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ELECTRICITY
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Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/81005
being a temporary or sacrificial substrate
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last 30 patents
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Patent Grant
Via for semiconductor device connection and methods of forming the...
Patent number
11,961,800
Issue date
Apr 16, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package stacking using chip to wafer bonding
Patent number
11,955,462
Issue date
Apr 9, 2024
Intel Corporation
Georg Seidemann
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and manufacturing method thereof
Patent number
11,948,808
Issue date
Apr 2, 2024
Amkor Technology Singapore Holding Pte Ltd.
Dong Jin Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device with transmissive layer and manufacturing meth...
Patent number
11,942,581
Issue date
Mar 26, 2024
Amkor Technology Singapore Holding Pte Ltd.
David Clark
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device having a redistribution layer
Patent number
11,935,856
Issue date
Mar 19, 2024
Amkor Technology Singapore Holding Pte Ltd.
Jong Sik Paek
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device having laterally offset stacked semiconductor...
Patent number
11,929,349
Issue date
Mar 12, 2024
Micron Technology, Inc.
Chan H. Yoo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for manufacturing semiconductor device having chip stacked a...
Patent number
11,923,287
Issue date
Mar 5, 2024
Kabushiki Kaisha Toshiba
Takayuki Tajima
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
3D semiconductor device and structure with bonding
Patent number
11,923,230
Issue date
Mar 5, 2024
Monolithic 3D Inc.
Zvi Or-Bach
G11 - INFORMATION STORAGE
Information
Patent Grant
Multi-chip package with high density interconnects
Patent number
11,908,802
Issue date
Feb 20, 2024
Intel Corporation
Aleksandar Aleksov
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
3D semiconductor device and structure with memory
Patent number
11,901,210
Issue date
Feb 13, 2024
Monolithic 3D Inc.
Zvi Or-Bach
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Microelectronic assemblies
Patent number
11,901,330
Issue date
Feb 13, 2024
Intel Corporation
Shawna M. Liff
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and manufacturing method thereof
Patent number
11,901,332
Issue date
Feb 13, 2024
Amkor Technology Singapore Holding Pte Ltd.
Yeong Beom Ko
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor device with integrated heat distribution and manufact...
Patent number
11,901,343
Issue date
Feb 13, 2024
Amkor Technology Singapore Holding Pte Ltd.
Bora Baloglu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
3D semiconductor device and structure with single-crystal layers
Patent number
11,876,011
Issue date
Jan 16, 2024
Monolithic 3D Inc.
Zvi Or-Bach
G11 - INFORMATION STORAGE
Information
Patent Grant
Multi-chip package and method of providing die-to-die interconnects...
Patent number
11,876,053
Issue date
Jan 16, 2024
Intel Corporation
Henning Braunisch
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor package using a coreless signal distribution structure
Patent number
11,869,879
Issue date
Jan 9, 2024
Amkor Technology Singapore Holding Pte Ltd.
Do Hyung Kim
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Method for producing a 3D semiconductor device and structure with m...
Patent number
11,862,503
Issue date
Jan 2, 2024
Monolithic 3D Inc.
Zvi Or-Bach
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods for producing a 3D semiconductor device and structure with...
Patent number
11,854,857
Issue date
Dec 26, 2023
Monolithic 3D Inc.
Zvi Or-Bach
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package with layer structures, antenna layer and elec...
Patent number
11,837,552
Issue date
Dec 5, 2023
Mediatek Inc.
Wen-Sung Hsu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and method for manufacturing the same
Patent number
11,830,841
Issue date
Nov 28, 2023
Taiwan Semiconductor Manufacturing Company Ltd.
Chuei-Tang Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
3D semiconductor device and structure with bonding
Patent number
11,830,757
Issue date
Nov 28, 2023
Monolithic 3D Inc.
Zvi Or-Bach
G11 - INFORMATION STORAGE
Information
Patent Grant
Method of manufacturing an electronic device and electronic device...
Patent number
11,823,913
Issue date
Nov 21, 2023
Amkor Technology Singapore Holding Pte Ltd.
Bora Baloglu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multi-chip package and method of providing die-to-die interconnects...
Patent number
11,824,008
Issue date
Nov 21, 2023
Intel Corporation
Henning Braunisch
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of forming package structure
Patent number
11,817,437
Issue date
Nov 14, 2023
Taiwan Semiconductor Manufacturing Co., Ltd
Jing-Cheng Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
High density substrate routing in package
Patent number
11,810,884
Issue date
Nov 7, 2023
Intel Corporation
Weng Hong Teh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
3DIC formation with dies bonded to formed RDLs
Patent number
11,810,899
Issue date
Nov 7, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods for producing a 3D semiconductor device and structure with...
Patent number
11,804,396
Issue date
Oct 31, 2023
Monolithic 3D Inc.
Zvi Or-Bach
G11 - INFORMATION STORAGE
Information
Patent Grant
Package structure and manufacturing method thereof
Patent number
11,804,457
Issue date
Oct 31, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
3D semiconductor device and structure with bonding
Patent number
11,784,082
Issue date
Oct 10, 2023
Monolithic 3D Inc.
Zvi Or-Bach
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Dual sided fan-out package having low warpage across all temperatures
Patent number
11,784,166
Issue date
Oct 10, 2023
Micron Technology, Inc.
