Passive two-terminal components without a potential-jump or surface barrier for integrated circuits; Details thereof; Multistep manufacturing processes therefor

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Patents Grantslast 30 patents

Information Patent Grant
Stacked non-planar capacitors based multi-function linear threshold...
- Patent number 12,334,918
- Issue date Jun 17, 2025
- Kepler Computing Inc.
- Amrita Mathuriya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-function threshold gate with input based adaptive threshold a...
- Patent number 12,322,743
- Issue date Jun 3, 2025
- Kepler Computing Inc.
- Amrita Mathuriya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Planar capacitors with shared electrode and methods of fabrication
- Patent number 12,324,163
- Issue date Jun 3, 2025
- Kepler Computing Inc.
- Noriyuki Sato
- G11 - INFORMATION STORAGE
Information Patent Grant
Integrated circuit devices and methods of manufacturing the same
- Patent number 12,322,745
- Issue date Jun 3, 2025
- Samsung Electronics Co., Ltd.
- Jungoo Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-function linear threshold gate with input based adaptive thre...
- Patent number 12,316,319
- Issue date May 27, 2025
- Kepler Computing Inc.
- Amrita Mathuriya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin film structure including method of manufacturing
- Patent number 12,308,365
- Issue date May 20, 2025
- Samsung Electronics Co., Ltd.
- Hyungjun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure
- Patent number 12,300,679
- Issue date May 13, 2025
- Mediatek Inc.
- Yi-Jyun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including storage capacitor having pixel elect...
- Patent number 12,300,702
- Issue date May 13, 2025
- Semiconductor Energy Laboratory Co., Ltd.
- Hajime Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor structure
- Patent number 12,300,715
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chang-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid integrated circuit package
- Patent number 12,300,621
- Issue date May 13, 2025
- Infinera Corporation
- John W. Osenbach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit semiconductor device
- Patent number 12,295,136
- Issue date May 6, 2025
- Samsung Electronics Co., Ltd.
- Intak Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Area optimized ferroelectric or paraelectric based low power multip...
- Patent number 12,294,370
- Issue date May 6, 2025
- Kepler Computing Inc.
- Amrita Mathuriya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Doped polar layers and semiconductor device incorporating same
- Patent number 12,294,029
- Issue date May 6, 2025
- Kepler Computing Inc.
- Ramesh Ramamoorthy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Deep trench capacitor array with reduced warpage
- Patent number 12,294,033
- Issue date May 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Fu-Chiang Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method for forming integrated high density MIM capacitor
- Patent number 12,288,802
- Issue date Apr 29, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method of manufacture
- Patent number 12,288,801
- Issue date Apr 29, 2025
- TAIWAN SEMICONDUCTOR MANUFACTUING COMPANY LIMITED
- Ching-Hung Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out semiconductor package
- Patent number 12,283,577
- Issue date Apr 22, 2025
- Samsung Electronics Co., Ltd.
- Joonsung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D inductor design using bundle substrate vias
- Patent number 12,283,607
- Issue date Apr 22, 2025
- QUALCOMM Incorporated
- Jonghae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and electronic equipment
- Patent number 12,283,592
- Issue date Apr 22, 2025
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Shinya Morita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Majority or minority based low power checkerboard carry save multip...
- Patent number 12,283,955
- Issue date Apr 22, 2025
- Kepler Computing Inc.
- Amrita Mathuriya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,283,599
- Issue date Apr 22, 2025
- Semiconductor Energy Laboratory Co., Ltd.
- Shunpei Yamazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package board
- Patent number 12,278,197
- Issue date Apr 15, 2025
- Murata Manufacturing Co., Ltd.
- Kenji Nishiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor and semiconductor device including the same
- Patent number 12,278,260
- Issue date Apr 15, 2025
- Samsung Electronics Co., Ltd.
- Byunghoon Na
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor, electronic device including the same, and method of manu...
- Patent number 12,278,261
- Issue date Apr 15, 2025
- Samsung Electronics Co., Ltd.
- Euncheol Do
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
DC/DC converter component
- Patent number 12,279,373
- Issue date Apr 15, 2025
- Murata Manufacturing Co., Ltd.
- Yoshimasa Yoshioka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit and manufacturing method thereof
- Patent number 12,279,414
- Issue date Apr 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Katherine H Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside integrated voltage regulator for integrated circuits
- Patent number 12,278,217
- Issue date Apr 15, 2025
- Google LLC
- Namhoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for shielded inductive devices
- Patent number 12,278,259
- Issue date Apr 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Feng Wei Kuo
- C02 - TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
Information Patent Grant
Integrated fan-out package with 3D magnetic core inductor
- Patent number 12,272,637
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Wen-Shiang Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with source resistor
- Patent number 12,272,640
