Passive two-terminal components without a potential-jump or surface barrier for integrated circuits; Details thereof; Multistep manufacturing processes therefor

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor devices including crack sensor
- Patent number 12,181,432
- Issue date Dec 31, 2024
- SK hynix Inc.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Quantum circuit with trench capacitor
- Patent number 12,185,644
- Issue date Dec 31, 2024
- International Business Machines Corporation
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with dummy MIM capacitor die
- Patent number 12,183,723
- Issue date Dec 31, 2024
- Mediatek Inc.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structures having deep trench capacitor and methods f...
- Patent number 12,183,778
- Issue date Dec 31, 2024
- NANYA TECHNOLOGY CORPORATION
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin-film transistors and MIM capacitors in exclusion zones
- Patent number 12,183,668
- Issue date Dec 31, 2024
- Intel Corporation
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including capacitor and resistor
- Patent number 12,183,670
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded interconnects in bridges for integrated-circuit packages
- Patent number 12,183,722
- Issue date Dec 31, 2024
- Intel Corporation
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit and method of forming the same
- Patent number 12,183,779
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,183,302
- Issue date Dec 31, 2024
- Semiconductor Energy Laboratory Co., Ltd.
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Metal-insulator-metal (MIM) energy storage device with layered stac...
- Patent number 12,183,520
- Issue date Dec 31, 2024
- Smoltek AB
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power converter
- Patent number 12,183,774
- Issue date Dec 31, 2024
- Mitsubishi Electric Corporation
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit with FEOL resistor
- Patent number 12,183,775
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Configurable metal—insulator—metal capacitor and devices
- Patent number 12,183,669
- Issue date Dec 31, 2024
- MACOM Technology Solutions Holdings, Inc.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated magnetic assembly with conductive field plates
- Patent number 12,183,693
- Issue date Dec 31, 2024
- Texas Instruments Incorporated
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming capacitor via
- Patent number 12,183,776
- Issue date Dec 31, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame and method for stacking discrete components to be embedd...
- Patent number 12,185,469
- Issue date Dec 31, 2024
- SARAS MICRO DEVICES, INC.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Storage capacitor with multiple dielectrics
- Patent number 12,176,386
- Issue date Dec 24, 2024
- NANYA TECHNOLOGY CORPORATION
- Kai-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through plate interconnect for a vertical MIM capacitor
- Patent number 12,176,284
- Issue date Dec 24, 2024
- Intel Corporation
- Travis Lajoie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with uneven electrode surface and method for f...
- Patent number 12,176,281
- Issue date Dec 24, 2024
- NANYA TECHNOLOGY CORPORATION
- Tsu-Chieh Ai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Trench capacitor profile to decrease substrate warpage
- Patent number 12,176,387
- Issue date Dec 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsin-Li Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ferroelectric structure including a ferroelectric film having a fir...
- Patent number 12,176,413
- Issue date Dec 24, 2024
- Samsung Electronics Co., Ltd.
- Sanghyun Jo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device for enhancing quality factor of inductor and m...
- Patent number 12,176,385
- Issue date Dec 24, 2024
- Richwave Technology Corp.
- Chia-Wei Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device with semiconductor layer on isolation structure
- Patent number 12,178,048
- Issue date Dec 24, 2024
- Kioxia Corporation
- Takenori Kodama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and structures pertaining to improved ferroelectric random-a...
- Patent number 12,171,104
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tzu-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of forming same
- Patent number 12,170,274
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for preparing semiconductor structure and semiconductor stru...
- Patent number 12,170,201
- Issue date Dec 17, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Qiang Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuits including composite dielectric layer
- Patent number 12,170,310
- Issue date Dec 17, 2024
- Texas Instruments Incorporated
- Guruvayurappan S. Mathur
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded metal insulator metal structure
- Patent number 12,170,241
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Feng-Wei Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cerium-doped ferroelectric materials and related devices and methods
- Patent number 12,166,098
- Issue date Dec 10, 2024
- The Board of Trustees of the Leland Stanford Junior University
- Paul C. McIntyre
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices including ferroelectric materials
- Patent number 12,167,610
- Issue date Dec 10, 2024
- Micron Technology, Inc.
- Qian Tao
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR CIRCUIT, MEMORY SYSTEM, AND INFORMATION PROCESSING DE...
- Publication number 20240429266
- Publication date Dec 26, 2024
- KIOXIA Corporation
- Takashi TOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240429268
