being an anchoring portion

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H01L2924/18301

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/18301being an anchoring portion

Industries

Patents Grantslast 30 patents

Information Patent Grant
Reliable semiconductor packages
- Patent number 12,211,863
- Issue date Jan 28, 2025
- UTAC HEADQUARTERS PTE. LTD.
- Il Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method therefor
- Patent number 12,080,673
- Issue date Sep 3, 2024
- Mitsubishi Electric Corporation
- Tatsuya Kitagawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging of a semiconductor device with a plurality of leads
- Patent number 12,046,541
- Issue date Jul 23, 2024
- Rohm Co., Ltd.
- Katsuhiro Iwai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package comprising a pin in the form of a dril...
- Patent number 11,955,415
- Issue date Apr 9, 2024
- Infineon Technologies Austria AG
- Thorsten Scharf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface treatment method and apparatus for semiconductor packaging
- Patent number 11,776,880
- Issue date Oct 3, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Horng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing semiconductor device
- Patent number 11,710,705
- Issue date Jul 25, 2023
- Rohm Co., Ltd.
- Kazunori Fuji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging of a semiconductor device with a plurality of leads
- Patent number 11,658,100
- Issue date May 23, 2023
- Rohm Co., Ltd.
- Katsuhiro Iwai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,348,853
- Issue date May 31, 2022
- Kabushiki Kaisha Toshiba
- Yuuichi Fujita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic module with a groove and press hole on the surface of a...
- Patent number 11,227,810
- Issue date Jan 18, 2022
- Shindengen Electric Manufacturing Co., Ltd.
- Yoshihiro Kamiyama
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Packaging of a semiconductor device with a plurality of leads
- Patent number 11,183,444
- Issue date Nov 23, 2021
- Rohm Co., Ltd.
- Katsuhiro Iwai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component tethers with spacers
- Patent number 11,088,007
- Issue date Aug 10, 2021
- X-CELEPRINT LIMITED
- Alin Mihai Fecioru
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing light emitting device and light emitting de...
- Patent number 11,018,286
- Issue date May 25, 2021
- Nichia Corporation
- Shimpei Sasaoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,998,295
- Issue date May 4, 2021
- Denso Corporation
- Hiromasa Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,916,490
- Issue date Feb 9, 2021
- Fuji Electric Co., Ltd.
- Yoshihiro Yasuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic substrate and electronic apparatus
- Patent number 10,910,289
- Issue date Feb 2, 2021
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Masataka Maehara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging structure with recessed outer and inner lead surfaces
- Patent number 10,886,203
- Issue date Jan 5, 2021
- Rohm Co., Ltd.
- Katsuhiro Iwai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die stack structure, semiconductor package having the same and meth...
- Patent number 10,886,255
- Issue date Jan 5, 2021
- Samsung Electronics Co., Ltd.
- Ji-Seok Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,825,758
- Issue date Nov 3, 2020
- Rohm Co., Ltd.
- Shoji Yasunaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface treatment method and apparatus for semiconductor packaging
- Patent number 10,811,338
- Issue date Oct 20, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Horng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing semiconductor device
- Patent number 10,770,380
- Issue date Sep 8, 2020
- Rohm Co., Ltd.
- Akihiro Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,763,204
- Issue date Sep 1, 2020
- Denso Corporation
- Tomohito Iwashige
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, and method for manufacturing semiconductor de...
- Patent number 10,707,388
- Issue date Jul 7, 2020
- Nichia Corporation
- Teppei Kunimune
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,658,324
- Issue date May 19, 2020
- Mitsubishi Electric Corporation
- Daisuke Murata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor device having nanoparticle adhesion layer pa...
- Patent number 10,636,679
- Issue date Apr 28, 2020
- Texas Instruments Incorporated
- Benjamin Stassen Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip carrier configured for delamination-free encapsulation and sta...
- Patent number 10,586,756
- Issue date Mar 10, 2020
- Infineon Technologies AG
- Alexander Roth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing semiconductor device
- Patent number 10,573,584
- Issue date Feb 25, 2020
- Rohm Co., Ltd.
- Akihiro Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing light emitting device and light emitting de...
- Patent number 10,522,731
- Issue date Dec 31, 2019
- Nichia Corporation
- Shimpei Sasaoka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Surface treatment method and apparatus for semiconductor packaging
- Patent number 10,522,444
- Issue date Dec 31, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Horng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing an optoelectronic semiconductor component, opto...
- Patent number 10,483,444
- Issue date Nov 19, 2019
- Osram Opto Semiconductors GmbH
- Harald Jäger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power quad flat no-lead (PQFN) package in a single shunt inverter c...
- Patent number 10,438,876
- Issue date Oct 8, 2019
- Infineon Technologies Americas Corp.
- Dean Fernando
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240347426
- Publication date Oct 17, 2024
- ROHM CO., LTD.
- Katsuhiro IWAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING A SEMICONDUCTOR DEVICE PACKAGE COMPRISING A...
- Publication number 20240186225
- Publication date Jun 6, 2024
- Infineon Technologies Austria AG
- Thorsten Scharf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE PACKAGE WITH SEALED DIE ENCLOSURES
- Publication number 20240088081
- Publication date Mar 14, 2024
- QUALCOMM Incorporated
- Bart KASSTEEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...
- Publication number 20240063096
- Publication date Feb 22, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Shigeki TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240047288
- Publication date Feb 8, 2024
- InnoLux Corporation
- Sheng-Nan CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230411232
- Publication date Dec 21, 2023
- Rohm Co., Ltd.
- Yosui FUTAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20230260922
- Publication date Aug 17, 2023
- ROHM CO., LTD.
- Kazunori FUJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230253298
- Publication date Aug 10, 2023
- ROHM CO., LTD.
- Katsuhiro IWAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
- Publication number 20230197470
- Publication date Jun 22, 2023
- Fuji Electric Co., Ltd.
- Takashi KATSUKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230163092
- Publication date May 25, 2023
- Samsung Electronics Co., Ltd.
- Soohwan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230142301
- Publication date May 11, 2023
- Samsung Electronics Co., Ltd.
- Changbo LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20220392819
- Publication date Dec 8, 2022
- DENSO CORPORATION
- Sachio KODAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE ELECTRICAL CONTACT STRUCTURES AND RELATED MET...
- Publication number 20220384204
- Publication date Dec 1, 2022
- Semiconductor Components Industries, LLC
- Francis J. Carney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20220301965
- Publication date Sep 22, 2022
- Rohm Co., Ltd.
- Ryuta KIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20220301966
- Publication date Sep 22, 2022
- Rohm Co., Ltd.
- Ryuta KIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20220301967
- Publication date Sep 22, 2022
- Rohm Co., Ltd.
- Ryuta KIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR
- Publication number 20220262761
- Publication date Aug 18, 2022
- Mitsubishi Electric Corporation
- Tatsuya KITAGAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE, SEMICONDUCTOR PACKAGE MANUFACTURING METHOD,...
- Publication number 20220254824
- Publication date Aug 11, 2022
- Sony Semiconductor Solutions Corporation
- MITSUHITO KANATAKE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20220037260
- Publication date Feb 3, 2022
- Rohm Co., Ltd.
- Kazunori FUJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Package Comprising a Pin in the Form of a Dril...
- Publication number 20220005755
- Publication date Jan 6, 2022
- Thorsten Scharf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20210407893
- Publication date Dec 30, 2021
- ROHM CO., LTD.
- Katsuhiro IWAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RELIABLE SEMICONDUCTOR PACKAGES
- Publication number 20210366963
- Publication date Nov 25, 2021
- UTAC Headquarters Pte. Ltd.
- Il Kwon SHIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20210296197
- Publication date Sep 23, 2021
- Kabushiki Kaisha Toshiba
- Yuuichi FUJITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20210090978
- Publication date Mar 25, 2021
- ROHM CO., LTD.
- Katsuhiro IWAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Surface Treatment Method and Apparatus for Semiconductor Packaging
- Publication number 20210050281
- Publication date Feb 18, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Horng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC MODULE
- Publication number 20200335412
- Publication date Oct 22, 2020
- SHINDENGEN ELECTRIC MANUFACTURING CO., LTD
- Yoshihiro KAMIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20200161228
- Publication date May 21, 2020
- Rohm Co., Ltd.
- Akihiro Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Surface Treatment Method and Apparatus for Semiconductor Packaging
- Publication number 20200126893
- Publication date Apr 23, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Horng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING LIGHT EMITTING DEVICE AND LIGHT EMITTING DE...
- Publication number 20200091394
- Publication date Mar 19, 2020
- Nichia Corporation.
- Shimpei SASAOKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20190378787
- Publication date Dec 12, 2019
- ROHM CO., LTD.
- Shoji YASUNAGA
- H01 - BASIC ELECTRIC ELEMENTS