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Po-Zeng Kang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
THIN FILM LAMINATE STRUCTURE, INTEGRATED DEVICE INCLUDING THE SAME,...
- Publication number 20250072016
- Publication date Feb 27, 2025
- Samsung Electronics Co., Ltd.
- Kiyoung LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RADIO FREQUENCY MODULE
- Publication number 20250070037
- Publication date Feb 27, 2025
- MURATA MANUFACTURING CO., LTD.
- Yoshihito OTSUBO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN FILM CAPACITOR, MANUFACTURING METHOD THEREFOR, AND ELECTRONIC...
- Publication number 20250069814
- Publication date Feb 27, 2025
- TDK Corporation
- Miyu HASEGAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250070103
- Publication date Feb 27, 2025
- Rohm Co., Ltd.
- Masanobu TSUJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONFIGURABLE METAL - INSULATOR - METAL CAPACITOR AND DEVICES AND PR...
- Publication number 20250070016
- Publication date Feb 27, 2025
- MACOM Technology Solutions Holdings, Inc.
- Jeremy FISHER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER CONVERTER PACKAGES, APPARATUS FOR POWER CONVERSION, AND METHO...
- Publication number 20250070102
- Publication date Feb 27, 2025
- Murata Manufacturing Co., Ltd.
- David Giuliano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL INSULATOR METAL CAPACITOR (MIM CAPACITOR)
- Publication number 20250072017
- Publication date Feb 27, 2025
- International Business Machines Corporation
- ATSUSHI OGINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HETEROGENEOUS METAL LINE COMPOSITIONS FOR ADVANCED INTEGRATED CIRCU...
- Publication number 20250072078
- Publication date Feb 27, 2025
- Intel Corporation
- Andrew W. YEOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESISTOR STRUCTURE WITH CAPPING STRUCTURE ON TFR LAYER
- Publication number 20250072013
- Publication date Feb 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Tsung Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF MANUFACTURING RESISTOR DEVICES
- Publication number 20250072014
- Publication date Feb 27, 2025
- Micron Technology, Inc.
- Ahmed N. Noemaun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250072012
- Publication date Feb 27, 2025
- Rohm Co., Ltd.
- Masanobu TSUJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250063746
- Publication date Feb 20, 2025
- ROHM CO., LTD.
- Bungo TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20250063715
- Publication date Feb 20, 2025
- WINBOND ELECTRONICS CORP.
- Ji-Min LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20250063745
- Publication date Feb 20, 2025
- JCET GROUP CO., LTD.
- Jianghua Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL INSULATOR METAL CAPACITOR (MIM CAPACITOR)
- Publication number 20250062219
- Publication date Feb 20, 2025
- International Business Machines Corporation
- ATSUSHI OGINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIGNAL TRANSMISSION DEVICE
- Publication number 20250062256
- Publication date Feb 20, 2025
- DENSO CORPORATION
- Shuji ASANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Vertically Stacked Capacitors
- Publication number 20250062220
- Publication date Feb 20, 2025
- Ampleon Netherlands B.V.
- Daniel Maassen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-FREQUENCY HIGH-POWER DENSITY MODULE POWER SUPPLY, PARALLEL COM...
- Publication number 20250062243
- Publication date Feb 20, 2025
- SHANGHAI METAPWR ELECTRONICS CO., LTD
- Jianhong ZENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRENCH CAPACITOR PROFILE TO DECREASE SUBSTRATE WARPAGE
- Publication number 20250063744
- Publication date Feb 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsin-Li Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL INSULATOR METAL CAPACITOR (MIM CAPACITOR)
- Publication number 20250062218
- Publication date Feb 20, 2025
- International Business Machines Corporation
- ATSUSHI OGINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IN-TRENCH CAPACITOR MERGED STRUCTURE
- Publication number 20250063743
- Publication date Feb 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Hui SU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20250056819
- Publication date Feb 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Lun Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICALLY-ARRANGED GATE ALL AROUND TRANSISTORS HAVING UNIFORM CELL...
- Publication number 20250056828
- Publication date Feb 13, 2025
- Micron Technology, Inc.
- Si-Woo LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20250054877
- Publication date Feb 13, 2025
- Advanced Semiconductor Engineering, Inc.
- Pao-Nan LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING LOW-RESISTANCE VIA CONTACT
- Publication number 20250054858
- Publication date Feb 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sheng-Kai Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT PACKAGE INCLUDING BRIDGE STRUCTURE AND METHOD OF MANUFACTUR...
- Publication number 20250054867
- Publication date Feb 13, 2025
- SILICON BOX PTE. LTD.
- Byung Joon HAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE INCLUDING IPD AND METHOD OF FORMING THE SAME
- Publication number 20250054894
- Publication date Feb 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hua-Wei Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESISTOR GEOMETRY
- Publication number 20250056817
- Publication date Feb 13, 2025
- Pragmatic Semiconductor Limited
- Richard PRICE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-INSULATOR-METAL DEVICE WITH HIGH-K LAYER CAPPING STRUCTURE
- Publication number 20250056820
- Publication date Feb 13, 2025
- Taiwan Semiconductor Manufacturing company Ltd.
- Liang-Shiuan Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF AND MEMORY SYSTEM
- Publication number 20250048646
- Publication date Feb 6, 2025
- Yangtze Memory Technologies Co., Ltd.
- Zhong Zhang
- H01 - BASIC ELECTRIC ELEMENTS