Chan H. Yoo
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
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Patent Application
DRIVING SUBSTRATE, MICRO LED TRANSFER DEVICE AND MICRO LED TRANSFER...
Publication number
20240153908
Publication date
May 9, 2024
HKC Corporation Limited
YANG PU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
Publication number
20240145417
Publication date
May 2, 2024
Samsung Electronics Co., Ltd.
Hyeongwoo JIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
APPARATUS CONFIGURED TO TRANSFER ELECTRONIC COMPONENT, METHOD FOR B...
Publication number
20240145427
Publication date
May 2, 2024
Stroke Precision Advanced Engineering Co., Ltd.
Chingju Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MICROELECTRONIC ASSEMBLIES
Publication number
20240136323
Publication date
Apr 25, 2024
Intel Corporation
Shawna M. Liff
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
Publication number
20240113089
Publication date
Apr 4, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Tian Hu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
APPARATUS FOR TRANSFERRING ELECTRONIC COMPONENT AND METHOD FOR BOND...
Publication number
20240105671
Publication date
Mar 28, 2024
Stroke Precision Advanced Engineering Co., Ltd.
Chien-Shou Liao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF FABRICATING DISPLAY PANEL
Publication number
20240072027
Publication date
Feb 29, 2024
SAMSUNG DISPLAY CO., LTD.
Jeong Won HAN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MANUFACTURING METHOD OF DISPLAY PANEL, AND DETECTION AND BONDING AP...
Publication number
20240047280
Publication date
Feb 8, 2024
TIANMA ADVANCED DISPLAY TECHNOLOGY INSTITUTE (XIAMEN) CO., LTD.
Kerui XI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MOUNTED STRUCTURE, LED DISPLAY, AND MOUNTING METHOD
Publication number
20240038951
Publication date
Feb 1, 2024
DAICEL CORPORATION
Hiroto MIYAKE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DIE PROCESSING
Publication number
20240021572
Publication date
Jan 18, 2024
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Cyprian Emeka Uzoh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STRUCTURE
Publication number
20240014192
Publication date
Jan 11, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Jing-Cheng LIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
Publication number
20240014151
Publication date
Jan 11, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Fingerprint Sensor Device and Method
Publication number
20230343133
Publication date
Oct 26, 2023
Taiwan Semiconductor Manufacturing Co., Ltd.
Yu-Chih Huang
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
Publication number
20230335540
Publication date
Oct 19, 2023
Samsung Electronics Co., Ltd.
YANGGYOO JUNG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE INCLUDING INTERPOSER
Publication number
20230317623
Publication date
Oct 5, 2023
Samsung Electronics Co., Ltd.
Jong-youn Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Controlling Warpage During LAB
Publication number
20230307414
Publication date
Sep 28, 2023
STATS ChipPAC Pte Ltd.
Wagno Alves Braganca
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LOGIC DRIVE USING STANDARD COMMODITY PROGRAMMABLE LOGIC IC CHIPS CO...
Publication number
20230299774
Publication date
Sep 21, 2023
iCometrue Company Ltd.
Mou-Shiung LIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF
Publication number
20230282560
Publication date
Sep 7, 2023
Amkor Technology Singapore Holding Pte. Ltd.
Michael Kelly
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP PACKAGE WITH REDISTRIBUTION STRUCTURE HAVING MULTIPLE CHIPS
Publication number
20230260890
Publication date
Aug 17, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Shin-Puu JENG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGED DIE AND RDL WITH BONDING STRUCTURES THEREBETWEEN
Publication number
20230253395
Publication date
Aug 10, 2023
Taiwan Semiconductor Manufacturing Co., Ltd.
Hsien-Wei Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Wafer Level Chip Scale Packaging Intermediate Structure Apparatus a...
Publication number
20230245923
Publication date
Aug 3, 2023
Taiwan Semiconductor Manufacturing Co, LTD.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
Publication number
20230223365
Publication date
Jul 13, 2023
Amkor Technology Singapore Holding Pte. Ltd.
Jong Sik Paek
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HIGH DENSITY INTERCONNECTION USING FANOUT INTERPOSER CHIPLET
Publication number
20230223348
Publication date
Jul 13, 2023
Apple Inc.
Jun Zhai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LEADLESS SEMICONDUCTOR PACKAGE WITH INTERNAL GULL WING LEAD STRUCTURES
Publication number
20230187327
Publication date
Jun 15, 2023
NXP USA, Inc.
Pat Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF
Publication number
20230154893
Publication date
May 18, 2023
Amkor Technology Singapore Holding Pte. Ltd.
David Hiner
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MICROELECTRONIC ASSEMBLIES
Publication number
20230127749
Publication date
Apr 27, 2023
Intel Corporation
Shawna M. Liff
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Integrated Fan-Out Package and the Methods of Manufacturing
Publication number
20230114652
Publication date
Apr 13, 2023
Taiwan Semiconductor Manufacturing Co., Ltd.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
Publication number
20230105710
Publication date
Apr 6, 2023
Samsung Electronics Co., Ltd.
Hyekyoung Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR MANUFACTURING PACKAGE STRUCTURE
Publication number
20230098830
Publication date
Mar 30, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Yi-Da TSAI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Forming Dual-Sided Interconnect...
Publication number
20230096463
Publication date
Mar 30, 2023
STATS ChipPAC Pte Ltd.
Yaojian Lin
H01 - BASIC ELECTRIC ELEMENTS