- Publication date Dec 26, 2024
- Samsung Electronics Co., Ltd.
- Taekyun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED INDUCTOR MODULE AND PACKAGED SEMICONDUCTOR DEVICE
- Publication number 20240429216
- Publication date Dec 26, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Jie CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESISTOR AND RESISTOR-TRANSISTOR-LOGIC CIRCUIT WITH GAN STRUCTURE A...
- Publication number 20240429228
- Publication date Dec 26, 2024
- UNITED MICROELECTRONICS CORP.
- Kuo-Hsing Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT INCLUDING A CAPACITIVE ELEMENT, AND CORRESPONDIN...
- Publication number 20240429232
- Publication date Dec 26, 2024
- STMicroelectronics International N.V.
- Abderrezak MARZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL INSULATOR METAL CAPACITOR (MIM CAPACITOR)
- Publication number 20240429270
- Publication date Dec 26, 2024
- International Business Machines Corporation
- HUIMEI ZHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO THROUGH-SILICON VIA FOR TRANSISTOR DENSITY SCALING
- Publication number 20240429131
- Publication date Dec 26, 2024
- Intel Corporation
- Bok Eng Cheah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240429159
- Publication date Dec 26, 2024
- RENESAS ELECTRONICS CORPORATION
- Yasutaka NAKASHIBA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMS SOLENOID TRANSFORMER AND MANUFACTURING METHOD THEREOF
- Publication number 20240428990
- Publication date Dec 26, 2024
- Tiantong XU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FRINGE CAPACITOR, INTEGRATED CIRCUIT AND MANUFACTURING PROCESS FOR...
- Publication number 20240429233
- Publication date Dec 26, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Naveen Tipirneni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSFORMER-BASED ISOLATOR WITH SPIRAL COILS
- Publication number 20240429265
- Publication date Dec 26, 2024
- ALLEGRO MICROSYSTEMS, LLC
- William P. Taylor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CAPACITOR
- Publication number 20240429269
- Publication date Dec 26, 2024
- Intel Corporation
- Peter BAUMGARTNER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE WITH INDUCTORS AND CAPACITORS THAT ARE EMBEDDED WITHIN...
- Publication number 20240429217
- Publication date Dec 26, 2024
- Monolithic Power Systems, Inc.
- Daocheng HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR AND SEMICONDUCTOR DEVICE INCLUDING THE SAME
- Publication number 20240429267
- Publication date Dec 26, 2024
- Samsung Electronics Co., Ltd.
- Jeongil BANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING A LOW RESISTIVITY TRENCH CAPACITOR
- Publication number 20240429271
- Publication date Dec 26, 2024
- SK keyfoundry Inc.
- Youngryeol KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MIM Capacitor in IC Heterogenous Integration
- Publication number 20240421063
- Publication date Dec 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Chieh Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL INSULATOR METAL CAPACITOR (MIM CAPACITOR)
- Publication number 20240421067
- Publication date Dec 19, 2024
- International Business Machines Corporation
- Baozhen Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN FILM RESISTOR, THERMISTOR AND METHOD OF PRODUCING THE SAME
- Publication number 20240421074
- Publication date Dec 19, 2024
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- Qiying WONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR AND METHOD FOR MANUFACTURING CAPACITOR
- Publication number 20240420889
- Publication date Dec 19, 2024
- Murata Manufacturing Co., Ltd.
- Sota YANAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20240420954
- Publication date Dec 19, 2024
- SK HYNIX INC.
- Se-Hun KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOPED POLAR LAYERS AND SEMICONDUCTOR DEVICE INCORPORATING SAME
- Publication number 20240421229
- Publication date Dec 19, 2024
- Kepler Computing Inc.
- Ramesh Ramamoorthy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL INTERLOCKED CORRUGATED CAPACITOR STRUCTURES
- Publication number 20240421181
- Publication date Dec 19, 2024
- Intel Corporation
- Denzil Frost
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR USE IN IMPROVING LINEARITY OF MOSFETS USIN...
- Publication number 20240421227
- Publication date Dec 19, 2024
- pSemi Corporation
- Christopher N. Brindle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-INSULATOR-METAL STRUCTURES AND METHODS OF FORMING THE SAME
- Publication number 20240421066
- Publication date Dec 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Liang CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES HAVING CAPACITOR STRUCTURES AND SEMICONDUCTOR...
- Publication number 20240421068
- Publication date Dec 19, 2024
- Samsung Electronics Co., Ltd.
- Myoungsoo KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH MULTIPLE STACKED PASSIVE DEVICES
- Publication number 20240421128
- Publication date Dec 19, 2024
- QUALCOMM Incorporated
- Yangyang SUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE AND MANUFACTURING METHOD OF WIRING SUBSTRATE
- Publication number 20240421059
- Publication date Dec 19, 2024
- TOPPAN Holdings Inc.
- Tsukasa Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20240412971
- Publication date Dec 12, 2024
- SK HYNIX INC.
- Se-Hun KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE WITH ELECTRODE LAYER AND METHOD FOR...
- Publication number 20240413193
- Publication date Dec 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Tzu CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL METAL-INSULATOR-METAL CAPACITORS
- Publication number 20240413194
- Publication date Dec 12, 2024
- Intel Corporation
- Denzil Frost
- H01 - BASIC ELECTRIC ELEMENTS

