memory GmbH
- Stefan Ferdinand Müller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR STRUCTURE, AND SEMICONDUCTOR...
- Publication number 20220037333
- Publication date Feb 3, 2022
- Changxin Memory Technologies, Inc.
- Jiancheng HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING POLYSILICON STRUCTURES AND METHOD OF...
- Publication number 20210351070
- Publication date Nov 11, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- J. J. LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-INSULATOR-METAL CAPACITOR AND METHOD FOR FABRICATING THE SAME
- Publication number 20210288138
- Publication date Sep 16, 2021
- United Microelectronics Corp.
- Bo-Wei HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-INSULATOR-METAL CAPACITORS INCLUDING NANOFIBERS
- Publication number 20210126086
- Publication date Apr 29, 2021
- GLOBALFOUNDRIES U.S. Inc.
- Lili Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20210020738
- Publication date Jan 21, 2021
- Murata Manufacturing Co., Ltd.
- Takeshi Kagawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINUSOIDAL SHAPED CAPACITOR ARCHITECTURE IN OXIDE
- Publication number 20200388669
- Publication date Dec 10, 2020
- ADVANCED MICRO DEVICES, INC.
- Richard T. Schultz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20200235199
- Publication date Jul 23, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yi-Chen HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FINGERPRINT SENSORS
- Publication number 20200185491
- Publication date Jun 11, 2020
- Semiconductor Manufacturing International (Shanghai) Corporation
- Fu Gang CHEN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD OF FORMING SEMICONDUCTOR DEVICE INCLUDING POLYSILICON STRUCT...
- Publication number 20200161174
- Publication date May 21, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- J. J. LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR DEVICES AND FABRICATION METHODS THEREOF
- Publication number 20200105865
- Publication date Apr 2, 2020
- Semiconductor Manufacturing International (Shanghai) Corporation
- Lianfeng HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FINGERPRINT SENSORS AND FABRICATION METHODS THEREOF
- Publication number 20190035879
- Publication date Jan 31, 2019
- Semiconductor Manufacturing International (Beijing) Corporation
- Fu Gang CHEN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING POLYSILICON STRUCTURES AND METHOD OF...
- Publication number 20180342417
- Publication date Nov 29, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- J. J. LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING BOTTOM ELECTRODE
- Publication number 20180226470
- Publication date Aug 9, 2018
- UNITED MICROELECTRONICS CORP.
- Ger-Pin Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICES AND METHODS OF FABRICATING THE SAME
- Publication number 20180166529
- Publication date Jun 14, 2018
- Samsung Electronics Co., Ltd.
- Hyesung Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A CAPACITOR STRUCTURE AND CAPACITOR STRUCTURE
- Publication number 20170317161
- Publication date Nov 2, 2017
- GLOBALFOUNDRIES INC.
- Ran Yan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrable electrochemical capacitor
- Publication number 20150332863
- Publication date Nov 19, 2015
- TEKNOLOGIAN TUTKIMUSKESKUS VTT
- Jouni Ahopelto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Capacitors and Methods of Forming Capacitors
- Publication number 20150194478
- Publication date Jul 9, 2015
- Micron Technology, Inc.
- Vassil N. Antonov
- H01 - BASIC ELECTRIC ELEMENTS

being a rough surface

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Thin film capacitor and electronic circuit substrate having the same

Thin film capacitor and electronic circuit substrate having the same

Metal plate corner structure on metal insulator metal

Memory cell, capacitive memory structure, and methods thereof

Method for manufacturing semiconductor structure, and semiconductor...

Manufacturing method for deep trench capacitor with scalloped profile

Method for fabricating metal-insulator-metal capacitor

Semiconductor device and manufacturing method for semiconductor device

Semiconductor device including polysilicon structures and method of...

Semiconductor device and manufacturing method thereof

Semiconductor device and method of fabricating the same

Metal-insulator-metal capacitor and method for fabricating the same

Capacitor devices and fabrication methods thereof

Substrate structure having roughned upper surface of conductive layer

Fingerprint sensors

Capacitor and method for manufacturing the same

Semiconductor device and manufacturing method thereof

Method of forming semiconductor device including polysilicon struct...

Metal-insulator-metal capacitors including nanofibers

Sinusoidal shaped capacitor architecture in oxide

Oscillating capacitor architecture in polysilicon for improved capa...

Fingerprint sensors and fabrication methods thereof

Semiconductor device including polysilicon structures having differ...

Thin film capacitor and semiconductor device with improved heat dis...

Manufacturing method of power storage device

Method of forming a capacitor structure and capacitor structure

Electrochemical capacitor and semiconductor chip having an electroc...

Integration of energy storage devices onto substrates for microelec...

Light emitting device having interstitial elements in grain boundar...

Silicon structure and manufacturing methods thereof and of capacito...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE STRUCTURE WITH ELECTRODE LAYER AND METHOD FOR...

METAL PLATE CORNER STRUCTURE ON METAL INSULATOR METAL

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE

THIN FILM CAPACITOR, ITS MANUFACTURING METHOD, AND ELECTRONIC CIRCU...

SEMICONDUCTOR DEVICE INCLUDING POLYSILICON STRUCTURES AND METHOD OF...

THIN FILM CAPACITOR AND ELECTRONIC CIRCUIT SUBSTRATE HAVING THE SAME

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

ELECTRONIC SYSTEM WITH POWER DISTRIBUTION NETWORK INCLUDING CAPACIT...

MANUFACTURING METHOD FOR DEEP TRENCH CAPACITOR WITH SCALLOPED PROFILE

METHOD FOR FABRICATING METAL-INSULATOR-METAL CAPACITOR

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

CAPACITOR AND METHOD FOR PRODUCING THE SAME

MEMORY CELL, CAPACITIVE MEMORY STRUCTURE, AND METHODS THEREOF

METHOD FOR MANUFACTURING SEMICONDUCTOR STRUCTURE, AND SEMICONDUCTOR...

SEMICONDUCTOR DEVICE INCLUDING POLYSILICON STRUCTURES AND METHOD OF...

METAL-INSULATOR-METAL CAPACITOR AND METHOD FOR FABRICATING THE SAME

METAL-INSULATOR-METAL CAPACITORS INCLUDING NANOFIBERS

CAPACITOR AND METHOD FOR MANUFACTURING THE SAME

SINUSOIDAL SHAPED CAPACITOR ARCHITECTURE IN OXIDE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

FINGERPRINT SENSORS

METHOD OF FORMING SEMICONDUCTOR DEVICE INCLUDING POLYSILICON STRUCT...

CAPACITOR DEVICES AND FABRICATION METHODS THEREOF

FINGERPRINT SENSORS AND FABRICATION METHODS THEREOF

SEMICONDUCTOR DEVICE INCLUDING POLYSILICON STRUCTURES AND METHOD OF...

METHOD OF FABRICATING BOTTOM ELECTRODE

SEMICONDUCTOR MEMORY DEVICES AND METHODS OF FABRICATING THE SAME

METHOD OF FORMING A CAPACITOR STRUCTURE AND CAPACITOR STRUCTURE

Integrable electrochemical capacitor

Capacitors and Methods of Forming Capacitors