Passive two-terminal components without a potential-jump or surface barrier for integrated circuits; Details thereof; Multistep manufacturing processes therefor

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor structure and method for forming the same
- Patent number 12,218,049
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin film capacitor and electronic circuit substrate having the same
- Patent number 12,218,185
- Issue date Feb 4, 2025
- TDK Corporation
- Daiki Ishii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip parts
- Patent number 12,217,913
- Issue date Feb 4, 2025
- Rohm Co., Ltd.
- Keisuke Fukae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for fabricating the same
- Patent number 12,218,182
- Issue date Feb 4, 2025
- SK Hynix Inc.
- Kwan Woo Do
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for forming the same
- Patent number 12,218,184
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Jui-Lin Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compact capacitor structure
- Patent number 12,218,257
- Issue date Feb 4, 2025
- Realtek Semiconductor Corporation
- Jian Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package and manufacturing method thereof
- Patent number 12,218,108
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layered resistor with a tight temperature coefficient of resi...
- Patent number 12,218,180
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Szu-Hsien Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Barrier layer for metal insulator metal capacitors
- Patent number 12,218,181
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Anhao Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor structure and semiconductor...
- Patent number 12,218,183
- Issue date Feb 4, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Yulei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Back-end-of-line passive device structure having common connection...
- Patent number 12,218,186
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wen-Chiung Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit (IC) packages employing a capacitor-embedded, re...
- Patent number 12,218,041
- Issue date Feb 4, 2025
- QUALCOMM Incorporated
- Jihong Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Via plug resistor
- Patent number 12,218,042
- Issue date Feb 4, 2025
- Intel Corporation
- Santosh Gangal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device including MIM capacitor and resistor
- Patent number 12,211,838
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hsiang Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices having a resistor structure with more refined...
- Patent number 12,211,887
- Issue date Jan 28, 2025
- MediaTek Singapore Pte Ltd.
- Lanxiang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices
- Patent number 12,211,891
- Issue date Jan 28, 2025
- Samsung Electronics Co., Ltd.
- Cheol Ju Yun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inductors with airgap electrical isolation
- Patent number 12,211,886
- Issue date Jan 28, 2025
- GLOBALFOUNDRIES U.S. Inc.
- Prateek Kumar Sharma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having supporter pattern
- Patent number 12,211,892
- Issue date Jan 28, 2025
- Samsung Electronics Co., Ltd.
- Seung Jin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transferring information across a high voltage gap using capacitive...
- Patent number 12,211,785
- Issue date Jan 28, 2025
- Infineon Technologies Austria AG
- Lars Mueller-Meskamp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 12,211,836
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Wen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Barrier layer for metal insulator metal capacitors
- Patent number 12,211,890
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Anhao Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a thin film resistor with improved thermal stabi...
- Patent number 12,211,888
- Issue date Jan 28, 2025
- United Microelectronics Corp.
- Kuo-Chih Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrode layer, capacitor and methods for electrode layer and capa...
- Patent number 12,211,889
- Issue date Jan 28, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Weiping Bai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Non-linear polar material based flip-flop
- Patent number 12,212,321
- Issue date Jan 28, 2025
- Kepler Computing Inc.
- Amrita Mathuriya
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 12,211,893
- Issue date Jan 28, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Kui Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Group III-V IC with different sheet resistance 2-DEG resistors
- Patent number 12,211,835
- Issue date Jan 28, 2025
- Texas Instruments Incorporated
- Dong Seup Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,205,952
- Issue date Jan 21, 2025
- Samsung Electronics Co., Ltd.
- Gihee Cho
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor device having a resistor
- Patent number 12,205,980
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Liang-Hsiang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-oxide-metal (MOM) capacitors for integrated circuit monitoring
- Patent number 12,205,885
- Issue date Jan 21, 2025
- Microchip Technology Incorporated
- Yaojian Leng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of fabricating the same
- Patent number 12,205,889
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Hsien Lai
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF AND MEMORY SYSTEM
- Publication number 20250048646
- Publication date Feb 6, 2025
- Yangtze Memory Technologies Co., Ltd.
- Zhong Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250046705
- Publication date Feb 6, 2025
- RENESAS ELECTRONICS CORPORATION