Passive two-terminal components without a potential-jump or surface barrier for integrated circuits; Details thereof; Multistep manufacturing processes therefor

Industry

Parent Industries

Current Industry

Sub Industries

Patents Grantslast 30 patents

Semiconductor devices including crack sensor

Quantum circuit with trench capacitor

Semiconductor package with dummy MIM capacitor die

Semiconductor structures having deep trench capacitor and methods f...

Thin-film transistors and MIM capacitors in exclusion zones

Semiconductor device including capacitor and resistor

Molded interconnects in bridges for integrated-circuit packages

Integrated circuit and method of forming the same

Semiconductor device

Metal-insulator-metal (MIM) energy storage device with layered stac...

Power converter

Integrated circuit with FEOL resistor

Configurable metal—insulator—metal capacitor and devices

Integrated magnetic assembly with conductive field plates

Method for forming capacitor via

Lead frame and method for stacking discrete components to be embedd...

Storage capacitor with multiple dielectrics

Through plate interconnect for a vertical MIM capacitor

Semiconductor device with uneven electrode surface and method for f...

Trench capacitor profile to decrease substrate warpage

Ferroelectric structure including a ferroelectric film having a fir...

Semiconductor device for enhancing quality factor of inductor and m...

Memory device with semiconductor layer on isolation structure

Method and structures pertaining to improved ferroelectric random-a...

Semiconductor packages and methods of forming same

Method for preparing semiconductor structure and semiconductor stru...

Integrated circuits including composite dielectric layer

Embedded metal insulator metal structure

Cerium-doped ferroelectric materials and related devices and methods

Semiconductor devices including ferroelectric materials

Patents Applicationslast 30 patents

SEMICONDUCTOR CIRCUIT, MEMORY SYSTEM, AND INFORMATION PROCESSING DE...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

EMBEDDED INDUCTOR MODULE AND PACKAGED SEMICONDUCTOR DEVICE

RESISTOR AND RESISTOR-TRANSISTOR-LOGIC CIRCUIT WITH GAN STRUCTURE A...

INTEGRATED CIRCUIT INCLUDING A CAPACITIVE ELEMENT, AND CORRESPONDIN...

METAL INSULATOR METAL CAPACITOR (MIM CAPACITOR)

MICRO THROUGH-SILICON VIA FOR TRANSISTOR DENSITY SCALING

SEMICONDUCTOR DEVICE

MEMS SOLENOID TRANSFORMER AND MANUFACTURING METHOD THEREOF

FRINGE CAPACITOR, INTEGRATED CIRCUIT AND MANUFACTURING PROCESS FOR...

TRANSFORMER-BASED ISOLATOR WITH SPIRAL COILS

INTEGRATED CAPACITOR

POWER MODULE WITH INDUCTORS AND CAPACITORS THAT ARE EMBEDDED WITHIN...

CAPACITOR AND SEMICONDUCTOR DEVICE INCLUDING THE SAME

SEMICONDUCTOR DEVICE HAVING A LOW RESISTIVITY TRENCH CAPACITOR

MIM Capacitor in IC Heterogenous Integration

METAL INSULATOR METAL CAPACITOR (MIM CAPACITOR)

THIN FILM RESISTOR, THERMISTOR AND METHOD OF PRODUCING THE SAME

CAPACITOR AND METHOD FOR MANUFACTURING CAPACITOR

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

DOPED POLAR LAYERS AND SEMICONDUCTOR DEVICE INCORPORATING SAME

THREE-DIMENSIONAL INTERLOCKED CORRUGATED CAPACITOR STRUCTURES

METHOD AND APPARATUS FOR USE IN IMPROVING LINEARITY OF MOSFETS USIN...

METAL-INSULATOR-METAL STRUCTURES AND METHODS OF FORMING THE SAME

SEMICONDUCTOR DEVICES HAVING CAPACITOR STRUCTURES AND SEMICONDUCTOR...

SEMICONDUCTOR DEVICE WITH MULTIPLE STACKED PASSIVE DEVICES

WIRING SUBSTRATE AND MANUFACTURING METHOD OF WIRING SUBSTRATE

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

SEMICONDUCTOR DEVICE STRUCTURE WITH ELECTRODE LAYER AND METHOD FOR...

THREE-DIMENSIONAL METAL-INSULATOR-METAL CAPACITORS