being an anchoring portion

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Reliable semiconductor packages

Semiconductor device and manufacturing method therefor

Packaging of a semiconductor device with a plurality of leads

Semiconductor device package comprising a pin in the form of a dril...

Surface treatment method and apparatus for semiconductor packaging

Semiconductor device and method for manufacturing semiconductor device

Packaging of a semiconductor device with a plurality of leads

Semiconductor device

Electronic module with a groove and press hole on the surface of a...

Packaging of a semiconductor device with a plurality of leads

Component tethers with spacers

Method of manufacturing light emitting device and light emitting de...

Semiconductor device

Semiconductor device

Electronic substrate and electronic apparatus

Packaging structure with recessed outer and inner lead surfaces

Die stack structure, semiconductor package having the same and meth...

Semiconductor device

Surface treatment method and apparatus for semiconductor packaging

Semiconductor device and method for manufacturing semiconductor device

Semiconductor device

Semiconductor device, and method for manufacturing semiconductor de...

Semiconductor device

Packaged semiconductor device having nanoparticle adhesion layer pa...

Chip carrier configured for delamination-free encapsulation and sta...

Semiconductor device and method for manufacturing semiconductor device

Method of manufacturing light emitting device and light emitting de...

Surface treatment method and apparatus for semiconductor packaging

Method of producing an optoelectronic semiconductor component, opto...

Power quad flat no-lead (PQFN) package in a single shunt inverter c...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE

METHOD FOR FABRICATING A SEMICONDUCTOR DEVICE PACKAGE COMPRISING A...

DIE PACKAGE WITH SEALED DIE ENCLOSURES

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...

ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE ELECTRICAL CONTACT STRUCTURES AND RELATED MET...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR

SEMICONDUCTOR PACKAGE, SEMICONDUCTOR PACKAGE MANUFACTURING METHOD,...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

Semiconductor Device Package Comprising a Pin in the Form of a Dril...

SEMICONDUCTOR DEVICE

RELIABLE SEMICONDUCTOR PACKAGES

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

Surface Treatment Method and Apparatus for Semiconductor Packaging

ELECTRONIC MODULE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

Surface Treatment Method and Apparatus for Semiconductor Packaging

METHOD OF MANUFACTURING LIGHT EMITTING DEVICE AND LIGHT EMITTING DE...

SEMICONDUCTOR DEVICE