- Nobuhito SHIRAISHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONFIGURABLE CAPACITOR
- Publication number 20250048661
- Publication date Feb 6, 2025
- EMPOWER SEMICONDUCTOR, INC.
- Artin Der Minassians
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INSULATION CHIP AND SEMICONDUCTOR DEVICE
- Publication number 20250046773
- Publication date Feb 6, 2025
- ROHM CO., LTD.
- Masanobu TSUJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR ARRAY FORMATION USING SINGLE ETCH PROCESS
- Publication number 20250048658
- Publication date Feb 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Hsien Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GETTER LAYER FOR HYDROGEN IN A MIM DEVICE
- Publication number 20250048660
- Publication date Feb 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-Yuan Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE INCLUDING CRACK DETECTOR AND MANUFACTURING...
- Publication number 20250046702
- Publication date Feb 6, 2025
- Taiwan Semiconductor Manufacturing company Ltd.
- WEI-YU CHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250046755
- Publication date Feb 6, 2025
- Samsung Electronics Co., Ltd.
- Myungsam KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metal-Insulator-Metal Capacitor Within Metallization Structure
- Publication number 20250038102
- Publication date Jan 30, 2025
- Taiwan Semiconductor Manufacturing company Ltd.
- Chi-Han Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MIM CAPACITOR AND FABRICATING METHOD OF THE SAME
- Publication number 20250040158
- Publication date Jan 30, 2025
- UNITED MICROELECTRONICS CORP.
- Da-Jun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-INSULATOR-METAL CAPACITOR STRUCTURE AND METHOD FORM FORMING SAME
- Publication number 20250040159
- Publication date Jan 30, 2025
- Semiconductor Manufacturing International (Shanghai) Corporation
- Jisong JIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SUPPLY MODULE
- Publication number 20250038157
- Publication date Jan 30, 2025
- Murata Manufacturing Co., Ltd.
- Takami MUTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE OF MIM CAPACITOR AND HEAT SINK
- Publication number 20250038103
- Publication date Jan 30, 2025
- UNITED MICROELECTRONICS CORP.
- Da-Jun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLANAR FERROELECTRIC MEMORY DEVICE
- Publication number 20250040146
- Publication date Jan 30, 2025
- Kepler Computing Inc.
- Sasikanth Manipatruni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metal-Oxide-Semiconductor Capacitors and Methods of Fabricating The...
- Publication number 20250040157
- Publication date Jan 30, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Liang Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN FILM TRANSISTOR ARRAY SUBSTRATE AND ORGANIC LIGHT-EMITTING DIO...
- Publication number 20250040349
- Publication date Jan 30, 2025
- SAMSUNG DISPLAY CO., LTD.
- Won-Se Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IC SUBSTRATE WITH SUPPORT STRUCTURE AND FUNCTIONAL INLAYS THEREIN
- Publication number 20250038117
- Publication date Jan 30, 2025
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Gerald WEIS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250031396
- Publication date Jan 23, 2025
- Mitsubishi Electric Corporation
- Kazuya KONISHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEEP TRENCH CAPACITOR INCLUDING STRESS-RELIEF VOIDS AND METHODS OF...
- Publication number 20250031393
- Publication date Jan 23, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Fu-Chiang KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING THREE-DIMENSIONAL INTEGRATED STRUCTURE
- Publication number 20250029918
- Publication date Jan 23, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yun-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20250031389
- Publication date Jan 23, 2025
- Fujian Jinhua Integrated Circuit Co., Ltd.
- Bingxing Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHUNT RESISTANCE, METHOD OF MANUFACTURING SHUNT RESISTANCE, AND SEM...
- Publication number 20250031392
- Publication date Jan 23, 2025
- Rohm Co., Ltd.
- Kosaku Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR HAVING A BOTTOM CAPACITOR PLATE WITH A ROUGH UPPER SURFAC...
- Publication number 20250031388
- Publication date Jan 23, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- I-Che Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-INSULATOR-METAL CAPACITOR VIA STRUCTURES
- Publication number 20250029917
- Publication date Jan 23, 2025
- International Business Machines Corporation
- Huimei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VOLTAGE-ISOLATED INTEGRATED CIRCUIT PACKAGES WITH PLANAR TRANSFORMERS
- Publication number 20250022646
- Publication date Jan 16, 2025
- ALLEGRO MICROSYSTEMS, LLC
- William P. Taylor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20250022911
- Publication date Jan 16, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Cheng Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH DENSITY CAPACITOR AND METHODS OF FORMING THE SAME
- Publication number 20250022912
- Publication date Jan 16, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Meng-Hsien Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VOLTAGE-ISOLATED INTEGRATED CIRCUIT PACKAGES WITH PIN-COUPLED COILS
- Publication number 20250022654
- Publication date Jan 16, 2025
- ALLEGRO MICROSYSTEMS, LLC
- Vijay Mangtani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT OVER ACTIVE GATE STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT...
- Publication number 20250022939
- Publication date Jan 16, 2025
- Intel Corporation
- Andrew W. Yeoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH A BOOSTER LAYER AND METHOD FOR FABRICATIN...
- Publication number 20250022655
- Publication date Jan 16, 2025
- SK HYNIX INC.
- Se-Hun KANG
- H01 - BASIC ELECTRIC ELEMENTS