Passive two-terminal components without a potential-jump or surface barrier for integrated circuits; Details thereof; Multistep manufacturing processes therefor

Industry

Parent Industries

Current Industry

Sub Industries

Patents Grantslast 30 patents

Stacked non-planar capacitors based multi-function linear threshold...

Multi-function threshold gate with input based adaptive threshold a...

Planar capacitors with shared electrode and methods of fabrication

Integrated circuit devices and methods of manufacturing the same

Multi-function linear threshold gate with input based adaptive thre...

Thin film structure including method of manufacturing

Semiconductor package structure

Semiconductor device including storage capacitor having pixel elect...

Capacitor structure

Hybrid integrated circuit package

Integrated circuit semiconductor device

Area optimized ferroelectric or paraelectric based low power multip...

Doped polar layers and semiconductor device incorporating same

Deep trench capacitor array with reduced warpage

Structure and method for forming integrated high density MIM capacitor

Semiconductor structure and method of manufacture

Fan-out semiconductor package

3D inductor design using bundle substrate vias

Semiconductor device and electronic equipment

Majority or minority based low power checkerboard carry save multip...

Semiconductor device

Package board

Capacitor and semiconductor device including the same

Capacitor, electronic device including the same, and method of manu...

DC/DC converter component

Integrated circuit and manufacturing method thereof

Backside integrated voltage regulator for integrated circuits

Systems and methods for shielded inductive devices

Integrated fan-out package with 3D magnetic core inductor

Semiconductor device with source resistor

Patents Applicationslast 30 patents

THIN FILM LAMINATE STRUCTURE, INTEGRATED DEVICE INCLUDING THE SAME,...

RADIO FREQUENCY MODULE

THIN FILM CAPACITOR, MANUFACTURING METHOD THEREFOR, AND ELECTRONIC...

SEMICONDUCTOR DEVICE

CONFIGURABLE METAL - INSULATOR - METAL CAPACITOR AND DEVICES AND PR...

POWER CONVERTER PACKAGES, APPARATUS FOR POWER CONVERSION, AND METHO...

METAL INSULATOR METAL CAPACITOR (MIM CAPACITOR)

HETEROGENEOUS METAL LINE COMPOSITIONS FOR ADVANCED INTEGRATED CIRCU...

RESISTOR STRUCTURE WITH CAPPING STRUCTURE ON TFR LAYER

METHODS OF MANUFACTURING RESISTOR DEVICES

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR MEMORY STRUCTURE AND METHOD FOR FORMING THE SAME

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

METAL INSULATOR METAL CAPACITOR (MIM CAPACITOR)

SIGNAL TRANSMISSION DEVICE

Vertically Stacked Capacitors

HIGH-FREQUENCY HIGH-POWER DENSITY MODULE POWER SUPPLY, PARALLEL COM...

TRENCH CAPACITOR PROFILE TO DECREASE SUBSTRATE WARPAGE

METAL INSULATOR METAL CAPACITOR (MIM CAPACITOR)

IN-TRENCH CAPACITOR MERGED STRUCTURE

CAPACITOR STRUCTURE AND METHODS OF FORMING THE SAME

VERTICALLY-ARRANGED GATE ALL AROUND TRANSISTORS HAVING UNIFORM CELL...

SEMICONDUCTOR PACKAGE STRUCTURE

SEMICONDUCTOR STRUCTURE HAVING LOW-RESISTANCE VIA CONTACT

FAN-OUT PACKAGE INCLUDING BRIDGE STRUCTURE AND METHOD OF MANUFACTUR...

PACKAGE STRUCTURE INCLUDING IPD AND METHOD OF FORMING THE SAME

RESISTOR GEOMETRY

METAL-INSULATOR-METAL DEVICE WITH HIGH-K LAYER CAPPING STRUCTURE

SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF AND MEMORY SYSTEM