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being an additional member attached to the bonding area through an adhesive or solder

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  • H01L2224/40491
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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/40491being an additional member attached to the bonding area through an adhesive or solder
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Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING THE SAME, AND POWER C...
    • Publication number 20240312880
    • Publication date Sep 19, 2024
    • Mitsubishi Electric Corporation
    • Yusuke KUSAKABE
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20240096843
    • Publication date Mar 21, 2024
    • Kabushiki Kaisha Toshiba
    • Kyo TANABIKI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20240047315
    • Publication date Feb 8, 2024
    • ROHM CO., LTD.
    • Masaki KANO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20230411338
    • Publication date Dec 21, 2023
    • Rohm Co., Ltd.
    • Takukazu OTSUKA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE, AND PRODUCTION METHOD FOR SEMICONDUCTOR DEVICE
    • Publication number 20230245954
    • Publication date Aug 3, 2023
    • Rohm Co., Ltd.
    • Koshun SAITO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20210407954
    • Publication date Dec 30, 2021
    • Rohm Co., Ltd.
    • Katsuhiko YOSHIHARA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20180047698
    • Publication date Feb 15, 2018
    • Rohm Co., Ltd.
    • Mamoru YAMAGAMI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20140374926
    • Publication date Dec 25, 2014
    • Kabushiki Kaisha Toshiba
    • Takeshi MIYAKAWA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Semiconductor Device Using Diffusion Soldering
    • Publication number 20130200532
    • Publication date Aug 8, 2013
    • INFINEON TECHNOLOGIES AG
    • Ralf Otremba
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20130069215
    • Publication date Mar 21, 2013
    • Kabushiki Kaisha Toshiba
    • Junichi Nakao
    • H01 - BASIC ELECTRIC ELEMENTS