Passive two-terminal components without a potential-jump or surface barrier for integrated circuits; Details thereof; Multistep manufacturing processes therefor

Industry

Parent Industries

Current Industry

Sub Industries

Patents Grantslast 30 patents

Semiconductor structure and method for forming the same

Thin film capacitor and electronic circuit substrate having the same

Chip parts

Semiconductor device and method for fabricating the same

Semiconductor structure and method for forming the same

Compact capacitor structure

Package and manufacturing method thereof

Multi-layered resistor with a tight temperature coefficient of resi...

Barrier layer for metal insulator metal capacitors

Method for manufacturing semiconductor structure and semiconductor...

Back-end-of-line passive device structure having common connection...

Integrated circuit (IC) packages employing a capacitor-embedded, re...

Via plug resistor

Device including MIM capacitor and resistor

Semiconductor devices having a resistor structure with more refined...

Semiconductor devices

Inductors with airgap electrical isolation

Semiconductor device having supporter pattern

Transferring information across a high voltage gap using capacitive...

Semiconductor device and manufacturing method thereof

Barrier layer for metal insulator metal capacitors

Method for forming a thin film resistor with improved thermal stabi...

Electrode layer, capacitor and methods for electrode layer and capa...

Non-linear polar material based flip-flop

Semiconductor structure and manufacturing method thereof

Group III-V IC with different sheet resistance 2-DEG resistors

Semiconductor device

Semiconductor device having a resistor

Metal-oxide-metal (MOM) capacitors for integrated circuit monitoring

Semiconductor device and method of fabricating the same

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF AND MEMORY SYSTEM

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

CONFIGURABLE CAPACITOR

INSULATION CHIP AND SEMICONDUCTOR DEVICE

CAPACITOR ARRAY FORMATION USING SINGLE ETCH PROCESS

GETTER LAYER FOR HYDROGEN IN A MIM DEVICE

SEMICONDUCTOR STRUCTURE INCLUDING CRACK DETECTOR AND MANUFACTURING...

SEMICONDUCTOR PACKAGE

Metal-Insulator-Metal Capacitor Within Metallization Structure

MIM CAPACITOR AND FABRICATING METHOD OF THE SAME

METAL-INSULATOR-METAL CAPACITOR STRUCTURE AND METHOD FORM FORMING SAME

POWER SUPPLY MODULE

STRUCTURE OF MIM CAPACITOR AND HEAT SINK

PLANAR FERROELECTRIC MEMORY DEVICE

Metal-Oxide-Semiconductor Capacitors and Methods of Fabricating The...

THIN FILM TRANSISTOR ARRAY SUBSTRATE AND ORGANIC LIGHT-EMITTING DIO...

IC SUBSTRATE WITH SUPPORT STRUCTURE AND FUNCTIONAL INLAYS THEREIN

SEMICONDUCTOR DEVICE

DEEP TRENCH CAPACITOR INCLUDING STRESS-RELIEF VOIDS AND METHODS OF...

METHOD FOR FORMING THREE-DIMENSIONAL INTEGRATED STRUCTURE

CAPACITOR DEVICE AND MANUFACTURING METHOD THEREOF

SHUNT RESISTANCE, METHOD OF MANUFACTURING SHUNT RESISTANCE, AND SEM...

CAPACITOR HAVING A BOTTOM CAPACITOR PLATE WITH A ROUGH UPPER SURFAC...

METAL-INSULATOR-METAL CAPACITOR VIA STRUCTURES

VOLTAGE-ISOLATED INTEGRATED CIRCUIT PACKAGES WITH PLANAR TRANSFORMERS

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

HIGH DENSITY CAPACITOR AND METHODS OF FORMING THE SAME

VOLTAGE-ISOLATED INTEGRATED CIRCUIT PACKAGES WITH PIN-COUPLED COILS

CONTACT OVER ACTIVE GATE STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT...

SEMICONDUCTOR DEVICE WITH A BOOSTER LAYER AND METHOD FOR FABRICATIN...